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    5SLX12E1200 Search Results

    5SLX12E1200 Datasheets (1)

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    5SLX12E1200 ABB Semiconductors Original PDF

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    abb igbt die

    Abstract: No abstract text available
    Text: VCE IC = = 1200 V 25 A IGBT-Die 5SMX 12E1274 Die size: 6.6 x 6.5 mm Doc. No. 5SYA 1301-00 Dec 07 • • • • • Low loss, rugged SPT technology Smooth switching for good EMC Minimized gate charge, short delay times Optimized for paralleling Large bondable emitter area


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    PDF 12E1274 CH-5600 abb igbt die

    abb igbt die

    Abstract: No abstract text available
    Text: VCE IC = = 1200 V 25 A IGBT-Die 5SMX 12E1280 PRELIMINARY Die size: 6.6 x 6.5 mm Doc. No. 5SYA1306-01 July 08 • • • • • Low loss, rugged SPT technology Smooth switching for good EMC Large bondable emitter area Passivation: Silicon Nitride plus Polyimide


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    PDF 12E1280 5SYA1306-01 CH-5600 abb igbt die

    Untitled

    Abstract: No abstract text available
    Text: VCE IC = = 1200 V 25 A IGBT-Die 5SMX 12E1262 Die size: 6.6 x 6.5 mm Doc. No. 5SYA 1628-00 Feb. 05 • Low loss, rugged SPT technology • Smooth switching for good EMC • Large bondable emitter area Maximum rated values Parameter Collector-emitter voltage


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    PDF 12E1262 CH-5600

    9280A

    Abstract: 5SLX12E1200
    Text: 9& ,&  9  $ ,*%7'LH 60; + 'LH VL]H  [  PP Doc. No. 5SYA 1616-01 July 03 • /RZ ORVV WKLQ ,*%7 GLH • +LJKO\ UXJJHG 637 GHVLJQ • /DUJH IURQW ERQGDEOH DUHD 0D[LPXP UDWHG YDOXHV  3DUDPHWHU Collector-emitter voltage 6\PERO &RQGLWLRQV


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    PDF CH-5600 9280A 5SLX12E1200

    5SLX12E1200

    Abstract: No abstract text available
    Text: VCE IC = = 1200 V 50 A IGBT-Die 5SMX 12H1273 Die size: 9.1 x 9.0 mm Doc. No. 5SYA 1641-00 Apr 07 • • • • • Low loss, rugged SPT technology Smooth switching for good EMC Minimized gate charge, short delay times Optimized for paralleling Large bondable emitter area


    Original
    PDF 12H1273 CH-5600 5SLX12E1200

    IGBT abb

    Abstract: 5SLX12E1200
    Text: VCE IC = = 1200 V 25 A IGBT-Die 5SMX 12E1273 Die size: 6.6 x 6.5 mm Doc. No. 5SYA 1632-00 June 05 • • • • • Low loss, rugged SPT technology Smooth switching for good EMC Minimized gate charge, short delay times Optimized for paralleling Large bondable emitter area


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    PDF 12E1273 wE1273 CH-5600 IGBT abb 5SLX12E1200

    Untitled

    Abstract: No abstract text available
    Text: VCE IC = = 1200 V 50 A IGBT-Die 5SMX 12H1262 Die size: 9.1 x 9.0 mm Doc. No. 5SYA 1629-00 Feb. 05 • Low loss, rugged SPT technology • Smooth switching for good EMC • Large bondable emitter area Maximum rated values Parameter Collector-emitter voltage


    Original
    PDF 12H1262 CH-5600

    5SLX12E1200

    Abstract: No abstract text available
    Text: 9& ,&  9  $ ,*%7'LH 60; ( 'LH VL]H  [  PP Doc. No. 5SYA1615-01 July 03 • /RZ ORVV WKLQ ,*%7 GLH • +LJKO\ UXJJHG 637 GHVLJQ • /DUJH IURQW ERQGDEOH DUHD 0D[LPXP UDWHG YDOXHV  3DUDPHWHU Collector-emitter voltage 6\PERO &RQGLWLRQV


    Original
    PDF 5SYA1615-01 CH-5600 5SLX12E1200

    CH-5600

    Abstract: 5SYA2033-01 5SLX12E1200
    Text: 9& ,&  9  $ ,*%7'LH 60;+ 'LH VL]H  [  PP ‡ ‡ ‡ Doc. No. 5SYA1607-01 Aug 02 /RZ ORVV WKLQ ,*%7 GLH +LJKO\ UXJJHG 637 GHVLJQ /DUJH IURQW ERQGDEOH DUHD 0D[LPXP 5DWHG 9DOXHV 3DUDPHWHU Collector-Emitter Voltage (Tj = 25°C, unless specified otherwise


    Original
    PDF 5SYA1607-01 5SYA2033-01 CH-5600 5SLX12E1200

    Untitled

    Abstract: No abstract text available
    Text: VCE IC = = 1200 V 25 A IGBT-Die 5SMX 12E1280 Die size: 6.6 x 6.5 mm Doc. No. 5SYA1306-03 04 14 •     Low loss, rugged SPT technology Smooth switching for good EMC Large bondable emitter area Passivation: Silicon Nitride plus Polyimide Optimized for high DC-link voltage applications


    Original
    PDF 12E1280 5SYA1306-03 CH-5600

    Untitled

    Abstract: No abstract text available
    Text: VCE IC = = 1200 V 50 A IGBT-Die 5SMX 12H1280 PRELIMINARY Die size: 9.1 x 9.0 mm Doc. No. 5SYA1307-01 July 08 • • • • • Low loss, rugged SPT technology Smooth switching for good EMC Large bondable emitter area Passivation: Silicon Nitride plus Polyimide


    Original
    PDF 12H1280 5SYA1307-01 CH-5600

    Untitled

    Abstract: No abstract text available
    Text: 9& ,&  9  $ ,*%7'LH 60;( 'LH VL]H  [  PP ‡ ‡ ‡ Doc. No. 5SYA1601-03 Aug 02 /RZ ORVV WKLQ ,*%7 GLH +LJKO\ UXJJHG 137 GHVLJQ /DUJH IURQW ERQGDEOH DUHD 0D[LPXP 5DWHG 9DOXHV 3DUDPHWHU Collector-Emitter Voltage (Tj = 25°C, unless specified otherwise


    Original
    PDF 5SYA1601-03 5SYA2033-01 CH-5600

    Untitled

    Abstract: No abstract text available
    Text: VCE IC = = 1200 V 50 A IGBT-Die 5SMX 12H1280 Die size: 9.1 x 9.0 mm Doc. No. 5SYA1307-03 04 14 •     Low loss, rugged SPT technology Smooth switching for good EMC Large bondable emitter area Passivation: Silicon Nitride plus Polyimide Optimized for high DC-link voltage applications


    Original
    PDF 12H1280 5SYA1307-03 CH-5600

    Untitled

    Abstract: No abstract text available
    Text: VCE IC = = 1200 V 50 A IGBT-Die 5SMX 12H1274 Die size: 9.1 x 9.0 mm Doc. No. 5SYA 1302-00 Dec 07 • • • • • Low loss, rugged SPT technology Smooth switching for good EMC Minimized gate charge, short delay times Optimized for paralleling Large bondable emitter area


    Original
    PDF 12H1274 CH-5600