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Catalog Datasheet	MFG & Type	Document Tags	PDF
LGA 1156 PIN OUT diagram Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)	Original	DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram	PDF
HT 1200-4 Abstract: IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing Text: Hitachi Semiconductor Package Data Book ADE–410–001C 4th Edition March/98 Semiconductor & Integrated Circuit Devision, Hitachi, Ltd. Introduction Thank you for using Hitachi’s semiconductor devices. The growing market for electronic equipment requires mounting semiconductor devices with higher	Original	March/98 intern844-347360 HT 1200-4 IC51-2084-1052-11 IC51-0242-1341 YAMAICHI ic234 transistor fpq 630 IC51-0404-1511 fpq-144-0.5-03 648-0482211-A01 IC189 Series Open Top SOP, SSOP, TSOP Type I a HLQFP 176 Package drawing	PDF
IC51-2084-1052-36 Abstract: FPQ 208 0.5 10 18AB IC51-0484-806-7 IC107-3204-G IC162 FPQ-240-0 FPQ-64 IC235-0442 IC37NRB-1403-G4 Text: 作成：前回作成： 2001 年 4 月 1998 年 7 月パッケージインフォメーション第 8 章参考資料本文書は全 8 章にて構成されるパッケージインフォメーションドキュメントの第 8 章部分となります。	Original	IC37F-0803-G4HT IC37NRB-1403-G4 IC37NRB-1603-G4 IC37NRB-1803-G4 IC37NRB-2003-G4 IC37NRB-2203-G4 IC37NRB-2204-G4 IC37NRB-2406-G4 IC37NRB-2806-G4 IC8620-3206-G4 IC51-2084-1052-36 FPQ 208 0.5 10 18AB IC51-0484-806-7 IC107-3204-G IC162 FPQ-240-0 FPQ-64 IC235-0442	PDF
IC354 Abstract: IC51-2084-1052-36 IC37F-3606-G4HT IC51-0484-806-7 OTS-24 IC107 FTQ-100-0 IC118 IC51-2084-1052-11 IC37NRB-2806-G4 Text: 8. 参考資料 8. 参考資料 8-1. 測定用ソケット 8-1-1. 測定用ソケットメーカー - 2 8-1-2. 測定用ソケット一覧表 - 3 8-2. パッケージ関連標準規格 - 8	Original	300mil 400mil 600mil 750mil IC37F-0803-G4HT IC37NRB-1403-G4 IC37NRB-1603-G4 IC37NRB-1803-G4 IC354 IC51-2084-1052-36 IC37F-3606-G4HT IC51-0484-806-7 OTS-24 IC107 FTQ-100-0 IC118 IC51-2084-1052-11 IC37NRB-2806-G4	PDF
SMD IC 2025 bl Abstract: ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20 Text: J2T0011-38-60 まえがき平素は「沖半導体製品」を御愛用いただき厚く御礼申し上げます。エレクトロニクス分野におきましては半導体製品の応用はますます広がりをみせており、その性能機	Original	J2T0011-38-60 Copyright1998OKIELECTRICINDUSTRYCO. J2T0002-38-60 BGA-388 BGA-420 2144-9028-01-X5X1 MIL-M-38510 MIL-STD-883 SMD IC 2025 bl ssop64 D560 MK 50075 N QFP Package 128 lead .5mm DIP16-C-300-2 R400 S115 960f FPQ20	PDF
Yamaichi ic354 Abstract: IC354 IC51-2084-1052-36 IC51-0484-806 Enplas OTS-32-0.5-01 sumitomo 3m Enplas fpq 352 IC235-0442 fpq-64-0.5-06 Enplas fpq 240 Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 8. RELATED INFORMATION This document is Chapter 8 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 8. RELATED INFORMATION 8. RELATED INFORMATION	Original	MIL-M-38510 MIL-STD-883 Yamaichi ic354 IC354 IC51-2084-1052-36 IC51-0484-806 Enplas OTS-32-0.5-01 sumitomo 3m Enplas fpq 352 IC235-0442 fpq-64-0.5-06 Enplas fpq 240	PDF