DFN PACKAGE thermal resistance

Abstract: ADN005 thermal resistance standards AN792 JESD51-5 JESD51-7 TC1301B
Contextual Info: Smaller Packages = Bigger Thermal Challenges By Bonnie C. Baker, Microchip Technology Inc. ANALOG DESIGN NOTE IC manufacturers are working furiously to reduce the package sizes for their customer base. This effort has been well received by the multitudes, particularly where portable applications are