Untitled
Abstract: No abstract text available
Text: GS88218/36CB-300M GS88218/36CD-300M 119- and 165-Bump BGA Military Temp 300 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • Military Temperature Range • FT pin for user-configurable flow through or pipeline operation
|
Original
|
PDF
|
GS88218/36CB-300M
GS88218/36CD-300M
165-Bump
x18/x36
882xxC-300M
|
Untitled
Abstract: No abstract text available
Text: GS88218/36C B/D -xxxIV 119- and 165-Bump BGA Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan
|
Original
|
PDF
|
GS88218/36C
165-Bump
x18/x36
882VxxC
882xxC
|
Untitled
Abstract: No abstract text available
Text: GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan
|
Original
|
PDF
|
GS88218/36C
165-Bump
x18/x36
882VxxC
882xxC
|
GS88218CB-300M
Abstract: No abstract text available
Text: GS88218/36CB-300M GS88218/36CD-300M 119- and 165-Bump BGA Military Temp 300 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • Military Temperature Range • FT pin for user-configurable flow through or pipeline operation
|
Original
|
PDF
|
GS88218/36CB-300M
GS88218/36CD-300M
165-Bump
x18/x36
882xxC-300M
GS88218CB-300M
|
Untitled
Abstract: No abstract text available
Text: GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan
|
Original
|
PDF
|
GS88218/36C
165-Bump
x18/x36
882VxxC
882xxC
|