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    ALTERA PART MARKING Search Results

    ALTERA PART MARKING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    5962-8950303GC Rochester Electronics LLC ICM7555M - Dual Marked (ICM7555MTV/883) Visit Rochester Electronics LLC Buy
    54HC221AJ/883C Rochester Electronics LLC 54HC221AJ/883C - Dual marked (5962-8780502EA) Visit Rochester Electronics LLC Buy
    MG8097/B Rochester Electronics LLC 8097 - Math Coprocessor - Dual marked (8506301ZA) Visit Rochester Electronics LLC Buy
    5490/BCA Rochester Electronics LLC 5490 - Decade Counter - Dual marked (M38510/01307BCA) Visit Rochester Electronics LLC Buy
    5405/BCA Rochester Electronics LLC 5405 - Gate - Dual marked (M38510/00108BCA) Visit Rochester Electronics LLC Buy

    ALTERA PART MARKING Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    ALTERA PART MARKING

    Abstract: ADV0217 altera Date Code Formats ALTERA BGA packages PART MARKING altera date code format altera marking
    Text: CUSTOMER ADVISORY ADV0217 FULL LASER MARKING INTRODUCTION Change Description: Beginning January 2003, Altera will introduce a full topside laser mark on all Altera plastic body packages. Currently, the Altera device logo, part number, and date code are ink marked, while the Altera lot number and traceability code


    Original     		ADV0217 ALTERA PART MARKING ADV0217 altera Date Code Formats ALTERA BGA packages PART MARKING altera date code format altera marking PDF

    ADV0607

    Abstract: XZ-070 altera Date Code Formats Date Code Formats altera date code format ALTERA PART MARKING EP2C35 EP2C50 date code marking altera top marking
    Text: Revision 0: Initial Release CUSTOMER ADVISORY ADV0607 UFBGA 484 Package Coplanarity Enhancement Change Description Altera will enhance the coplanarity of its Ultra FineLine BGA UFBGA 484 packages as part of the company’s continuous product-quality improvement process. This enhancement


    Original     		ADV0607 ratin2C35 EP2C50 XZ0701T JESD46-B, 21-Nov-06 ADV0607 XZ-070 altera Date Code Formats Date Code Formats altera date code format ALTERA PART MARKING EP2C35 EP2C50 date code marking altera top marking PDF

    CY7C342B

    Abstract: EME-6300H
    Text: Qualification Report August 1996, QTP# 95514, Version 1.1 CY7C342B 128-Macrocell MAX EPLD MAX is a register trademark of Altera Coporation. PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:


    Original     		CY7C342B 128-Macrocell 68-Lead 7C342B CY7C342B-HC CY7C342B-JC CY7C342B EME-6300H PDF

    ADV0012

    Abstract: ALTERA PART MARKING altera top marking altera date code format BGA PACKAGE TOP MARK altera marking "lot Code" altera ALTERA BGA packages PART MARKING altera lot code format topmark
    Text: CUSTOMER ADVISORY BGA PACKAGE TOP MARK ENHANCEMENT Altera will begin marking a one-line internal traceability code on all BGA packages beginning January 2001. The Altera lot number, country of origin, and new internal marking code will be laser marked, or ink marked, on the top of all BGA packages for


    Original     		ADV0012 ADV0012 ALTERA PART MARKING altera top marking altera date code format BGA PACKAGE TOP MARK altera marking "lot Code" altera ALTERA BGA packages PART MARKING altera lot code format topmark PDF

    ADV0201

    Abstract: ALTERA PART MARKING altera top marking "lot Code" altera altera lot code format altera date code format altera "date code format" trace code altera marking Altera pdip top mark
    Text: CUSTOMER ADVISORY ADV0201 NON-BGA PACKAGE TOP MARK ENHANCEMENT Change Description: Altera will begin marking the assembly lot number and a one-line internal traceability code on all non-BGA packages beginning March 2002. Reason For Change: The assembly lot number and new internal traceability marking code will be laser or ink


    Original     		ADV0201 ADV0201 ALTERA PART MARKING altera top marking "lot Code" altera altera lot code format altera date code format altera "date code format" trace code altera marking Altera pdip top mark PDF

    ADV0217

    Abstract: ALTERA PART MARKING JESD46C JESD46-C altera date code format ALTERA BGA packages PART MARKING marking RY altera marking altera Date Code Formats FULL LASER MARKING
    Text: Revision: 1.1.0 CUSTOMER ADVISORY ADV0217 UPDATE FULL LASER MARKING INTRODUCTION Change Description This is an update to ADV0217. See the revision history table for information specific to this update. In January 2003, Altera introduced a full topside laser mark on all Altera plastic body packages.


    Original     		ADV0217 ADV0217. ADV0217 JESD46-C, 20X20 ALTERA PART MARKING JESD46C JESD46-C altera date code format ALTERA BGA packages PART MARKING marking RY altera marking altera Date Code Formats FULL LASER MARKING PDF

    ADV9707

    Abstract: altera Date Code Formats lot Code Formats altera ALTERA PART MARKING Date Code Formats Date Code Formats Altera altera top marking altera "date code format" Identification Traceability ALTERA die identifier
    Text: CUSTOMER ADVISORY TOP MARK TRACEABILITY ENHANCEMENTS As Altera adds additional sources of supply and in order for customers to maintain product traceability via device top mark, Altera will enhance its top marking scheme. In order to facilitate die identification, Altera will expand its current six character top mark date code and


    Original     		ADV9707 ADV9707 altera Date Code Formats lot Code Formats altera ALTERA PART MARKING Date Code Formats Date Code Formats Altera altera top marking altera "date code format" Identification Traceability ALTERA die identifier PDF

    ADV9401

    Abstract: RQFP ALTERA PART MARKING EPF81188ARC240-3 on 240 EPF81188RI240-3 marked EPF81188ARC240-2 EPF81188ARC240-4 altera MARKING
    Text: December 14, 1994 Dear Customer: Effective January 1, 1995, Altera will institute a new marking procedure on 240- and 304-pin Power Quad 2 packages. These changes are only aesthetic in nature and do not affect the functionality of the devices. Figure 1 illustrates the new mark that will appear on 240-pin RQFP and 304-pin RQFP


    Original     		304-pin 240-pin 304-pin 208-pin ADV9401 EPF81188RC240-3 EPF81188RC240-2 EPF81188RI240-3 ADV9401 RQFP ALTERA PART MARKING EPF81188ARC240-3 on 240 EPF81188RI240-3 marked EPF81188ARC240-2 EPF81188ARC240-4 altera MARKING PDF

    daewon tray

    Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
    Text: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA


    Original     		AN-071-5 Hand-0444 daewon tray Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga PDF

    MIL-I-8835A

    Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
    Text: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from


    Original     		PDF

    strapack s-669

    Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
    Text: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,


    Original     		PDF

    PCN0904

    Abstract: EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N
    Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0904 Cyclone III Family Process Shrink from 65-nm to 60-nm and Package Bill of Material Change Change Description This is an update to PCN0904, please see revision history table for information specific to this


    Original     		PCN0904 65-nm 60-nm PCN0904, EU-REP3C16U484I7N EP3C10E144C7 EP3C10E144C7N EP3C10E144C8 PCN0904 EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N PDF

    PLCC 84 PINS

    Abstract: camtex trays MIL-I-8835A
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF

    camtex trays

    Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF

    PCN1205

    Abstract: EP3C120F780I7N EP4CE30F29I8LN EP4CGX50CF23C8 EP2SGX125GF1508C4 EP3C16F484C8N EP4SGF45I3
    Text: Revision: 1.3.0 PROCESS CHANGE NOTIFICATION P C N1 2 0 5 ADDITIONAL ASSEMBLY SOURCE ASE AND TRANSITION TO CENTER PIN GATE MOLD FOR FBGA PACKAGES Change Description This is an update to PCN1205; please see the revision history table for information specific to this


    Original     		PCN1205; Reco0HF35I4 EP4SGX230HF35I4N EP4SGXHF35I3* EP4SGXKH40I3* EP4SGXKH40I3N* EP4SH40C2N* EP4SGF45I3* EP4SGX290NF45C2 PCN1205 EP3C120F780I7N EP4CE30F29I8LN EP4CGX50CF23C8 EP2SGX125GF1508C4 EP3C16F484C8N EP4SGF45I3 PDF

    ADV0812

    Abstract: ALTERA PART MARKING EP3SE110F1152C4N altera top marking DEVICE MARKING CODE table EP3SL110F1152C4N EP3SE260F1152C4N altera date code format XZ-082 EP3SE110F
    Text: Revision: 1.0.0 CUSTOMER ADVISORY ADV0812 ADDITIONAL PACKAGE OPTION FOR SELECTED STRATIX III FPGA DEVICES Description Altera will be introducing the Fine-Line BGA F1152 non-OPD on package decoupling 8-layer substrate design as an additional package option. The Stratix® III FBGA F1152 package is


    Original     		ADV0812 F1152 10-layer XZ0825T JESD46-C, ADV0812 ALTERA PART MARKING EP3SE110F1152C4N altera top marking DEVICE MARKING CODE table EP3SL110F1152C4N EP3SE260F1152C4N altera date code format XZ-082 EP3SE110F PDF

    ADV0907

    Abstract: ALTERA PART MARKING EP3C16M164C7N EPM240ZM68I8N EPM570ZM100I8N EP3C16M164I7N altera epm570 Date Code Formats EP3C16M164C8N epm1270 fpga EP3C10M164I7N
    Text: Revision: 1.0.0 CUSTOMER ADVISORY ADV0907 ADDITIONAL ASSEMBLY PLANT FOR MBGA PACKAGES Change Description Altera will be introducing Amkor, Philippines as an additional assembly source for Altera Micro FineLine BGA MBGA packages. This change does not affect the form, fit, or function of the


    Original     		ADV0907 ADV0907 ALTERA PART MARKING EP3C16M164C7N EPM240ZM68I8N EPM570ZM100I8N EP3C16M164I7N altera epm570 Date Code Formats EP3C16M164C8N epm1270 fpga EP3C10M164I7N PDF

    PCN0802

    Abstract: ALTERA PART MARKING EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 EP3C5 tsmc
    Text: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0802 ADDITIONAL TSMC WAFER FABRICATION SITE FOR CYCLONE III FPGAs Change Description Altera will begin manufacturing and shipping Cyclone III FPGAs out of Taiwan Semiconductor Manufacturing Company TSMC wafer FAB 14, located in Tainan, Taiwan.


    Original     		PCN0802 JESD46-C, PCN0802 ALTERA PART MARKING EP3C10 EP3C120 EP3C16 EP3C25 EP3C40 EP3C55 EP3C5 tsmc PDF

    PCN0901

    Abstract: ALTERA PART MARKING EP1C12F256C8EC EP1C6F256C8N EP1C12F256C8N altera top marking DEVICE MARKING CODE table EP1C12F324I7N EP1C12F256C8 EP1C12F324C8N
    Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0901 SUBSTRATE CHANGE FOR SELECTED FBGA PACKAGES Change Description This is an update to PCN0901; please see the revision history table for information specific to this update. Altera is implementing a substrate change on selected product lines assembled in the Fine-Line


    Original     		PCN0901 PCN0901; PCN0901 ALTERA PART MARKING EP1C12F256C8EC EP1C6F256C8N EP1C12F256C8N altera top marking DEVICE MARKING CODE table EP1C12F324I7N EP1C12F256C8 EP1C12F324C8N PDF

    epcs1n

    Abstract: EPCS16SI8N EPCS64SI16N EPCS4SI8N EPCS16SI8N marking EPCS1SI8 epcs4si8naa EPCS128SI16N SOIC16 EPCS64SI16N equivalent
    Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN1003 ALTERNATIVE ASSEMBLY SITE FOR THE EPC EPCS SERIAL CONFIGURATION DEVICE FAMILY Change Description This is an update to PCN1003, PCN1003 please see revision history table for information specific to this update.


    Original     		PCN1003 PCN1003 PCN1003, EPCS16SI8N EPCS64SI16N EPCS128SI16N epcs1n EPCS16SI8N EPCS64SI16N EPCS4SI8N EPCS16SI8N marking EPCS1SI8 epcs4si8naa EPCS128SI16N SOIC16 EPCS64SI16N equivalent PDF

    PCN0903

    Abstract: Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type
    Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0903 ALTERNATIVE ASSEMBLY SITE FOR THE EPC CONFIGURATION FAMILY Change Description Altera is introducing Amkor, Philippines ATP and Amkor, Korea (ATK) as additional assembly sources for the EPC configuration devices. The EPC devices are currently assembled out of


    Original     		PCN0903 PCN0903 Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type PDF

    PCN0902

    Abstract: HC220F780NAK HC220F672nan HC210F484NAC XZ-092 HC230F1020BN HC240F1020NBC HC230F1020AW EP2S60F1020C4N EP2SGXF1152AA
    Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0902 ADDITIONAL ASSEMBLY SOURCE AND BILL OF MATERIAL CHANGE FOR ALTERA FLIP CHIP PRODUCTS Change Description This is an update to PCN0902; please see the revision history table for information specific to this


    Original     		PCN0902 PCN0902; PCN0902 HC220F780NAK HC220F672nan HC210F484NAC XZ-092 HC230F1020BN HC240F1020NBC HC230F1020AW EP2S60F1020C4N EP2SGXF1152AA PDF

    PCN0702

    Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
    Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line


    Original     		PCN0702 PCN0702, 6300HJ G700M PCN0702 MP8000CH4 48hrs) X10-5 UL-94 SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound sumitomo G700 Tg PDF

    ADV0804

    Abstract: marking A3 Taiwan semiconductor ALTERA PART MARKING EP3SE50 EP3SL110 MARKed A7 marking a7 altera marking JESD46-C 1/USB/EP3SE110
    Text: Revision: 1.0.0 CUSTOMER ADVISORY ADV0804 TSMC WAFER FABRICATION SITES FOR THE STRATIX III FPGA FAMILY Description Altera will begin shipping Stratix III FPGAs out of two Taiwan Semiconductor Manufacturing Company TSMC wafer fabrication sites: FAB 12, located in Hsinchu, Taiwan, and FAB 14,


    Original     		ADV0804 65-nm JESD46-C, ADV0804 marking A3 Taiwan semiconductor ALTERA PART MARKING EP3SE50 EP3SL110 MARKed A7 marking a7 altera marking JESD46-C 1/USB/EP3SE110 PDF