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Text: — — HOW TO SELECT A HEAT SINK Seri Lee, Director Advanced Thermal Engineering Aavid Thermal Technologies, Inc. Laconia, New Hampshire 03247 Tel: 603 527-2339 Fmc (603) 528-1478 e-mail: lee@aavid. com With the increase in heat dissipation from microelectronic devices and the reduction in overall form factors,
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Text: Comparative Analysis of Various Heatsink Technologies in Forced Ventilation AAVID THERMALLOY in cooperation with Applied Thermal Technologies - India www.aavidthermalloy.com www.appliedthermal.co.in 03 April 2003 with APPLIED Thermal Technologies - INDIA 1
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heat sink design guide, IGBT
Abstract: loop heat pipes Aavid Thermalloy Aavid Thermalloy cold plate Aavid cold plate heat exchanger heat pipes igbt clip rail air fin fan exchangers Heat exchanger air to air
Text: Thermal Management Solutions for Cooling Electronics WWW.AAVIDTHERMALLOY.COM Our Mission Aavid Thermalloy will lead the electronics thermal management industry worldwide. We will be the company our customers partner with to solve their most demanding thermal challenges. Our business processes are designed for
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14F-4,
heat sink design guide, IGBT
loop heat pipes
Aavid Thermalloy
Aavid Thermalloy cold plate
Aavid cold plate
heat exchanger
heat pipes
igbt clip rail
air fin fan exchangers
Heat exchanger air to air
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AAVID THERMALLOY COMPOUND 250
Abstract: No abstract text available
Text: THERMAL PERFORMANCE OF INTERFACE MATERIAL IN MICROELECTRONICS PACKAGING APPLICATIONS By l Malcolm Early , Seri Lee, and Mark Pellilo Aavid Thermal Technologies, Inc. Laconia, New Hampshire 03247 As the need to dissipate heat from microelectronics packaging increases, the role of
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electronic passive components catalog
Abstract: heat sink design guide, IGBT polar cap Aavid Thermalloy cold plate loop heat pipes laptop fan Aavid Thermalloy TUBE MTBF IGBT
Text: Thermal Management Solutions for Cooling Electronics WWW.AAVIDTHERMALLOY.COM Our Mission Aavid Thermalloy will lead the electronics thermal management industry worldwide. We will be the company our customers partner with to solve their most demanding thermal challenges. Our business processes are designed for
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14F-4,
electronic passive components catalog
heat sink design guide, IGBT
polar cap
Aavid Thermalloy cold plate
loop heat pipes
laptop fan
Aavid Thermalloy TUBE
MTBF IGBT
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Peltier Thermo
Abstract: No abstract text available
Text: Power Thermal Solution Solutions Division Cooling to keep your Key Chips Alive Guy Diemunsch Aavid Thermalloy diemunsch.g@aavid.com Agenda Power Thermal Solution Solutions Division From the Chip to the Fluid The story of conductivity and heat density Technologies and Heat Transfer coefficients
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250G AAVID THERMALLOY
Abstract: Thermalcote THE 249 AAVID THERMALLOY 250G 101700F00000G AAVID THERMALLOY 102000F00000G AAVID 101700F00000G 101800F00000G thermalcote 100300F00000G 100500F00000
Text: Home | Contact Us | About Aavid | Sales Rep Log In Chinese -Useful Links- / Interface Materials Products 6 / Greases Thermal Greases Search by part # » Sil - Free RoHS Compliant silicone - free synthetic thermal grease Check distributor part inventory
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Text: THERMAL PERFORMANCE OF AN ELLIPTICAL PIN FIN HEAT SINK Christopher L. Chapman, and Seri Lee Aavid Engineering, Inc. Laconia, New Hampshire 03247 Bill L. Schmidt Silicon Graphics Computer Systems Mountainview, California 94039 L m Abstract Comparative thermal tests have been carried out using
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CLP212s
Abstract: ICS Sensors 1220 FT 147 M 78215 T0218 T0247 T092 ft 103 CLP212T 78315
Text: THE MAX CLIP SYSTEM ™ THE THE PROPRIETARY PROPRIETARY THERMAL THERMAL MANAGEMENT MANAGEMENT SOLUTION SOLUTION FOR FOR ALL ALL POWER POWER COMPONENTS COMPONENTS AAVID THERMALLOY ONE COOL IDEA AFTER ANOTHER THE MAX CLIP SYSTEM™ FOR POWER TRANSISTORS How do you optimize the thermal management of power transistors while saving labor and costs?
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Text: Home | Contact Us | About Aavid | Sales Rep Log In Chinese -Useful Links- Products Search by part # / Interface Materials / Adhesives Thermal Adhesives Ther - O- Bond 1500 Epoxy casting system for potting and encapsulation Check distributor part inventory
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4949G
4950G
4951G
4952G
4953G
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Abstract: No abstract text available
Text: BLISTER LIQUID COLD PLATES – PRODUCTION TECHNOLOGY; THERMAL PERFORMANCES ANALYSIS AND APPLICATION COMPARISONS Author: Dr. Ing. Cesare CAPRIZ AAVID THERMALLOY ITALY Abstract: The Blister Liquid Cold Plates are an innovative approach to the manufacturing of cost
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Text: BONDING AND BRAZING TECHNOLOGIES FOR POWER ELECTRONIC COOLING – WHEN AND WHY Author: Dr. Ing. Cesare CAPRIZ AAVID THERMALLOY ITALY Abstract: Bonding is a joint obtained with a special designed thermal epoxy resin: performance and characteristic. Brazing is a pure metallic joint obtained at high temperature: performance and characteristic.
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tip122 tip127 audio amp schematic
Abstract: mje521 equivalent BJT small signal low power BD139 MJ15003 300 watts amplifier 2N3773 pinout transistor mj11032 equivalent MJ11028 transistor equivalent 2n3055 IC 2N3773 audio amplifier diagram 2n222 TRANSISTOR use as audio amplifier
Text: DL111/D Rev. 8, July-2001 Bipolar Power Transistor Data Bipolar Power Transistor Data DL111/D Rev. 8, Jul–2001 SCILLC, 2001 Previous Edition 1995 “All Rights Reserved’’ Grafoil is a registered Trademark of Union Carbide. Kon–Dux and Rubber–Duc are trademarks of Aavid Thermal Technologies, Inc.
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DL111/D
July-2001
r14525
tip122 tip127 audio amp schematic
mje521 equivalent
BJT small signal low power BD139
MJ15003 300 watts amplifier
2N3773 pinout
transistor mj11032 equivalent
MJ11028 transistor equivalent
2n3055 IC
2N3773 audio amplifier diagram
2n222 TRANSISTOR use as audio amplifier
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53-02-103G
Abstract: No abstract text available
Text: Hom e | Conta ct Us | About Aavid | Sale s R e p Log In Chinese -Useful Links- 6 Thermalsil III Search by part # RoHS Compliant Thermally Conductive Silicone Rubber Insulators Check distributor part inventory The newest Thermalsil™ III formula has improved thermal conductivity, providing
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53-77-10G
53-77-11G
53-77-13G
53-78-1G*
53-02-10G
53-02-25G
O-247
53-02-103G
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retention mechanisms
Abstract: AAVID Thermal Products
Text: HEAT SINKS FOR INTEL’S CELERON MICROPROCESSOR OPTIMIZED FOR OEM INSTALLATION An array of Low Cost Solutions for the Pentium® II in the Single Edge Processor Package S.E.P.P. ASSEMBLY VIEW FEATURES: • Scalable passive solutions • Optimized for cost performance with
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retention mechanisms
AAVID Thermal Products
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Abstract: No abstract text available
Text: Cooling to keep your Key Chips Alive Guy Diemunsch Aavid Thermalloy 70 Commercial Street, Suite 200 Concord, NH 03301 USA Abstract: plenty of cooling technologies are available, they can be used to spread the heat, conduct it to or exchange it with the cold source. We
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368052B20067
Abstract: 368055B00032 LR92346
Text: THE 3680 ACTIVE HEAT SINK FOR EMBEDDED PC COOLING T H E R M A L P R O D U C T S, I N C. The 3680 Active Heat Sink is a low profile fan heat sink for power IC’s. FEATURES: • Reliability for Industrial Usage • Low Profile Assembly • Quick Installation to IC
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368055B20067
368052B20067
368055B00032
LR92346
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D149
Abstract: IcePak
Text: THIN-FIN HEAT SINKS T H E R M A L P R O D U C T S, I N C. FOR COMPUTER AND CUSTOM APPLICATIONS LOW PROFILE COPPER HEAT SINKS IDEAL FOR PCI AND AGP CHIP SETS When space is at a premium, Aavid’s Thin-fin heat sinks reduce package case temperature by as much as 20º C. These flexible, copper
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T0252
Abstract: D3PAK T0-252 T0-268 440 d-pak thermal PCB D2PAK T0268 Aavid 252 573100D00000 573100D00010
Text: SURFACE MOUNT HEAT SINKS FOR D-PAK, D2PAK AND D3PAK PACKAGES T H E R M A L P R O D U C T S, I N C. THEORY OF OPERATION: • Surface mountable heat sink Heat from the D-PAK, D2PAK or D3PAK device is removed indirectly through conduction – no direct contact is made to the
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Chomerics T710
Abstract: A13494
Text: COLUSA 860 CHIP SET COOLING SOLUTIONS Part # 23408 Part # 23409 35 mm Tall 5 pc. Assembly 23 mm Tall 5 pc. Assembly • Easy Mounting to 860 Chip Set • Pre-Applied Interface Material • Shock Absorbing Gasket • Protects Chip and Package • Two Heights Available
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Chomerics T710
A13494
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533002B02551
Abstract: 530614 00 AAVID THERMALLOY COMPOUND 250 577102b04000 63815 MULTIWATT die semiconductors cross index CC 3053 566010B03400 53010-1
Text: PRODUCT SELECTION GUIDE Condensed AAVID THERMALLOY AAVID THERMALLOY PRODUCT SELECTION GUIDE Condensed This condensed catalog features the more popular devices and configurations that Aavid Thermalloy produces today to cool high speed microprocessors and other commonly used semi
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10-6326-27
Abstract: bgs2 10-5607-05 374924B60024 2332B 374924B00035 374224B00032 BGA 441 10-L4LB-03 10-L4LB-05
Text: PRODUCT SELECTOR GUIDE New Cooling Solutions for Ball Grid Arrays The Industry’s Most Comprehensive Selection of BGA Heat Sinks Aavid Thermalloy offers the broadest line of innovative BGA heat sinks – including standard, off-the-shelf solutions to support all of your most demanding applications. Cost effective
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Chomerics T710
Abstract: A13494 a1349
Text: TEHAMA 850 CHIP SET COOLING SOLUTIONS Part # 23410 Part # 23411 35 mm Tall 5 pc. Assembly 23 mm Tall 5 pc. Assembly • Easy Mounting to 850 Chip Set • Pre-Applied Interface Material • Shock Absorbing Gasket • Protects Chip and Package • Two Heights Available
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A13494
Chomerics T710
A13494
a1349
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INTEL 82306
Abstract: 65630 tic 2360 ES 61420 EN 61210 intel 80468 62660 60490 I1335 60550 AAVID
Text: AAV ID TM AAVID ENGINEERING, INC. C T R B 'x ,J; / Ü 7 ' Aluminum Heat Sink Extrusion Profiles Thermal Management Solutions m DIMENSIONAL TOLERANCES FOR ALUMINUM EXTRUSIONS TYPICAL PROPERTIES OF 6063-T5 ALUMINUM EXTRUSION ALLOY Aavid Engineering’s aluminum extrusions comply with
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