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    U8439-1

    Abstract: AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 DCL4 X23-7772
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1006-03 DATE: 23-Jul-2010 Product Affected: MEANS OF DISTINGUISHING CHANGED DEVICES: 35.0mm x 35.0mm x 3.42mm FCBGA-1156 (RoHS & Standard)


    Original     		PDF A1006-03 23-Jul-2010 FCBGA-1156 FCBGA-900 23-Oct-2010 89HPES16T16ZABL 89HPES16T16ZABR 89HPES22T16ZABL 89HPES22T16ZABLI U8439-1 AUS703 NAU-8 namics underfill ABF-GX3 Ablestik underfill DCL5 X23-7772-4 DCL4 X23-7772

    X23-7772-4

    Abstract: U8439-1 DCL5 AUS703 namics underfill X23-7772 NAU-8 ABF-GX3 namics U8439-1 X2377
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A0904-03 DATE: 22-May-2009 MEANS OF DISTINGUISHING CHANGED DEVICES: Product Affected: 19mm x 19mm FCBGA-324 (RoHS) Refer to Attachment II for the affected part numbers


    Original     		PDF A0904-03 22-May-2009 FCBGA-324 22-Aug-2009 JESD22-A104 JESD22-A118 JESD22-A103 JESD22-A113. 80KSW0001AR X23-7772-4 U8439-1 DCL5 AUS703 namics underfill X23-7772 NAU-8 ABF-GX3 namics U8439-1 X2377

    underfill

    Abstract: SILICON CONTROL RECTIFIER DETAILS AN-1050 Aluminum alloys physical properties Ablestik underfill SN62 PB36 ag2 Copper SN62 PB36 ag2 alsic 105 alsic
    Text: AN-1050 DirectFET TM Technology Materials and Practices Application Note page Factors causing thermal fatigue 2 Summarized test results 2 Use of underfill beneath devices 3 Use of lead-free solder alloys 3 Use of insulated metal substrates 4 Use of conformal coatings


    Original     		PDF AN-1050 AN-1035, underfill SILICON CONTROL RECTIFIER DETAILS AN-1050 Aluminum alloys physical properties Ablestik underfill SN62 PB36 ag2 Copper SN62 PB36 ag2 alsic 105 alsic

    underfill

    Abstract: Aluminum alloys physical properties AN-1050 SILICON CONTROL RECTIFIER DETAILS alsic 105 SN62 PB36 ag2 International Power Devices silicon carbide LED lead-free solder joint reliability thermal cycle alsic
    Text: Application Note AN-1050 DirectFETTM Technology Materials and Practices Application Note Table of Contents Page Factors Causing Thermal Fatigue .2 Summarized Test Results .2


    Original     		PDF AN-1050 underfill Aluminum alloys physical properties AN-1050 SILICON CONTROL RECTIFIER DETAILS alsic 105 SN62 PB36 ag2 International Power Devices silicon carbide LED lead-free solder joint reliability thermal cycle alsic

    PPC970FX

    Abstract: ablestik 8360 Ablestik underfill PPC970 PPC-970FX Thermacore
    Text: Application Note Thermal Considerations: PPC970FX Abstract The 64-bit IBM PowerPC 970FX PPC970FX enters a new era of processing power and thermal dissipation over earlier PowerPC products. The processor can operate at multiple GHz clock speeds and can dissipate relatively high levels of power through a very small processor die. The high power


    Original     		PDF PPC970FX 64-bit 970FX PPC970FX) PPC970FX ablestik 8360 Ablestik underfill PPC970 PPC-970FX Thermacore

    2088AB* led matrix

    Abstract: led matrix 2088ab 2088AB led matrix led matrix 8x8 mini circuits 2088AB matrix 2088ab Ultrasonic humidifier circuit torque settings for metric cap head screws TRANSISTOR C 6090 EQUIVALENT CV 7311
    Text: Soldering and Mounting Techniques Reference Manual SOLDERRM/D Rev. 3, May−2006 SCILLC, 2006 “All Rights Reserved” SOLDERRM FULLPAK, ICePAK, MicroIntegration, MicroLeadless, MOSORB, MiniMOSORB, and POWERTAP are trademarks of Semiconductor Components Industries, LLC SCILLC . Cho−Therm is a registered trademark of Chromerics, Inc. Grafoil is a registered trademark of


    Original     		PDF May-2006 2088AB* led matrix led matrix 2088ab 2088AB led matrix led matrix 8x8 mini circuits 2088AB matrix 2088ab Ultrasonic humidifier circuit torque settings for metric cap head screws TRANSISTOR C 6090 EQUIVALENT CV 7311

    matrix 2088ab

    Abstract: 2088AB led matrix torque settings chart for metric stainless bolts led matrix 2088ab 2088AB* led matrix PHASE CONTROL THYRISTOR MODULE TT 56 N SIL-PAD to-247 Ultrasonic humidifier circuit full wave BRIDGE RECTIFIER 1044 2088AB
    Text: Soldering and Mounting Techniques Reference Manual SOLDERRM/D Rev. 5, January−2007 SCILLC, 2007 “All Rights Reserved” SOLDERRM FULLPAK, ICePAK, MicroIntegration, MicroLeadless, MOSORB, MiniMOSORB, and POWERTAP are trademarks of Semiconductor Components Industries, LLC SCILLC . Cho−Therm is a registered trademark of Chromerics, Inc. Grafoil is a registered trademark of


    Original     		PDF January-2007 matrix 2088ab 2088AB led matrix torque settings chart for metric stainless bolts led matrix 2088ab 2088AB* led matrix PHASE CONTROL THYRISTOR MODULE TT 56 N SIL-PAD to-247 Ultrasonic humidifier circuit full wave BRIDGE RECTIFIER 1044 2088AB