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Abstract: No abstract text available
Text: □PM PS256X32V3 Dense-Pac Microsystems, Inc. O C E R A M IC 256K X 32 C M O S S R A M VERSA-STACK PRELIMINARY DESCRIPTION: The D PS256X32V3 "VER SA -STA C K " module is a re v o lu tio n a ry n ew m em o ry sub system using Dense-Pac Microsystems' ceramic Stackable Leadless
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DPS256X32V3
PS256X32V3
DPS256X32V3
30A04400
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180x32
Abstract: No abstract text available
Text: DENSE-PAC 8 Megabit CMOS SRAM M ICROSYST E M S PS256X32V3 DESCRIPTION: The D PS256X32V3 "V E R S A -S T A C K ” m odule is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 8
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DPS256X32V3
DPS256X32V3
120ns
180x32
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A16E
Abstract: No abstract text available
Text: PS256X32V3 □PM Dense-Pac Microsystems, Inc. CERAMIC 256K X 32 CM O S SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: The D PS256X32V3 "VERSA-STACK" m od ule is a re v o lu tio n a r y n e w m e m o ry s u b s y s te m u s in g Dense-Pac M icrosystem s' ceram ic Stackable Leadless
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OCR Scan
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PDF
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DPS256X32V3
PS256X32V3
DPS256X32V3
30A04400
A16E
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