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    64-PIN CERAMIC QUAD FLATPACK Search Results

    64-PIN CERAMIC QUAD FLATPACK Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ102MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    64-PIN CERAMIC QUAD FLATPACK Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    68-PIN

    Abstract: No abstract text available
    Text: 4.10 Package Diagrams 64-Pin Thin Quad Flat Pack A64 4-43 Package Diagrams 68-Pin Grid Array Cavity Up G68 4-44 Package Diagrams 64-Lead Plastic Thin Quad Flatpack N65 4-45 Package Diagrams 64-Lead Ceramic Quad Flatpack (Cavity Up) U65 4-46


    Original     		PDF 64-Pin 68-Pin 64-Lead

    68-PIN

    Abstract: No abstract text available
    Text: 4.10 Package Diagrams 64-Pin Thin Quad Flat Pack A64 4-40 Package Diagrams 68-Pin Grid Array Cavity Up G68 4-41 Package Diagrams 64-Lead Plastic Thin Quad Flatpack N65 4-42 Package Diagrams 64-Lead Ceramic Quad Flatpack (Cavity Up) U65 4-43


    Original     		PDF 64-Pin 68-Pin 64-Lead

    Untitled

    Abstract: No abstract text available
    Text: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.C 64 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH BOTTOM HEATSINK Rev 1, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 64 0.025 (0.635) BSC 1 49 PIN 1


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.B 64 CERAMIC QUAD FLATPACK PACKAGE CQFP WITH E-PAD Rev 2, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 49 64 0.025 (0.635) BSC 1 PIN 1 INDEX AREA


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Hermetic Packages for Integrated Circuits Package Outline Drawing R64.A 64 CERAMIC QUAD FLATPACK PACKAGE CQFP Rev 5, 10/13 1.118 (28.40) 1.080 (27.43) 0.567 (14.40) 0.547 (13.90) 0.290 (7.37) 0.255 (6.48) 64 0.025 (0.635) BSC 49 1 PIN 1 INDEX AREA 48 0.567 (14.40)


    Original     		PDF

    ordering information

    Abstract: No abstract text available
    Text: Mechanical Drawings DEVICES INCORPORATED Mechanical Drawings ❑ Ceramic Dual In-line Package ❑ Sidebraze, Hermetic Dual In-line Package ❑ Flatpack ❑ Ceramic Pin Grid Array ❑ Plastic J-Lead Chip Carrier ❑ Ceramic Leadless Chip Carrier ❑ Ceramic Flatpack


    Original     		PDF 24-pin, MS-027-AC 28-pin, MS-027-AA 32-pin, ordering information

    CERAMIC QUAD FLATPACK CQFP

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CY74FCT CERAMIC LEADLESS CHIP CARRIER LCC 24 ic 62256 dual flatpack 8 PAL20 22V10 PAL CMOS device
    Text: Ordering Information RAM, PROM, Dual-Port Static RAM, FIFO, Data Communications PREFIX DEVICE CY CY CY CY CY CY 7C128 62256 7C245 7C006 7C404 7B991 C = CMOS B = BiCMOS SUFFIX -45 D L-70 S L-35 P V-15 J -25 D -5 J MB C C C MB C FAMILY CMOS SRAM - FAST CMOS SRAM - SLOW


    Original     		PDF 7C128 7C245 7C006 7C404 7B991 MIL-STD-883C 231XNZ 7C63000A CERAMIC QUAD FLATPACK CQFP 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC CY74FCT CERAMIC LEADLESS CHIP CARRIER LCC 24 ic 62256 dual flatpack 8 PAL20 22V10 PAL CMOS device

    CY37032

    Abstract: CY37032V CY37064 CY37064V CY37128 CY37128V CY37192 CY37256 CY37384 CY37512
    Text: Ultra37000 CPLD Family 5V, 3.3V, ISR High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes do not cause pinout changes — Design changes do not cause timing changes


    Original     		PDF Ultra37000 CY37256P160-154AXC, CY37256P160-125AXC, CY37256P160-125AXI, CY37256P160-83AXC, CY37256P160-83AXI, CY37032VP44-143AXC, CY37032VP44-100AXC, CY37032VP44-100AXI, CY37032VP44-100JXI, CY37032 CY37032V CY37064 CY37064V CY37128 CY37128V CY37192 CY37256 CY37384 CY37512

    5962-9951902QYA

    Abstract: CY37128P100-125AXC U208 5962-9952301QZC CERAMIC LEADLESS CHIP CARRIER CY37032P44-125JXC CY37512P256-100BGI CY37192 CY37256 CY37384
    Text: Ultra37000 CPLD Family 5V, 3.3V, ISR High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes do not cause pinout changes — Design changes do not cause timing changes


    Original     		PDF Ultra37000 CY37128P160-100AXC, CY37128P100-100AXI, CY37192P160-154AXC, CY37192P160-125AXC, CY37192P160-125AXI, CY37192P160-83AXC, CY37192P160-83AXI, CY37256P160-154AXC, CY37256P160-125AXC, 5962-9951902QYA CY37128P100-125AXC U208 5962-9952301QZC CERAMIC LEADLESS CHIP CARRIER CY37032P44-125JXC CY37512P256-100BGI CY37192 CY37256 CY37384

    CY37032P44-154AXI

    Abstract: CY37128P160-125AC 5962-9951902QYA CY37032 CY37032V CY37064 CY37064V CY37128 CY37128V CY37192
    Text: Ultra37000 CPLD Family 5V, 3.3V, ISR High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes do not cause pinout changes — Design changes do not cause timing changes


    Original     		PDF Ultra37000 proY37192P160-83AXI, CY37256P160-154AXC, CY37256P160-125AXC, CY37256P160-125AXI, CY37256P160-83AXC, CY37256P160-83AXI, CY37032VP44-143AXC, CY37032VP44-100AXC, CY37032VP44-100AXI, CY37032P44-154AXI CY37128P160-125AC 5962-9951902QYA CY37032 CY37032V CY37064 CY37064V CY37128 CY37128V CY37192

    CY37032VP44-100AI

    Abstract: CY37128P100-125AXC
    Text: Ultra37000 CPLD Family 5V, 3.3V, ISR High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes do not cause pinout changes — Design changes do not cause timing changes


    Original     		PDF Ultra37000 CY37192P160-154AXC, CY37192P160-125AXC, CY37192P160-125AXI, CY37192P160-83AXC, CY37192P160-83AXI, CY37256P160-154AXC, CY37256P160-125AXC, CY37256P160-125AXI, CY37256P160-83AXC, CY37032VP44-100AI CY37128P100-125AXC

    i87C51

    Abstract: i87C52 ST72T71N5B1 i80c51 i87c51fa sab8031 89CXX 80c154 intel PIC16C84 MICROCHIP DATA BOOK Z08614
    Text: Flash MCU Order Code Guide Atmel Intel Philips AMD Microchip Zilog Matra Dallas Siemens AT89C51 i80C31 i80C51 i87C51 PCx80C31 SC80C31 PCx80C51 SC80C51 SC87C51 8751 87C51 PIC16C73 PIC16C74 Z84C01, Z84C50, Z08614 Z80C30, Z85C30, Z86C15 Z85230, Z850230, Z86C30


    Original     		PDF AT89C51 i80C31 i80C51 i87C51 PCx80C31 SC80C31 PCx80C51 SC80C51 SC87C51 87C51 i87C51 i87C52 ST72T71N5B1 i80c51 i87c51fa sab8031 89CXX 80c154 intel PIC16C84 MICROCHIP DATA BOOK Z08614

    CERAMIC CHIP CARRIER LCC 68 socket

    Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a


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    64 pin CERAMIC QUAD FLATPACK

    Abstract: CERAMIC QUAD FLATPACK CQFP CY7C960 CY7C961 CY7C964 VIC068A VIC64 64-pin CERAMIC QUAD FLATPACK
    Text: fax id: 5604 64 CY7C964 Bus Interface Logic Circuit Features • Comparators, counters, latches, and drivers minimize logic requirements for a variety of multiplexed and non-multiplexed buses • Directly drives VMEbus address and data signals • 8-bit comparator for slave address decoding


    Original     		PDF CY7C964 64-pin 68-pin CY7C964 64 pin CERAMIC QUAD FLATPACK CERAMIC QUAD FLATPACK CQFP CY7C960 CY7C961 VIC068A VIC64 64-pin CERAMIC QUAD FLATPACK

    CY7C386A-1AC

    Abstract: CY7C386A-0AC 7C385A CY7C385A-2AC
    Text: CY7C385A CY7C386A Very High Speed 4K 12K Gate CMOS FPGA Features D Very high speed D D D D D Ċ Loadable counter frequencies greater than 150 MHz Ċ ChipĆtoĆchip operating frequencies up to 110 MHz Ċ Input + logic cell + output delays under 6 ns Unparalleled FPGA performance for


    Original     		PDF CY7C385A CY7C386A 84pin 100pin 144pin 160pin 16bit CY7C386A-1AC CY7C386A-0AC 7C385A CY7C385A-2AC

    CY37064P44-154YMB

    Abstract: CY37512P208-100UMB CY37256P160-125UMB CY37032 CY37032V CY37064 CY37064V CY37128 CY37128V CY37032VP44-100AI
    Text: Family Ultra37000 CPLD Family[1] 5V, 3.3V, ISR™ High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes don’t cause pinout changes — Design changes don’t cause timing changes


    Original     		PDF Ultra37000TM CY37064P44-154YMB CY37512P208-100UMB CY37256P160-125UMB CY37032 CY37032V CY37064 CY37064V CY37128 CY37128V CY37032VP44-100AI

    cypress VMEbus Interface handbook

    Abstract: CY7C960 CY7C961 CY7C964 VIC068A VIC64 CY7C964-NC QFP 64 Cavity package
    Text: fax id: 5604 64 CY7C964 Bus Interface Logic Circuit Features • Comparators, counters, latches, and drivers minimize logic requirements for a variety of multiplexed and non-multiplexed buses • Directly drives VMEbus address and data signals • 8-bit comparator for slave address decoding


    Original     		PDF CY7C964 64-pin 68-pin CY7C964 cypress VMEbus Interface handbook CY7C960 CY7C961 VIC068A VIC64 CY7C964-NC QFP 64 Cavity package

    231369

    Abstract: TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package
    Text: Package Module PC Card Outlines and Dimensions February 1996 Order Number 231369-012 PACKAGE MODULE PC CARD OUTLINES AND DIMENSIONS Intel Product Identification Codes 231369 – 1 EXAMPLES A80486DX25SX387 32-Bit Microprocessor 25 MHz 168-Lead Ceramic Pin Grid Array


    Original     		PDF A80486DX25SX387 32-Bit 168-Lead NG80386SX16SX159 16-Bit 100-Lead 231369 TQFP 44 PACKAGE footprint NG80386SX16 Side Brazed Ceramic Dual-In-Line Packages CERAMIC PIN GRID ARRAY CPGA lead frame 325 A80486DX-25 TQFP 144 PACKAGE DIMENSION intel order 231369 600E12 BGA and QFP Package

    CY37032VP44-100AI

    Abstract: CY37512P208-100UM CY37512P208-100UMB CY37064P44-154YMB
    Text: Family Ultra37000 CPLD Family 5V, 3.3V, ISR™ High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes don’t cause pinout changes — Design changes don’t cause timing changes


    Original     		PDF Ultra37000TM CY37032VP44-100AI CY37512P208-100UM CY37512P208-100UMB CY37064P44-154YMB

    CY37032VP44-100AI

    Abstract: No abstract text available
    Text: Family Ultra37000 CPLD Family 5V, 3.3V, ISR™ High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes don’t cause pinout changes — Design changes don’t cause timing changes


    Original     		PDF Ultra37000TM CY37032VP44-100AI

    CY37032

    Abstract: CY37032V CY37064 CY37064V CY37128 CY37128V CY37192 CY37256 CY37384 CY37512
    Text: 1Ultra37000 Features Family Ultra37000: December 13, 1996 Revision: March 15, 2001 Ultra37000 CPLD Family 5V, 3.3V, ISR™ High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability


    Original     		PDF 1Ultra37000 Ultra37000: Ultra37000TM CY37032 CY37032V CY37064 CY37064V CY37128 CY37128V CY37192 CY37256 CY37384 CY37512

    TSOP 56 socket

    Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
    Text: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the


    Original     		PDF 68-Pin iMC00XFLKA iNC110XX TSOP 56 socket 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817

    5962-9951902QYA

    Abstract: CY37032 CY37032V CY37064 CY37064V CY37128 CY37128V CY37192 CY37256 CY37384
    Text: Ultra37000 CPLD Family 5V, 3.3V, ISR High-Performance CPLDs Features General Description • In-System Reprogrammable™ ISR™ CMOS CPLDs — JTAG interface for reconfigurability — Design changes do not cause pinout changes — Design changes do not cause timing changes


    Original     		PDF Ultra37000 CY37128V BB100 5962-9951902QYA CY37032 CY37032V CY37064 CY37064V CY37128 CY37192 CY37256 CY37384

    Untitled

    Abstract: No abstract text available
    Text: •A M I Packaging Availability AMERICAN MICROSYSTEMS, INC. August 1996 AMI offers you space-saving and cost-effective packages and package processes spanning a broad spectrum of capabilities. AMI can meet your package requirements in a variety of ways. You can choose from ten basic package


    OCR Scan     		PDF