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    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		PDF DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram

    HT 1200-4

    Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing
    Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher


    Original     		PDF March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing

    IC51-2084-1052-36

    Abstract: FPQ 208 0.5 10 18AB IC51-0484-806-7 IC107-3204-G IC162 FPQ-240-0 FPQ-64 IC235-0442 IC37NRB-1403-G4
    Text: 作成： 前回作成： 2001 年 4 月 1998 年 7 月 パッケージインフォメーション 第 8 章 参考資料 本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 8 章部分とな ります。


    Original     		PDF IC37F-0803-G4HT IC37NRB-1403-G4 IC37NRB-1603-G4 IC37NRB-1803-G4 IC37NRB-2003-G4 IC37NRB-2203-G4 IC37NRB-2204-G4 IC37NRB-2406-G4 IC37NRB-2806-G4 IC8620-3206-G4 IC51-2084-1052-36 FPQ 208 0.5 10 18AB IC51-0484-806-7 IC107-3204-G IC162 FPQ-240-0 FPQ-64 IC235-0442

    IC354

    Abstract: IC51-2084-1052-36 IC37F-3606-G4HT IC51-0484-806-7 OTS-24 IC107 FTQ-100-0 IC118 IC51-2084-1052-11 IC37NRB-2806-G4
    Text: 8. 参考資料 8. 参考資料 8-1. 測定用ソケット 8-1-1. 測定用ソケットメーカー - 2 8-1-2. 測定用ソケット一覧表 - 3 8-2. パッケージ関連標準規格 - 8


    Original     		PDF 300mil 400mil 600mil 750mil IC37F-0803-G4HT IC37NRB-1403-G4 IC37NRB-1603-G4 IC37NRB-1803-G4 IC354 IC51-2084-1052-36 IC37F-3606-G4HT IC51-0484-806-7 OTS-24 IC107 FTQ-100-0 IC118 IC51-2084-1052-11 IC37NRB-2806-G4

    SMD IC 2025 bl

    Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20
    Text: J2T0011-38-60 ま え が き 平素は「沖半導体製品」を御愛用いただき厚く御礼 申し上げます。 エレクトロニクス分野におきましては 半導体製品 の応用はますます広がりをみせており、その性能 機


    Original     		PDF J2T0011-38-60 Copyright1998OKIELECTRICINDUSTRYCO. J2T0002-38-60 BGA-388 BGA-420 2144-9028-01-X5X1 MIL-M-38510 MIL-STD-883 SMD IC 2025 bl ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20

    Yamaichi ic354

    Abstract: IC354 IC51-2084-1052-36 IC51-0484-806 Enplas OTS-32-0.5-01 sumitomo 3m Enplas fpq 352 IC235-0442 fpq-64-0.5-06 Enplas fpq 240
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 8. RELATED INFORMATION This document is Chapter 8 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 8. RELATED INFORMATION 8. RELATED INFORMATION


    Original     		PDF MIL-M-38510 MIL-STD-883 Yamaichi ic354 IC354 IC51-2084-1052-36 IC51-0484-806 Enplas OTS-32-0.5-01 sumitomo 3m Enplas fpq 352 IC235-0442 fpq-64-0.5-06 Enplas fpq 240