SOJ28-P-400-1
Abstract: No abstract text available
Text: 28P0N-A Plastic 28pin 400mil SOJ LOC EIAJ Package Code SOJ28-P-400-1.27 JEDEC Code – Weight(g) Lead Material Alloy 42 e D c 28 e1 HE E e1 I1 I2 15 Recommended Mount Pad Symbol 1 14 L A A1 b1 e b2 y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2 Dimension in Millimeters
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28P0N-A
28pin
400mil
SOJ28-P-400-1
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Untitled
Abstract: No abstract text available
Text: 28P0K Plastic 28pin 400mil SOJ EIAJ Package Code SOJ28-P-400-1.27 JEDEC Code MO-061AA Weight g 1.08 Lead Material Alloy 42 e D b2 28 I1 I2 c e1 E HE e1 15 Recommended Mount Pad Symbol 1 14 L A A1 b1 e y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2
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28P0K
28pin
400mil
SOJ28-P-400-1
MO-061AA
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SOJ28-P
Abstract: No abstract text available
Text: SOJ28-P-400-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.30 TYP. 5/Dec. 5, 1996
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SOJ28-P-400-1
SOJ28-P
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SOJ28
Abstract: No abstract text available
Text: SOJ28/24-P-400-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.25 TYP. 5/Dec. 5, 1996
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SOJ28/24-P-400-1
SOJ28
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soj28
Abstract: No abstract text available
Text: SOJ28/24-P-400-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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SOJ28/24-P-400-1
soj28
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SOJ28-P-300-1
Abstract: No abstract text available
Text: SOJ28-P-300-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Cu アロイ 半田メッキ (≥5µm) 0.80 TYP. 3 版/96.12.5
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SOJ28-P-300-1
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SOJ28-P
Abstract: No abstract text available
Text: SOJ28-P-400-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 1.30 TYP. 5 版/96.12.5
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SOJ28-P-400-1
SOJ28-P
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Untitled
Abstract: No abstract text available
Text: SOJ28-P-400-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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SOJ28-P-400-1
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SOJ28-P-300-1
Abstract: MAR 749
Text: 28P0D-A EIAJ Package Code SOJ28-P-300-1.27 Plastic 28pin 300mil SOJ LOC Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 Under Development D c 28 e1 HE E e1 I1 I2 15 Recommended Mount Pad 14 1 L A A1 b1 e y b SEATING PLANE Symbol A A1 b b1 c D E e e1
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28P0D-A
SOJ28-P-300-1
28pin
300mil
MAR 749
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PA-SOJ28D-L-V-01
Abstract: PA-SOJ28D-L-V-01W
Text: 0.198" 0.998" 1 Pin 28 28 0.261" 15 0.400" PA-SOJ28D-L-V-01 Pin 1 0.800" 14 1 0.989" 2 0.187" 0.141" 0.100" typ. Side View 0.050" 0.020"±0.001" dia. 0.165" End View 0.100" 0.193" PA-SOJ28D-L-V-01W 0.507" 28 27 26 24 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5
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PA-SOJ28D-L-V-01
PA-SOJ28D-L-V-01W
FR4/G10
PA-SOJ28D-CV-L-01
PA-SOJ28D-L-V-01
PA-SOJ28D-L-V-01W
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SOJ28
Abstract: No abstract text available
Text: M624256 1 Megabit 256K x 4 VERY FAST SRAM WITH OUTPUT ENABLE 256K x 4 VERY FAST SRAM with OUTPUT ENABLE EQUAL CYCLE and ACCESS TIMES: 15, 20ns LOW VCC DATA RETENTION: 2V TRI-STATE COMMON I/O JEDEC PLASTIC SOJ, 400 mil PACKAGE 28 1 SOJ28 (E) 400 mils DESCRIPTION
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M624256
SOJ28
M624256
SOJ28
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Untitled
Abstract: No abstract text available
Text: M624256 1 Megabit 256K x 4 VERY FAST SRAM WITH OUTPUT ENABLE DATA BRIEFING 256K x 4 VERY FAST SRAM with OUTPUT ENABLE EQUAL CYCLE and ACCESS TIMES: 15, 20ns LOW VCC DATA RETENTION: 2V TRI-STATE COMMON I/O JEDEC PLASTIC SOJ, 400 mil PACKAGE 28 1 SOJ28 (E)
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M624256
SOJ28
M624256
A0-A17
AI00811
SOJ28
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SOJ28-P-300-1
Abstract: No abstract text available
Text: SOJ28-P-300-1.27 Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Cu alloy Solder plating (≥5µm) 0.80 TYP. 3/Dec. 5, 1996
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SOJ28-P-300-1
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SOJ28-P-300-1
Abstract: No abstract text available
Text: 28P0J Plastic 28pin 300mil SOJ EIAJ Package Code SOJ28-P-300-1.27 JEDEC Code – Weight g 0.81 Lead Material Alloy 42 e b2 D e1 28 e1 HE E 15 Recommended Mount Pad Symbol 14 1 L A A1 b1 e I1 I2 c y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2 Dimension in Millimeters
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28P0J
28pin
300mil
SOJ28-P-300-1
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SOJ28-P-300-1
Abstract: SOJ28 SOJ28-P SOJ-28
Text: SOJ28-P-300-1.27 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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SOJ28-P-300-1
SOJ28
SOJ28-P
SOJ-28
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SOJ-28
Abstract: SOJ28
Text: SOJ28/24-P-400-1.27 Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 1.25 TYP. 5 版/96.12.5
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SOJ28/24-P-400-1
SOJ-28
SOJ28
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CV 203
Abstract: PA-SOJ28A-L-V-01 PA-SOJ28A-L-V-01W
Text: 0.993" Pin 28 0.203" 28 0.240" 1 15 0.295" PA-SOJ28A-L-V-01 Pin 1 Pin 1 0.800" 0.990" 14 1 2 0.187" Side View End View 0.141" 0.100" typ. 0.165" 0.050" 0.020"±0.001" dia. 0.100" 28 27 26 25 24 23 22 21 20 19 18 17 16 15 0.193" 1 2 3 4 5 6 7 8 9 10 11 12 13 14
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PA-SOJ28A-L-V-01
PA-SOJ28A-L-V-01W
FR4/G10
PA-SOJ28D-CV-L-01
PA-SOJ28A-L-V-01
CV 203
PA-SOJ28A-L-V-01W
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Untitled
Abstract: No abstract text available
Text: SOJ28-P-400-1.27 Unit nn Sep.2000
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SDJ28-P-400-1
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Untitled
Abstract: No abstract text available
Text: SOJ2824-P-400-1.27B U nit nn Sep.2000
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SDJ2824â
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TC5117445CSJ
Abstract: No abstract text available
Text: TO SHIBA_ TC5117445CSJ-40,-50,-60 TENTATIVE TOSHIBA MOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC 4,194,304-WORD BY 4-BIT EDO HYPER PAGE DYNAMIC RAM DESCRIPTION The TC5117445CSJ is an EDO (Hyper Page) dynamic RAM organized as 4,194,304 words by 4 bits. The
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TC5117445CSJ-40
304-WORD
TC5117445CSJ
28-pin
17445CSJ-40
TC5117445CSJ
SOJ28
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TC5117800bnt-60
Abstract: TC5117800B
Text: TOSHIBA TC5117800BNJ/BNT-60/70 PRELIMINARY 2,097,152 WORD X 8 BIT FAST PAGE DYNAMIC RAM Description The TC5117800BNT is the fast page dynamic RAM organized 2,097,152 words by 8 bits. The TC5117800BNT utilizes Toshiba’s CMOS silicon gate process technology as well as advanced circuit techniques to provide wide operating margins,
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TC5117800BNJ/BNT-60/70
TC5117800BNT
TC5117800bnt-60
TC5117800B
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lt928
Abstract: 55328P TC55328J
Text: 3 2 ,7 6 8 W O R D x 8 B IT C M O S S TA TIC R A M D E S C R IP T IO N The TC55328P/J is a 262,144 bits high speed static random access memory organized as 32,768 words by 8 bits using CMOS technology, and operated from a single 5-volt supply. Toshiba's CMOS
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TC55328P/J
TC55328P/J-20
TC55328P/J--25,
TC55328P/J-35
DIP28
TC55328P/J--17,
lt928
55328P
TC55328J
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Untitled
Abstract: No abstract text available
Text: TOSHIBA TC514800AJ/AZ/AFT-70/80 524,288 WORD X 8 BIT DYNAMIC RAM DESCRIPTION The TC514800AJ/AZ/AFT is the new generation dynam ic RAM organized 524,288 word by 8 bit. The TC514800A J/AZ/AFT utilizes T oshiba’s CM OS silicon gate process technology as w ell as advanced circuit
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TC514800AJ/AZ/AFT-70/80
TC514800AJ/AZ/AFT
TC514800A
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tc5117400f
Abstract: TC5117400J
Text: TOSHIBA TC5117400J/Z/FT-60/70 4,194,304 WORD X 4 BIT DYNAMIC RAM DESCRIPTION The TC5117400J/Z/FT-60/70 is the new generation dynamic RAM organized 4,194,304 word by 4 bit. The TC5117400J/Z/FT-60/70 utilizes Toshiba’s CMOS silicon gate process technology as well as advanced
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TC5117400J/Z/FT-60/70
TC5117400J/Z/FT-60/70
TC5117400J/Z/FT.
1MX16
tc5117400f
TC5117400J
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