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    8X8 64 FOOTPRINT Search Results

    8X8 64 FOOTPRINT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    HA456EVAL1 Renesas Electronics Corporation 120MHz, Low Power, 8x8 Video Crosspoint Switch Evaluation Board Visit Renesas Electronics Corporation
    HA456CMZ Renesas Electronics Corporation 120MHz, Low Power, 8x8 Video Crosspoint Switch, PLCC, /Tube Visit Renesas Electronics Corporation
    R5F513T5ADFJ#30 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation
    R5F513T5ADNE#20 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation
    R5F513T3ADFL#10 Renesas Electronics Corporation 32-bit Microcontrollers for Single Motor control Applications; Reduces Footprint and BOM Costs Visit Renesas Electronics Corporation

    8X8 64 FOOTPRINT Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    8x8 64 footprint

    Abstract: thermal PCB D2PAK ipl60r199cp IPL60R199 IPL60R299CP IPL60R385CP DB2010-0003 infineon smd Infineon Standard Power Products ipl60r
    Text: Product Brief CoolMOS in ThinPAK 8x8 The new leadless SMD package for CoolMOS™ Infineon Technologies introduces the ThinPAK™ 8x8, a new leadless SMD package for HV MOSFETs. The new package has a very small footprint of only 64 mm² vs. 150 mm² for the D2PAK and a very low profile with only 1 mm


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    B152-H9469-X-X-7600 DB2010-0003 8x8 64 footprint thermal PCB D2PAK ipl60r199cp IPL60R199 IPL60R299CP IPL60R385CP DB2010-0003 infineon smd Infineon Standard Power Products ipl60r PDF

    Untitled

    Abstract: No abstract text available
    Text: PGA ZIF Test & Burn-in Socket for Any Footprint on Std 8x8 to 21x21 Grid FEATURES • Strong Metal Cam Activates Normally-closed Contacts, Preventing Dependency on Plastic for Contact Force • Handle mounted on Right- or Left-hand Side • Any Footprint Accepted on Standard 13x13 to 21x21 Grid


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    21x21 13x13 MILG-45204 B54597 QQ-N-290 PDF

    Untitled

    Abstract: No abstract text available
    Text: STL24NM60N N-channel 600 V, 0.200 Ω typ., 16 A MDmesh II Power MOSFET in a PowerFLAT 8x8 HV package Datasheet − production data Features 6  6  6  Order code %RWWRPYLHZ VDS @ TJmax RDS on max STL24NM60N 650 V *  ID 16 A (1) < 0.215 Ω 1. The value is rated according to Rthj-case


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    STL24NM60N DocID18363 PDF

    Untitled

    Abstract: No abstract text available
    Text: PA51CC-BD Data Sheet 64 pin uBGA socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of an Atmel T89C51CC01 in the 64 pin uBGA package using the 40 pin DIP footprint specified by Atmel. This adapter is made up of 3 sub-assemblies. They assemble via


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    PA51CC-BD socket/40 T89C51CC01 CA-BGA64 51CCBD PDF

    QFN 64 8x8 footprint

    Abstract: 8x8 64 footprint
    Text: 3MTM TEXTOOLTM OPEN-TOP SOCKETS FOR QFN APPLICATIONS NOTES: 1. MATERIALS: 30 SPRINGS CONTACTS IC GUIDES PRESSURE PAD COVER BASE 30 SS Be Cu PES PES PPS or equiv. PES PLATING : Au COLOR : BLACK COLOR : BLACK COLOR : BLACK COLOR : BLACK 2. SEE THE REGULATORY INFORMATION APPENDIX RIA


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    COOLRUNNER-II examples

    Abstract: 245RL CPLD XC2C64 from Xilinx CoolRunner-II family CP132 equivalent 8x8 keyboard and microcontroller interfacing EPM240Z M100 XC2C128 XC2C256 XC2C64
    Text: White Paper Reduce Total System Cost in Portable Applications Using Zero-Power CPLDs Introduction Traditionally, portable system designers have used ASICs and ASSPs to implement memory interfaces, I/O expansion, power-on sequencing, discrete logic functions, display, and other functions in portable systems. Cost


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    STL24NM60N

    Abstract: No abstract text available
    Text: STL24NM60N N-channel 600 V, 0.200 Ω, 16 A PowerFLAT 8x8 HV MDmesh™ II Power MOSFET Features Type VDSS @ TJmax RDS on max ID STL24NM60N 650 V < 0.215 Ω 16 A (1) 3 3 3 "OTTOMVIEW ' $ 1. The value is rated according to Rthj-case • 100% avalanche tested


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    STL24NM60N STL24NM60N PDF

    DS00167

    Abstract: DS00104 ds39500 detector brownout Microchip Product Line DS00148 DS00711 DS00092 Embedded Control Handbook DS00092 1024X16 PIC18CXXX
    Text: PIC18F010/020 Microcontroller Family The PIC18F010/020 Microcontroller Products pack all the advantages of the PIC18C architecture and the flexibility of FLASH program memory in an 8-pin package. The PIC18F010/020 products feature a 16-bit instruction set, small


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    PIC18F010/020 PIC18C 16-bit DS41151A DS41151A* DS00167 DS00104 ds39500 detector brownout Microchip Product Line DS00148 DS00711 DS00092 Embedded Control Handbook DS00092 1024X16 PIC18CXXX PDF

    24nm60n

    Abstract: PowerFLAT 24nm6 STL24NM60N
    Text: STL24NM60N N-channel 600 V, 0.200 Ω, 16 A PowerFLAT 8x8 HV MDmesh™ II Power MOSFET Preliminary data Features Type VDSS @ TJmax RDS(on) max ID STL24NM60N 650 V < 0.215 Ω 16 A (1) 3 3 3 "OTTOMVIEW ' $ 1. The value is rated according to Rthj-case


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    STL24NM60N 24nm60n PowerFLAT 24nm6 STL24NM60N PDF

    Untitled

    Abstract: No abstract text available
    Text: 325 MHz, 8 x 8 Buffered Video Crosspoint Switches AD8108/AD8109 FUNCTIONAL BLOCK DIAGRAM EATURES APPLICATIONS Routing of high speed signals including Composite video NTSC, PAL, S, SECAM Component video (YUV, RGB) Compressed video (MPEG, Wavelet) 3-level digital video (HDB3)


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    AD8108/AD8109 AD8108: AD8109: AD8110/AD8111 AD8116 AD8108 AD8109 AD8108) AD8109) 80-Lead PDF

    12N65

    Abstract: STL12N65M5 12N65M5 8534A
    Text: STL12N65M5 N-channel 650 V, 0.390 Ω, 8.5 A PowerFLAT 8x8 HV ultra low gate charge MDmesh™ V Power MOSFET Preliminary data Features Type VDSS @ TJmax RDS(on) max ID STL12N65M5 710 V < 0.430 Ω 8.5 A (1) 3 3 3 "OTTOMVIEW ' $ 1. The value is rated according to Rthj-case


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    STL12N65M5 12N65 STL12N65M5 12N65M5 8534A PDF

    4DSYSTEMS

    Abstract: 8x12 font 8x8 font oled full colour microoled
    Text: µOLED-96-G1 USERS MANUAL Embedded Intelligent OLED Display Module tiny serial display module with integrated micro-SD card support Revision 1.0 4D Systems PROPRIETORY INFORMATION The information contained in this document is the property of 4D Systems Pty. Ltd., and may


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    OLED-96-G1 au/downloads/micro-OLED/uOLED-96-G1 4DSYSTEMS 8x12 font 8x8 font oled full colour microoled PDF

    12x16 font

    Abstract: PMD235 uLCD-320-PMD2 8x8 64 footprint microVGA MicroOLED 8x12 font
    Text: µLCD 320 PMD2 µSD USERS MANUAL Serial Command Platform Revision 1.1 4D Systems PROPRIETORY INFORMATION The information contained in this document is the property of 4D Systems Pty. Ltd., and may be the subject of patents pending or granted, and must not be copied or disclosed with out


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    AGL125-QNG132

    Abstract: FLASHPRO4 A2F500M3G A2F500M3G-FGG484 oled display 96x16 A2F500 A3PE jtag connector VQ100 emmc socket BGA A3P1000 144
    Text: Product Catalog May 2010 Now, more than ever, power matters. Whether you’re designing at the board or system level, Actel’s low power FPGAs and mixed signal FPGAs are your best choice. The unique, flash-based technology of Actel FPGAs, coupled with their history of reliability, sets them apart


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    WG82574it

    Abstract: QFN 64 8x8 footprint WG82578DM JL82576EB QFN 64 9x9 footprint intel 82574L JL82599ES WG82583 JL82599EB WG82577LM
    Text: http://intel.com/go/ethernet Driver Support Microsoft Windows 7* Microsoft Windows Vista* 32 & 64 bit Microsoft Windows XP* (32 & 64 bit) Microsoft Windows CE* Microsoft Windows NT* Microsoft Windows 2000 Server* Microsoft Windows Server 2003* (32 & 64 bit)


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    RC82573E RC82573V RC82573L RC82545GM FW82546GB GD82541PI GD82541ER WG82567LM ICH10 2567V WG82574it QFN 64 8x8 footprint WG82578DM JL82576EB QFN 64 9x9 footprint intel 82574L JL82599ES WG82583 JL82599EB WG82577LM PDF

    1000-pin bga 0,8 mm

    Abstract: HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog"
    Text: Renesas Semiconductor Packages General Catalog 2004.10 Renesas Semiconductor Packages General Catalog Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble


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    Unit2607 REJ01K0003-0300 1000-pin bga 0,8 mm HQFP1414-64 HLQFP 176 Package BGA and QFP Package mounting HLQFP1414-100 MO-235 FOOTPRINT QFN 64 8x8 footprint footprint WSON LFPAK footprint Renesas "General Catalog" PDF

    TQ144

    Abstract: XC5204 matrix 8x8 PQ100 PQ160 XC5200 XC5210 VersaBLOCK PC84 VQ100
    Text: XC5200 FPGA Family Grows T he XC5200 FPGA family has been expanded to include the 2,500-gate XC5202 and the 4,000-gate XC5204. The XC5200 family now includes flexible, high-density FPGA devices ranging from 2,500 to 18,000 gates. For lower-density designs that do not


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    XC5200 500-gate XC5202 000-gate XC5204. XC5204 TQ144 matrix 8x8 PQ100 PQ160 XC5210 VersaBLOCK PC84 VQ100 PDF

    S29GL064N application notes

    Abstract: TSOP56 FOOTPRINT S29GL064N Numonyx M29W640GS hardware protection of S29GL064N Numonyx software and application Spansion Flash M29W640GT SPANSION 16
    Text: Migrating to Spansion S29GL-N from Numonyx M29W 32-64 Mb Application Note 1. Introduction This Application Note details how to migrate designs from Numonyx™ 32 Mbit M29W320E and 64 Mbit M29W640G Flash Memory devices to Spansion® 32 Mbit S29GL032N and 64 Mbit S29GL064N MirrorBit®


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    S29GL-N M29W320E M29W640G S29GL032N S29GL064N S29GL064N application notes TSOP56 FOOTPRINT Numonyx M29W640GS hardware protection of S29GL064N Numonyx software and application Spansion Flash M29W640GT SPANSION 16 PDF

    M2GL005

    Abstract: A2F060
    Text: Power Matters. CO LUT4 C OVFL LO UB ADD_S FPGA and SoC Product +/- Catalog ] A[17:0 D EN RO IN YP EN _SR CLK RST EN X ] C[43:0 SL D SN[43 D ] B[17:0 17 SHIFT >> 17 ASC SEL_C SECURITY RELIABILITY LOW POWER :0] SN-1[43 I N T E G R AT I O N FPGAs SoC FPGAs


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    MS2-002-14 M2GL005 A2F060 PDF

    emmc pcb layout

    Abstract: oled display 96x16 fpga JTAG Programmer Schematics FLASHPRO4 A3PE1500-PQ208 ACTEL flashpro A2F200M3F-FGG484 96x16 oled A2F500 VQ100
    Text: Product Catalog March 2010 Now, more than ever, power matters. Whether you’re designing at the board or system level, Actel’s low-power FPGAs and mixed-signal FPGAs are your best choice. The unique, flash-based technology of Actel FPGAs, coupled with their history of reliability, sets them apart


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    WG82579LM

    Abstract: WG82574IT NHI350AM2 WG82579V JL82599EN NHI350AM WG82579 JLX540AT2 WG82583V 82599EN
    Text: www.intel.com/go/ethernet Driver Support Microsoft Windows 7* Microsoft Windows Vista* 32 & 64 bit Microsoft Windows XP* (32 & 64 bit) Microsoft Windows CE* Microsoft Windows NT* Microsoft Windows 2000 Server* Microsoft Windows Server 2003* (32 & 64 bit)


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    82546GB RC82545GM FW82546GB 82541PI 82541ER 15x15 196-pin GD82541PI GD82541ER WG82579LM WG82574IT NHI350AM2 WG82579V JL82599EN NHI350AM WG82579 JLX540AT2 WG82583V 82599EN PDF

    Untitled

    Abstract: No abstract text available
    Text: L.C.C. Production Sockets YAMAICHI IC61 Series • SPECIFICATIONS • JEDEC standard LCC socket • High density requires less board space • SMT through hole short & through hole long type available ■ CHARACTERISTICS Insulator Resistance Breakdown Voltage


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    000MO 10mA/20mV UL94V-0 11x11 12x12 17x17 24x16 30x20 40x40 PDF

    Untitled

    Abstract: No abstract text available
    Text: YAÏ1AICHI ELECTRONICS INC bôE » L.C.C. Production Sockets • tìe145S3h ÜDQnS70 Sb? ■ YAMAICHI IC61 Series I SPECIFICATIONS JEDEC standard LCC socket High density requires less board space SMT through hole shoit & through hole long type available Terminal TVpe


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    145S3h DQnS70 30mmi2 10mA/20mV UL94V-0 40x40 11x11 GG0GS71 IC61-0324-006 PDF

    fbga 12 x 12 thermal resistance

    Abstract: FBGA160-P-1212
    Text: 1C PACKAGES Pin-inserting Type i Surface-mount Type 1C Pack. TCP Tape Carrier Package CSP (Chip Size Package) Stacked Package COB (Chip On Board) Nowadays, the prominence of higher performance, smaller and lighter electronic equipment is increasing. Accordingly, the role played by the


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    developme5x24 fbga 12 x 12 thermal resistance FBGA160-P-1212 PDF