Untitled
Abstract: No abstract text available
Text: GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation
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Original
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PDF
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GS881E18/32/36C
100-Pin
165-bump
100-lead
881ExxC
|
Untitled
Abstract: No abstract text available
Text: GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation
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Original
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PDF
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GS881E18/32/36C
100-Pin
165-bump
100-lead
881ExxC
|
Untitled
Abstract: No abstract text available
Text: GS881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline
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Original
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PDF
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GS881E18C
/GS881E32C
/GS881E36C
100-Pin
165-bump
supply881E18C
100-lead
|
Untitled
Abstract: No abstract text available
Text: GS881E18/32/36C T/D -xxx 100-Pin TQFP & 165-bump BGA Commercial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation
|
Original
|
PDF
|
GS881E18/32/36C
100-Pin
165-bump
supply881E18C
100-lead
881E18C
|
Untitled
Abstract: No abstract text available
Text: GS881E18/32/36C T/D -xxxIV 100-Pin TQFP & 165-bump BGA Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation • IEEE 1149.1 JTAG-compatible Boundary Scan
|
Original
|
PDF
|
GS881E18/32/36C
100-Pin
165-bump
100-lead
881ExxC
|
Untitled
Abstract: No abstract text available
Text: GS881E18/32/36C T/D -xxxI 100-Pin TQFP & 165-bump BGA Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation
|
Original
|
PDF
|
GS881E18/32/36C
100-Pin
165-bump
supply881E18C
100-lead
881E18C
|
Untitled
Abstract: No abstract text available
Text: GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation
|
Original
|
PDF
|
GS881E18/32/36C
100-Pin
165-bump
100-lead
881ExxC
|
Untitled
Abstract: No abstract text available
Text: GS881E18C T/D /GS881E32C(T/D)/GS881E36C(T/D) 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline
|
Original
|
PDF
|
GS881E18C
/GS881E32C
/GS881E36C
100-Pin
165-bump
supply881E18C
881E18C
|
Untitled
Abstract: No abstract text available
Text: GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation • IEEE 1149.1 JTAG-compatible Boundary Scan
|
Original
|
PDF
|
GS881E18/32/36C
100-Pin
165-bump
100-lead
881ExxC
|
Untitled
Abstract: No abstract text available
Text: Preliminary GS881E18/32/36C T/D -xxxV 100-Pin TQFP & 165-bump BGA Commercial Temp Industrial Temp 250 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline
|
Original
|
PDF
|
GS881E18/32/36C
100-Pin
165-bump
100-lead
881ExxC
|