BSC27
Abstract: SS-BGA672B-02 aluminum 7075
Text: Features Top View Directly mounts to target PCB needs tooling holes with hardware A Minimum real estate required Compression plate distributes evenly Clamshell lid Materials: 1 Clam Shell Lid: Black anodized 7075 Aluminum. Height = 20 mm. 2 Socket Base: Black anodized 7075 Aluminum.
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225mm
SS-BGA672B-02
SS-BGA672B-02
125mm.
BSC27
aluminum 7075
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ASTM nut and bolt
Abstract: 38x150 durium bolt nut washer thread ASTM307 50x200 7075-T6 aluminum 38x125 burndy TMH267
Text: BURNDY Hardware TABLE OF CONTENTS DURIUM Hardware Bolts . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-2 Aluminum Hardware Bolts . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-6 Nuts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-3
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POGO
Abstract: SS-BGA1156A-01
Text: Features Top View Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required A Compression plate distributes evenly 57.225mm [2.253"] Clamshell lid Materials: 1 Clam Shell Lid: Black anodized 7075 Aluminum. Height = 20 mm.
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225mm
SS-BGA1156A-01
125mm.
600mm
POGO
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SS-LGA376A-01
Abstract: No abstract text available
Text: Top View Features Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required A Compression plate distributes evenly 49.225mm [1.938"] Clamshell lid Materials: A 42.60mm [1.677"] 11 1 Clam Shell Lid: Black anodized 7075 Aluminum.
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225mm
SS-LGA376A-01
125mm
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SS-BGA625A-01
Abstract: pogo
Text: Top View Features Directly mounts to target PCB needs tooling holes with hardware A Minimum real estate required 57.225mm [2.253"] Compression plate distributes evenly Clamshell lid Materials: A A 50.60mm [1.992"] 1 Clam Shell Lid: Black anodized 7075 Aluminum.
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225mm
SS-BGA625A-01
125mm.
600mm
pogo
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SS-QFN144A-01
Abstract: No abstract text available
Text: Top View Features Directly mounts to target PCB needs tooling holes with hardware A Minimum real estate required 39.23mm [1.544"] Compression plate distributes evenly Clamshell lid A Materials: 11 1 Clam Shell Lid: Black anodized 7075 Aluminum. Height = 20 mm.
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725mm
025mm
SS-QFN144A-01
229-8200solder
SS-QFN144A-01
125mm.
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SS-BGA800A-01
Abstract: No abstract text available
Text: Features Top View Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required A Compression plate distributes evenly 57.225mm [2.253"] Clamshell lid Materials: A A 11 50.60mm [1.992"] 1 Clam Shell Lid: Black anodized 7075 Aluminum.
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225mm
SS-BGA800A-01
125mm.
600mm
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pogo pin application note
Abstract: SS-BGA95A-01
Text: Top View Features Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required A 49.225mm [1.938"] Compression plate distributes evenly Clamshell lid Materials: A 42.6mm [1.677"] 11 Side View (Section AA) 1 Clam Shell Lid: Black anodized 7075 Aluminum.
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PDF
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225mm
SS-BGA95A-01
pogo pin application note
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SS-BGA772A-01
Abstract: No abstract text available
Text: Top View Features Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required Compression plate distributes evenly 57.225mm [2.253"] Clamshell lid Materials: A 11 Side View (Section AA) 50.60mm [1.992"] 1 Clam Shell Lid: Black anodized 7075 Aluminum.
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225mm
SS-BGA772A-01
125mm.
600mm
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SS-BGA256E-01
Abstract: No abstract text available
Text: Top View Features Directly mounts to target PCB needs tooling holes with hardware A Minimum real estate required 39.23mm [1.544"] Compression plate distributes forces evenly Clamshell lid A Materials: 11 32.60mm [1.283"] Side View (Section AA) 1 Clam Shell Lid: Black anodized 7075 Aluminum.
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SS-BGA256E-01
125mm.
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CG-BGA-4002
Abstract: 4002 ic
Text: Top View Features Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required Compression plate distributes forces evenly A 49.225mm [1.938"] Clamshell lid Materials: A 1 42.60mm [1.677"] 10 2 Side View (Section AA) Socket Base: Black anodized 7075 Aluminum.
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225mm
CG-BGA-4002
725mm
725mm
025mm
125mm.
4002 ic
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qfn68
Abstract: BOX21151 SS-QFN68A-01
Text: Top View Features Directly mounts to target PCB needs tooling holes with hardware A Minimum real estate required 30.23mm [1.190"] Compression plate distributes forces evenly Clamshell lid A Materials: 11 25.48mm [1.003"] Side View (Section AA) 1 Clam Shell Lid: Black anodized 7075 Aluminum.
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SS-QFN68A-01
BOX21151
125mm.
qfn68
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pogo pin application note
Abstract: BOX21151 SS-BGA62C-01 pogo pin
Text: Top View End View Features Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required A Compression plate distributes evenly 39.23mm [1.544"] Clamshell lid A Materials: 11 32.60mm [1.283"] Side View (Section AA) 4 1 Clam Shell Lid: Black anodized 7075 Aluminum.
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707Modified:
025mm
SS-BGA62C-01
pogo pin application note
BOX21151
pogo pin
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225G
Abstract: SS-BGA225G-01 BGA OUTLINE DRAWING
Text: Top View Features Directly mounts to target PCB needs tooling holes with hardware A Minimum real estate required 39.23mm [1.544"] Compression plate distributes evenly Clamshell lid A Materials: 11 1 Clam Shell Lid: Black anodized Aluminum. Height = 20 mm.
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725mm
025mm
SS-BGA225G-01
125mm.
225G
BGA OUTLINE DRAWING
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PEM SOS-632-8
Abstract: SOS-440-10 7075-T6 aluminum sos-6440-4 SOS-832-16 SOS-632-12 SOS-440-12 BSOS-440-10 SO-440-6 SOS-440-8
Text: S ELF-CLINCHING S TA N D O F F S SELF-CLINCHING STANDOFFS These standoffs, which use the proven self-clinching design, install with a squeeze in punched or drilled round holes – and become permanently mounted in the thin sheet. PEM brand standoffs are installed with their heads flush with one surface
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SO-12
1-800-DIAL-PEM
CAGE-46384
PEM SOS-632-8
SOS-440-10
7075-T6 aluminum
sos-6440-4
SOS-832-16
SOS-632-12
SOS-440-12
BSOS-440-10
SO-440-6
SOS-440-8
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SS-QFE128SD-01
Abstract: No abstract text available
Text: Features Top View Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required Compression plate distributes forces evenly A 49.225mm [1.938"] Clamshell lid Materials: A 11 42.60mm [1.677"] Side View (Section AA) 4 Assembled 44mm +/-2
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225mm
plat952)
SS-QFE128SD-01
725mm
725mm
025mm
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Untitled
Abstract: No abstract text available
Text: S ER IES 97 0 POWERTRIP CONNECTORS THE POW E R C ON N E CT OR FO R EX TREM E EN V I RO NMENT S FIRST EDITION • MARCH 2013 SERIES 970 HIGH CURRENT, HARSH ENVIRONMENT POWERTRIP ™ The power connector for extreme environments Protect circuits with Series 970 PowerTrip™ connectors
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SS-QFE176SC-01
Abstract: pogo pin 4-26MM 11351
Text: Features Top View Directly mounts to target PCB needs tooling holes with hardware Minimum real estate required Compression plate distributes forces evenly A 49.225mm [1.938"] Clamshell lid Materials: A 42.60mm [1.677"] 11 Side View (Section AA) 4 Assembled 44mm +/-2
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225mm
plated952)
SS-QFE176SC-01
725mm
725mm
025mm
pogo pin
4-26MM
11351
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Burndy PAT750-18V parts breakdown
Abstract: BURN GI CONDUIT lp 1610 for door bell Burndy Y35 hypress parts breakdown ci an 7591 NEC c317 KPC 45 94V SAE-AS7928 burndy Y35 Hypress owner manual burndy patriot pat750-18v replacement parts
Text: Master Catalog Solutions for the Electrical Industry Experience. Technology. Answers. TM Customer Service Department 7 Aviation Park Drive Londonderry, NH 03053 1-800-346-4175 1-603-647-5299 International Canada 1-800-361-6975 (Quebec) 1-800-387-6487 (All other provinces)
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bga676
Abstract: 1mm pitch BGA socket BGA-676 BGA 27X27 pitch 27X27MM 7075-T6 aluminum 180C 7075-T6 SBT-BGA-6002 1mm pitch BGA
Text: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • • • • 6 7 • 12 14 13 • Wide temperature range -55C to +180C High current capability (up to 8A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable
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27x27mm,
26x26
SBT-BGA-6002
bga676
1mm pitch BGA socket
BGA-676
BGA 27X27 pitch
27X27MM
7075-T6 aluminum
180C
7075-T6
1mm pitch BGA
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7075-T6 aluminum
Abstract: 7075-T6 high current pogo pin aluminium 7075 180C SBT-BGA-7000 high current high temperature pogo pin
Text: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features 10 14 9 7 8 6 • • • • • • 5 13 12 4 15 3 1 2 11 Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches from true position
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7075-T6
SBT-BGA-7000
7075-T6 aluminum
high current pogo pin
aluminium 7075
180C
high current high temperature pogo pin
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Untitled
Abstract: No abstract text available
Text: SIEM ENS 47E D • fl53SbDS GOSbBflH T ■ SIE6 RP-12C Mask-Diffused GaAsP LED PART NO. 2680-7075 -P M f P-metal anode Diffusion Barrier Epitaxial Layer Substrate N-metal (cathode) DESCRIPTION TYPICAL DEVICE PARAMETERS Siemens RP-12C is a mask-diffused GaAsP lightemitting diode. With a bright and uniform 655 nm
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fl53SbDS
RP-12C
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Untitled
Abstract: No abstract text available
Text: OPTO SIEM ENS MME D • ÖE3b32b DD OM b^ M S IE X h RP-12C Mask-Diffused GaAsP LED PART NO. 2680-7075 W '9? P -m e ta l a node D iffu sio n Barrier Epita xia l La y e r Substrate N -m e ta i (cathode) DESCRIPTION TYPICAL DEVICE PARAMETERS Siemens RP-12C is a mask-diffused GaAsP lightemitting diode. With a bright and uniform 655 nm
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OCR Scan
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PDF
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E3b32b
RP-12C
-10nA
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RP-12C
Abstract: 655-nm
Text: SIEM ENS 47E D fl235fc>D5 G 0 2 b ô ô 4 T » S I E G RP-12C Mask-Diffused GaAsP LED PART NO. 2680-7075 P-metal anode Diffusion Barrier Epitaxial Layer Substrate N-metal (cathode) DESCRIPTION TYPICAL DEVICE PARAMETERS Siemens RP-12C is a mask-diffused G aA sP lightemitting diode. With a bright and uniform 655 nm
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OCR Scan
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PDF
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RP-12C
RP-12C
655-nm
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