Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DPD32M Search Results

    DPD32M Datasheets (18)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    DPD32MS32PKW5-10C Dense-Pac Microsystems DRAM Board Original PDF
    DPD32MS32PKW5-70C Dense-Pac Microsystems DRAM Board Original PDF
    DPD32MS32PKW5-80C Dense-Pac Microsystems DRAM Board Original PDF
    DPD32MS32PW5-10C Dense-Pac Microsystems DRAM Board Original PDF
    DPD32MS32PW5-70C Dense-Pac Microsystems DRAM Board Original PDF
    DPD32MS32PW5-80C Dense-Pac Microsystems DRAM Board Original PDF
    DPD32MS36PKW5-10C Dense-Pac Microsystems DRAM Board Original PDF
    DPD32MS36PKW5-70C Dense-Pac Microsystems DRAM Board Original PDF
    DPD32MS36PKW5-80C Dense-Pac Microsystems DRAM Board Original PDF
    DPD32MS36PW5-10C Dense-Pac Microsystems DRAM Board Original PDF
    DPD32MS36PW5-70C Dense-Pac Microsystems DRAM Board Original PDF
    DPD32MS36PW5-80C Dense-Pac Microsystems DRAM Board Original PDF
    DPD32MS40PKW5-10C Dense-Pac Microsystems DRAM Board Original PDF
    DPD32MS40PKW5-70C Dense-Pac Microsystems DRAM Board Original PDF
    DPD32MS40PKW5-80C Dense-Pac Microsystems DRAM Board Original PDF
    DPD32MX8RY5-50C DPAC Technologies DRAM Module, FPM DRAM, 32MByte Density, 5V Supply, TSOP Package Original PDF
    DPD32MX8RY5-60C DPAC Technologies DRAM Module, FPM DRAM, 32MByte Density, 5V Supply, TSOP Package Original PDF
    DPD32MX8RY5-70C DPAC Technologies DRAM Module, FPM DRAM, 32MByte Density, 5V Supply, TSOP Package Original PDF

    DPD32M Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: 1152 Megabit CMOS DRAM DPD32MS36PKW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD32MS36PKW5 is the 32 Meg x 36 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks


    Original     		DPD32MS36PKW5 DPD32MS36PKW5 72-pin 30A155-10 PDF

    simm 72 dram

    Abstract: SIMM 80 jedec transistor C 2240 TT 2240
    Text: 1024 Megabit CMOS DRAM DPD32MS32PW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD32MS32PW5 is the 32 Meg x 32 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of sixteen dynamic RAM stacks


    Original     		DPD32MS32PW5 DPD32MS32PW5 72-pin 70rosystems, 30A146-01 simm 72 dram SIMM 80 jedec transistor C 2240 TT 2240 PDF

    Untitled

    Abstract: No abstract text available
    Text: 1024 Megabit CMOS DRAM DPD32MS32PKW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD32MS32PKW5 is the 32 Meg x 32 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks


    Original     		DPD32MS32PKW5 DPD32MS32PKW5 72-pin 30A159-10 PDF

    Untitled

    Abstract: No abstract text available
    Text: 1152 Megabit CMOS DRAM DPD32MS36PW5 PRELIMINARY DESCRIPTION: The DPD32MS36PW5 is the 32 Meg x 36 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of sixteen dynamic RAM stacks


    Original     		DPD32MS36PW5 DPD32MS36PW5 72-pin 30A152-01 PDF

    MA3280

    Abstract: ua3680
    Text: 1280 Megabit CMOS DRAM DPD32MS40PKW5 PRELIMINARY DESCRIPTION: The DPD32MS40PKW5 is the 32 Meg x 40 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks,


    Original     		DPD32MS40PKW5 DPD32MS40PKW5 72-pin 30A153-01 MA3280 ua3680 PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 1024 Megabit CMOS DRAM MICROSYSTEMS DPD32MS32PW5 PRELIMINARY PIN-OUT DIAGRAM D ESC R IPT IO N : The DPD32MS32PW5 is the 32 Meg x 32 Dynamic RAM module in the family of Sup er SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of sixteen dynamic RAM stacks


    OCR Scan     		DPD32MS32PW5 DPD32MS32PW5 72-pin PDF

    e351

    Abstract: DPD32
    Text: DENSE-PAC 1280 Megabit CMOS DRAM MICROSYSTEMS DPD32MS40PW 5 _ PRELIMINARY_ D E S C R IP T IO N : The D P D 32M S40 PW 5 is the 32 M eg x 40 Dynamic RAM module in the family of Super SIM M modules that utilize the new and innovative space saving TSO P


    OCR Scan     		DPD32MS40PW 100ns 30A153-01 DPD32MS40PW5 3QA153-01 e351 DPD32 PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC o vi i c R 1024 Megabit CMOS DRAM DPD32MS32RW s y s r i: m s DESCRIPTION: The DPD32MS32RW is the 32 Meg x 32 Dynamic RAM module in the family of modules that utilize the space saving TSOP technology. The module is constructed of sixteen 16M x 4 dynamic RAM surface mounted on an industry standard 72-pin


    OCR Scan     		DPD32MS32RW DPD32MS32RW 72-pin 100ns 30A171-00 PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC o vi i c R 1152 Megabit CMOS DRAM DPD32MS36RW s y s r i: m s DESCRIPTION: The DPD32MS36RW is the 32 Meg x 36 Dynamic RAM module in the family of JEDEC Standard modules that utilize the space saving TSOP technology. The module is constructed of sixteen 16Mx4 dynamic RAMs and eight 16 Meg x 1 Dynamic RAM's


    OCR Scan     		DPD32MS36RW DPD32MS36RW 16Mx4 72-pin 100ns 30A170-00 PDF

    Ka-52

    Abstract: D32M
    Text: DENSE-PAC 1152 Megabit CMOS DRAM MICROSYSTEMS DPD32MS36PW5 P R ELIM IN A R Y D E S C R IP T IO N : The DPD32M S36PW 5 is the 32 Meg x 36 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of sixteen dynamic RAM stacks


    OCR Scan     		DPD32MS36PW5 DPD32M S36PW 72-pin dec3QA152-01 100ns 30A152-01 Ka-52 D32M PDF

    Untitled

    Abstract: No abstract text available
    Text: 128 Megabit CMOS DRAM D E N S E -P A C m i e R e s y s t e m s : DPD32MX4PY5 PRELIM INARY DESCRIPTION: The DPD32MX4PY5 is the 32 M e g x4 Dynamic RAM module that utilizes the new and innovative space saving TSOP stacking technology. The module is constructed of eight 16


    OCR Scan     		DPD32MX4PY5 DPD32MX4PY5 30A149-08 PDF

    1s311

    Abstract: No abstract text available
    Text: DENSE-PAC 1280 Megabit CMOS DRAM DPD32MX40PKW5 M ICRO SYSTEM S PRELIMINARY D ESC RIPT IO N : The DPD32M X40PKW 5 is the 32 Meg x 40 ECC Dynamic RAM module in the family of SuperSIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twenty-four dynamic RAM stacks


    OCR Scan     		DPD32MX40PKW5 DPD32M X40PKW 72-pin X40PKW5 3QA153-11 1s311 PDF

    RA3045

    Abstract: DQ2451
    Text: DENSE-PAC MICROSYSTEMS 1024 Megabit CMOS DRAM DPD32MS32PKW5 PRELIMINARY D ESCRIPTIO N : The DPD32MS32PKW5 is the 32 Meg x 32 Dynamic RAM module in the family of Su p er SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks


    OCR Scan     		DPD32MS32PKW5 DPD32MS32PKW5 72-pin 30A159-10 100ns 72-PtN 3QA159-10 RA3045 DQ2451 PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC o vi i c R 1280 Megabit CMOS DRAM DPD32MS40RW s y s r i: m s PIN-OUT DIAGRAM DESCRIPTION: The DPD32MS40RW is the 32 Meg x 40 ECC Dynamic RAM modules that utilize the space saving TSOP stacking technology. The module is constructed of twenty 16M x 4 dynamic RAM's surface mounted on an industry standard 72-pin SIMM


    OCR Scan     		DPD32MS40RW DPD32MS40RW 72-pin 32IVI 30A176-00 PDF

    11kO

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 1152 Megabit CMOS DRAM DPD32MS36PKW5 PRELIMINARY D E S C R IP T IO N : PIN-OUT DIAGRAM The DPD32M536PKW5 is the 32 Meg x 36 Dynamic RAM module in the family of S u p e rS IM M modules that utilize the new and innovative space saving TSOP


    OCR Scan     		DPD32MS36PKW5 DPD32M536PKW5 72-pin DPD32MS36PKW5 30A155-10 100ns 11kO PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC MICROSYSTEMS 1024 Megabit CMOS DRAM DPD32M X32PKW 5 PRELIMINARY D ESCRIPTIO N : The DPD32MX32PKW5 is the 32 Meg x 32 Dynamic RAM module in the family of Su p er SIM M modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks


    OCR Scan     		DPD32M X32PKW DPD32MX32PKW5 72-pin DPD32MX32PKW5 3QA1S900 30A159-00 PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 1152 Megabit CMOS DRAM DPD32MX36PKW5 MICROSYSTEMS PRELIMINARY DESCRIPTION: The DPD32MX36PKW5 is the 32 Meg x 36 Dynamic RAM module in the family of SuperSlM M modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twenty-four dynamic RAM stacks


    OCR Scan     		DPD32MX36PKW5 DPD32MX36PKW5 72-pin 100ns 30A155-00 PDF

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC 1280 Megabit CMOS DRAM MICROSYSTEMS DPD32MS40PKW5 PRELIMINARY D ESCRIPTIO N : The DPD32MS40PKW5 is the 32 Meg x 40 Dynamic RAM module in the family of S u p e r S IM M modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks,


    OCR Scan     		DPD32MS40PKW5 DPD32MS40PKW5 72-pin 100ns 3QA153-01 30A153 PDF

    A273D

    Abstract: 16J3 512X32 48pin
    Text: R E F E R E N C E D R A O RG AN IZA TIO N PART NUMBER SIZE M P R O D 512 M egabit 6 4 0 Megabit 1024 Megabit 1152 Megabit 1152 Megabit S I Î A M P SPEED ns PACKAGE 16M x4 60, 70, 80 26-Pin TStack 19 16M x32 70, 80, 100 72-Pin S IM M 29 DPD16M X32PKW 5 16M x32


    OCR Scan     		26-Pin 72-Pin A273D 16J3 512X32 48pin PDF

    256KX8 SIMM

    Abstract: 512kx8 dram simm dram zip 256kx16 1mx8 DPS 119 61 sram 256kx8
    Text: TABLE OF CONTENTS GENERAL PRODUCT INFORMATION Reference by S iz e . 4 Dense-Pac Microsystems Modules and M onolithics. 5


    OCR Scan     		250ns, 1Mx8/512Kx16/256Kx32, 150-250ns, DPZ128X32VT/DPZ128X32VTP Z256S32IW 512Kx8/256Kx16/128Kx32, 120-250ns, 256KX8 SIMM 512kx8 dram simm dram zip 256kx16 1mx8 DPS 119 61 sram 256kx8 PDF