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    M14C32

    Abstract: No abstract text available
    Text: M14C32 DD M14C32 Die Description PRODUCT • WAFER SIZE M14C32 152 mm 6 inches ■ DIE IDENTIFICATION M14C32KA_R ■ DIE SIZE (X x Y) 2040 x 2355 µm ■ SCRIBE LINE 100.5 x 101.7 µm ■ PAD OPENING 100 x 100 µm DIE LAYOUT DI Die Identification (at the position shown in Figure 1)


    Original     		PDF M14C32 M14C32 M14C32KA

    M14C32

    Abstract: 99344
    Text: M14C32 DD M14C32 Die Description PRODUCT • WAFER SIZE M14C32 152 mm 6 inches ■ DIE IDENTIFICATION M14C32KA_R ■ DIE SIZE (X x Y) 2040 x 2355 µm ■ SCRIBE LINE 100.5 x 101.7 µm ■ PAD OPENING 100 x 100 µm DIE LAYOUT DI Die Identification (at the position shown in Figure 1)


    Original     		PDF M14C32 M14C32 M14C32KA 99344