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    96SC SOLDERING TEMPERATURE Search Results

    96SC SOLDERING TEMPERATURE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH022BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Open-drain type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation

    96SC SOLDERING TEMPERATURE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Multicore 96SC

    Abstract: 96SC soldering temperature CR32 recommended reflow profile LPCC2x2 multicore solder paste CR32 JEDEC SMT reflow profile 629002 5988-7963EN multicore solder paste 2C
    Text: The LPCC2x2 Package Application Note 1316 1. Introduction Avago’s LPCC2x2 package is a highly thermal efficient leadless package offering improved RF response over a wide operating frequency, DC - 6 GHz. The exposed die-attach paddle acts as a device grounding, heat


    Original     		PDF 5988-7963EN Multicore 96SC 96SC soldering temperature CR32 recommended reflow profile LPCC2x2 multicore solder paste CR32 JEDEC SMT reflow profile 629002 multicore solder paste 2C

    SAC387

    Abstract: BS219 SAC387 solder multicore solder wire Multicore 96SC 97Cu3 LMP62 solder wire HMP Loctite 414 MSDS Multicore savbit
    Text: Technical Data Sheet Properties of Alloys of Multicore“ Solder Wires August 2007 # This data sheet lists the most popular solders supplied as flux-cored wire and can be used in addition to the separate Technical Data Sheets for Multicore cored solder wire fluxes.


    Original     		PDF

    SAC387

    Abstract: IPC-SF-818 J-STD-004 solder wire rom1 C502 Multicore 96SC J-STD-004 sn60 henkel solder TR-NWT-000078 SAC387 solder J-STD-004 MSDS
    Text: Technical Data Sheet C502 December-2009 PRODUCT DESCRIPTION C502 provides the following product characteristics: Technology Activity Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Solder wire - Cored Medium • No clean • Clear residue


    Original     		PDF December-2009 IPC/J-STD-004 SAC387 IPC-SF-818 J-STD-004 solder wire rom1 C502 Multicore 96SC J-STD-004 sn60 henkel solder TR-NWT-000078 SAC387 solder J-STD-004 MSDS

    IPC-SF-818

    Abstract: SAC387 SAC305 C400TM SAC387 solder J-STD-004 MSDS EN29454-1 TR-NWT-000078 Multicore SOLDER Multicore 96SC
    Text: Technical Data Sheet C400 October-2009 PRODUCT DESCRIPTION C400™ provides the following product characteristics: Technology Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire • Halide free • No clean • Clear residue


    Original     		PDF C400TM October-2009 C400TM IPC/J-STD-004 IPC-SF-818 SAC387 SAC305 SAC387 solder J-STD-004 MSDS EN29454-1 TR-NWT-000078 Multicore SOLDER Multicore 96SC

    IPC-SF-818

    Abstract: SAC387 SAC387 solder
    Text: Technical Data Sheet C511 October-2009 PRODUCT DESCRIPTION C511™ provides the following product characteristics: Technology Activity Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire High • No clean • Clear residue


    Original     		PDF October-2009 IPC/J-STD-004 IPC-SF-818 SAC387 SAC387 solder

    SAC387 solder

    Abstract: SAC387
    Text: Technical Data Sheet C400 April-2011 PRODUCT DESCRIPTION C400 provides the following product characteristics: Technology Product Benefits IPC/J-STD-004 Classification Application Surface Finishes Cored solder wire • Halide free • No clean • Clear residue


    Original     		PDF April-2011 IPC/J-STD-004 SAC387 solder SAC387

    30392

    Abstract: ALM-1106 stencil Layout JEDEC SMT reflow profile stencil
    Text: ALM-1106 MCOB Package Packge Application Note 5282 Introduction PCB Land Pattern and Stencil Design Avago Technologies’s ALM-1106 MCOB 2.0x2.0x1.1mm is an economical , easy to use GaAs MMIC GPS Low Noise Amplifier LNA with bypass and Shutdown mode. The exposed die-attach paddle acts as device grounding,


    Original     		PDF ALM-1106 ALM-1106 AV01-0246EN 30392 stencil Layout JEDEC SMT reflow profile stencil

    IR 423f

    Abstract: 30392 stencil Layout AV01-0210EN stencil MGA-635T6 JEDEC SMT reflow profile solder powder a/IR 423f
    Text: MGA-635T6 UTSLP Package Application Note 5278 Introduction PCB Land Pattern and Stencil Design Avago Technologies's MGA-635T6 UTSLP 2x1.3x0.4 is an economical ,easy to use GaAs MMIC GPS Low Noise Amplifier LNA with bypass and Shutdown mode. The exposed die-attach


    Original     		PDF MGA-635T6 AV01-0210EN IR 423f 30392 stencil Layout stencil JEDEC SMT reflow profile solder powder a/IR 423f

    30392

    Abstract: IR 423f MGA-635T6 JEDEC SMT reflow profile
    Text: MGA-635T6 UTSLP Package Application Note 5278 Introduction PCB Land Pattern and Stencil Design Avago Technologies's MGA-635T6 UTSLP 2x1.3x0.4 is an ­economical, easy to use GaAs MMIC GPS Low Noise Amplifier LNA with bypass and Shutdown mode. The exposed die‑attach paddle acts as device grounding, heat


    Original     		PDF MGA-635T6 MGA-635T6 J-STD-020C AV01-0210EN AV02-1697EN 30392 IR 423f JEDEC SMT reflow profile

    sot89 stencil

    Abstract: sot89 land pattern Loctite 218 RG200 substrate 5989-0810EN LOCTITE-96sc Getek LOCTITE 384 RG200 laser gun
    Text: SOT89 Package Application Note 5051 Introduction PCB Land Pattern and Stencil Design Avago Technologies SOT89 is a 3 I/O pins Figure 1 package platform designed to offer excellent heat dissipation and wide RF frequency response. The SOT89 package itself is lead free with a dimension of 4.1 mm


    Original     		PDF 5989-0810EN sot89 stencil sot89 land pattern Loctite 218 RG200 substrate LOCTITE-96sc Getek LOCTITE 384 RG200 laser gun

    IPC-7525

    Abstract: IPC-9502 IPC9502 IPC7525 FDS7066N7 defect analysis to-220 Solder paste stencil life FDS7066N3 J-STD-020B 96SC
    Text: www.fairchildsemi.com Application Note 7006 Guidelines for Using Fairchild’s SO-8 FLMP Dennis Lang, Applications Engineer Introduction Board Layout The Flip chip in Leaded Molded Package FLMP SO-8 minimizes both Printed Circuit Board (PCB) space and RDS(ON) in a convenient, familiar SO-8 sized package,


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Development General NXP Semiconductors BL-Cellular Systems, MST RF Power Basestations DEV&QAS Title: Solder mounting recommendations for Ldmos Power Amplifiers Author: Josselin FAY, Michael ASIS, Jose SALTA Doc. Nr. Date: 2008/02/14 General solder mounting recommendations


    Original     		PDF

    AN10896

    Abstract: finger print sensor pcb with circuit Mounting and Soldering of RF transistors heller 1700 ipc 610D JEDEC J-STD-020d Moisture/Reflow sensitivity HVQFN48 J-STD-020D bga rework graphite thermal spreader
    Text: AN10896 Mounting and Soldering of RF transistors Rev. 01 — 17 May 2010 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages


    Original     		PDF AN10896 AN10896 finger print sensor pcb with circuit Mounting and Soldering of RF transistors heller 1700 ipc 610D JEDEC J-STD-020d Moisture/Reflow sensitivity HVQFN48 J-STD-020D bga rework graphite thermal spreader

    AN10896

    Abstract: No abstract text available
    Text: AN10896 Mounting and Soldering of RF transistors Rev. 2 — 13 Nov 2012 Application note Document information Info Content Keywords Surface mount, reflow soldering, bolt down Abstract This application note provides bolt down and soldering guidelines for NXP’s RF transistor packages


    Original     		PDF AN10896 AN10896