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Cinch Connectivity Solutions 415-0525-MM250 COAX CBL SMPM TO SMPM
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	415-0525-MM250	Bag	25		1	1 $45.31 10 $36.938 100 $30.625 1000 $30.625 10000 $30.625	Buy Now
Mouser Electronics	415-0525-MM250		25			1 $44.89 10 $40.08 100 $35.21 1000 $35.21 10000 $35.21	Buy Now
Newark	415-0525-MM250	Bulk	15		1	1 $30.3 10 $30.3 100 $30.3 1000 $30.3 10000 $30.3	Buy Now
RS	415-0525-MM250	Bulk		10 Weeks	25	1 - 10 - 100 $38.44 1000 $38.44 10000 $38.44	Get Quote
Interstate Connecting Components	415-0525-MM250					1 - 10 - 100 - 1000 - 10000 -	Buy Now

Richardson RFPD	415-0525-MM250				25	1 - 10 - 100 $29.81 1000 $28.21 10000 $28.21	Buy Now
Cinch Connectivity Solutions 415-0525-MM200 COAX CBL SMPM TO SMPM
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	415-0525-MM200	Bag	25		1	1 $44.47 10 $36.248 100 $30 1000 $30 10000 $30	Buy Now
Mouser Electronics	415-0525-MM200		21			1 $44 10 $39.26 100 $34.52 1000 $34.52 10000 $34.52	Buy Now
Newark	415-0525-MM200	Bulk	10		1	1 $29.71 10 $29.71 100 $29.71 1000 $29.71 10000 $29.71	Buy Now
RS	415-0525-MM200	Bulk		10 Weeks	25	1 - 10 - 100 $37.69 1000 $37.69 10000 $37.69	Get Quote
Interstate Connecting Components	415-0525-MM200					1 - 10 - 100 - 1000 - 10000 -	Buy Now

Richardson RFPD	415-0525-MM200				25	1 - 10 - 100 $29.17 1000 $27.56 10000 $27.56	Buy Now
Bel Fuse 415-0525-MM250 RF / Coaxial Cable Assembly, SMPM Jack to 90? SMPM Jack, 0.086" Semi Rigid, 9.8 ", 250 mm - Bag (Alt: 415-0525-MM250)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	415-0525-MM250	Bag		10 Weeks	25	1 - 10 - 100 $31.415 1000 $31.415 10000 $31.415	Buy Now
	415-0525-MM250	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Bel Fuse 415-0525-MM200 RF / Coaxial Cable Assembly, SMPM Jack to 90? SMPM Jack, 0.086" Semi Rigid, 7.9 ", 200 mm - Bag (Alt: 415-0525-MM200)
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
Avnet Americas	415-0525-MM200	Bag		10 Weeks	25	1 - 10 - 100 $30.805 1000 $30.805 10000 $30.805	Buy Now
	415-0525-MM200	Bulk			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
IPT TERMOPAD SP450-SB-1.5 25MM 25M Tape: heat transfer; W: 25mm; L: 25m; Thk: 0.45mm; 1.5W/mK; glueless
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
TME	TERMOPAD SP450-SB-1.5 25MM 25M				1	1 $109.12 10 $102.26 100 $102.26 1000 $102.26 10000 $102.26	Get Quote

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525MM2 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
Untitled Abstract: No abstract text available Text: W3E16M64S-XBX 16Mx64 DDR SDRAM FEATURES BENEFITS  DDR Data Rate = 200, 250, 266Mbps  50% SPACE SAVINGS  Package: • 219 Plastic Ball Grid Array PBGA , 21 x 25mm  Reduced part count  2.5V ±0.2V core power supply  Reduced I/O count	Original	W3E16M64S-XBX 16Mx64 266Mbps	PDF
7410 Abstract: 7410E WED3C7410E16M-XBHX WED3C750A8M-200BX WED3C7558M-XBX 90Sn10Pb 63SN 37PB CBGA 255 motorola Text: PowerPC 7410E AltiVec™/2M Byte SSRAM HiTCE™ Multi-Chip Package Optimum Density and Performance in One Package WED3C7410E16M-XBHX* Features Product Features • 7410 AltiVec™ µProcessor • 16 Mbit of Synchronous pipeline burst SRAM configured as 256Kx72 L2 Cache	Original	7410E WED3C7410E16M-XBHX* 256Kx72 25x21mm, 625mm2 352mm2 1329mm2 525mm2 x64/x72 7410 WED3C7410E16M-XBHX WED3C750A8M-200BX WED3C7558M-XBX 90Sn10Pb 63SN 37PB CBGA 255 motorola	PDF
CI 7410 Abstract: 7410 frequency divider PIN CONFIGURATION 7410 cga motorola 7410 transistor 7410 PC7410 Multi-Chip Modules motorola Text: PC7410 Microprocessor + 2MByte L2-Cache Multi-Chip Module Fact Sheet Main Features • • • • • • PC7410 RISC microprocessor 16 Mbit of Synchronous Pipelined Burst SRAM configured as 256Kx72 L2-Cache Extended temperature modules 1.8V (Core)/2.5V (I/0) for industrial and military applications	Original	PC7410 256Kx72 16Mbit BP123 CI 7410 7410 frequency divider PIN CONFIGURATION 7410 cga motorola 7410 transistor 7410 Multi-Chip Modules motorola	PDF
Untitled Abstract: No abstract text available Text: PowerPC 7410E AltiVec™/2M Byte SSRAM HiTCE™ Multi-Chip Package Optimum Density and Performance in One Package WED3C7410E16M-XBHX* Features Product Features • 7410 AltiVec™ µProcessor • 16 Mbit of Synchronous pipeline burst SRAM configured as 256Kx72 L2 Cache	Original	7410E WED3C7410E16M-XBHX* 256Kx72 625mm2 352mm2 1329mm2 525mm2 x64/x72 WED3C7410HITCE	PDF
Untitled Abstract: No abstract text available Text: 16M x 64 DDR SDRAM Multi-Chip Package Optimum Density and Performance in One Package W3E16M64S-XBX Performance Features VA N CE D DDR SDRAM Speed = 266, 250, 200MHz Core Supply Voltage = 2.5V ± 0.2V I/O Supply Voltage = 2.5V ± 0.2V - SSTL_2 compatible	Original	W3E16M64S-XBX 200MHz MIF2038	PDF
W3E16M64S-XBX Abstract: W3E32M64S-XBX Text: White Electronic Designs W3E16M64S-XBX 16Mx64 DDR SDRAM FEATURES BENEFITS DDR Data Rate = 200, 250, 266Mbps 50% SPACE SAVINGS Package: • 219 Plastic Ball Grid Array PBGA , 21 x 25mm Reduced part count Reduced I/O count • 17% I/O Reduction 2.5V ±0.2V core power supply	Original	W3E16M64S-XBX 16Mx64 266Mbps W3E32M64S-XBX) Bidi15, 25x21mm W3E16M64S-XBX W3E32M64S-XBX	PDF
WED3C750A8M-200BX Abstract: No abstract text available Text: PowerPC 750 /8Mbit SSRAM Multi-Chip Package Optimum Density and Performance in One Package WED3C7508M-200BX Features • • • A 200 MHz 750 RISC µProcessor 8 Mbit of Synchronous pipeline burst SRAM configured as 128Kx72 L2 Cache Extended temperature modules for industrial and military applications	Original	750TM/8Mbit WED3C7508M-200BX 128Kx72 WED3C750A WED3C7558M-300BX WED3C750A8M-200BX* WEDPN8M72V-XBX* 750sbd WED3C750A8M-200BX	PDF
Untitled Abstract: No abstract text available Text: WEDPN4M72V-XBX HI-RELIABILITY PRODUCT 4Mx72 Synchronous DRAM PRELIMINARY* FEATURES GENERAL DESCRIPTION • High Frequency = 100, 125MHz The 32MByte 256Mb SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 67,108,864 bits.	Original	WEDPN4M72V-XBX 4Mx72 125MHz 32MByte 256Mb) 216-bit 100MHz	PDF
Untitled Abstract: No abstract text available Text: WEDPN8M72V-XBX HI-RELIABILITY PRODUCT 8Mx72 Synchronous DRAM PRELIMINARY* FEATURES GENERAL DESCRIPTION • High Frequency = 100, 125MHz The 64MByte 512Mb SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 67,108,864 bits.	Original	WEDPN8M72V-XBX 8Mx72 125MHz 64MByte 512Mb) 432-bit 100MHz	PDF
Untitled Abstract: No abstract text available Text: WEDPN8M72V-XB2X 8Mx72 Synchronous DRAM FEATURES GENERAL DESCRIPTION  High Frequency = 100, 125, 133MHz  Package: • 219 Plastic Ball Grid Array PBGA , 21 x 25mm  Single 3.3V ± 0.3V power supply  Fully Synchronous; all signals registered on positive edge	Original	WEDPN8M72V-XB2X 8Mx72 133MHz WEDPN8M72V-XB2X 64MByte 512Mb)	PDF
WEDPN16M72V-XB2X Abstract: No abstract text available Text: White Electronic Designs WEDPN16M72V-XB2X 16Mx72 Synchronous DRAM FEATURES GENERAL DESCRIPTION High Frequency = 100, 125, 133MHz Package: • 219 Plastic Ball Grid Array PBGA , 21 x 25mm Single 3.3V ±0.3V power supply Fully Synchronous; all signals registered on positive	Original	WEDPN16M72V-XB2X 16Mx72 133MHz WEDPN16M72V-XB2X 128MByte 268anges 525mm2 133MHz	PDF
Untitled Abstract: No abstract text available Text: W3E16M64S-XBX White Electronic Designs 16Mx64 DDR SDRAM Advanced* FEATURES BENEFITS n High Frequency = 200, 250, 266MHz n 50% SPACE SAVINGS n Package: n Reduced part count n Reduced I/O count • 219 Plastic Ball Grid Array PBGA , 21 x 25mm n 2.5V ±0.2V core power supply	Original	16Mx64 266MHz 200MHz 250MHz W3E16M64S-XBX	PDF
sram 1mbyte 3.3v Abstract: 16x16 bga Multi-Chip Package MEMORY TQFP 100 PACKAGE footprint with or without underfill PC755B PCX755B Text: PC755B Microprocessor + 1MByte L2-Cache Multi-Chip Module Fact Sheet Main Features • PC755B RISC microprocessor • 8 Mbit of Synchronous Pipelined Burst SRAM configured as 128Kx72 L2-Cache • Extended temperature modules 2.0V (Core)/3.3V (I/0) for industrial and military applications	Original	PC755B 128Kx72 PCX745BVZFUxxxLE PC7410M16MGxxxLE PCX755B BP123 sram 1mbyte 3.3v 16x16 bga Multi-Chip Package MEMORY TQFP 100 PACKAGE footprint with or without underfill	PDF
ATMEL 322 Abstract: atmel 711 PC755B Text: 3& 0LFURSURFHVVRU 0%\WH /&DFKH 0XOWL&KLS 0RGXOH DFW 6KHHW 0DLQ )HDWXUHV • PC755B RISC microprocessor • 8 Mbit of Synchronous Pipelined Burst SRAM configured as 128Kx72 L2-Cache) • Extended temperature modules 2.0V (Core)/3.3V (I/0) for industrial and military applications	Original	PC755B 128Kx72 PCX745BVZFUxxxLE PC7410M16MGxxxLE PCX755B BP123 ATMEL 322 atmel 711	PDF

Untitled Abstract: No abstract text available Text: 16M x 64 DDR SDRAM Multi-Chip Package Optimum Density and Performance in One Package compatible VA N CE D W3E16M64S-XBX Performance Features • DDR SDRAM Speed = 266, 250, 200MHz • Core Supply Voltage = 2.5V ± 0.2V • I/O Supply Voltage = 2.5V ± 0.2V - SSTL_2	Original	W3E16M64S-XBX 200MHz W3E16M64S-XBX MIF2038	PDF
Untitled Abstract: No abstract text available Text: PowerPC 7410E AltiVec™/2M Byte SSRAM Multi-Chip Package Optimum Density and Performance in One Package WED3C7410E16M-XBX* Features Product Features • 7410 AltiVec™ µProcessor • 16 Mbit of Synchronous pipeline burst SRAM configured • as 256Kx72 L2 Cache	Original	7410E WED3C7410E16M-XBX* 256Kx72 625mm2 352mm2 1329mm2 525mm2 x64/x72 W72M64V-XBX	PDF
WED3C7508M-200BX Abstract: WED3C750A8M-200BX WEDPN8M72V-XBX Text: PowerPC 750 /8Mbit SSRAM Multi-Chip Package WED3C750A8M Product Sheet Rev. 1 5/01 Optimum Density and Performance in One Package WED3C7508M-200BX Features • • • A 200 MHz 750 RISC µProcessor 8 Mbit of Synchronous pipeline burst SRAM configured as 128Kx72 L2 Cache	Original	750TM/8Mbit WED3C750A8M WED3C7508M-200BX 128Kx72 25x21mm, 525mm WED3C750A 625mm2 352mm2 1329mm2 WED3C750A8M-200BX WEDPN8M72V-XBX	PDF
WEDPN16M72V-XB2X Abstract: No abstract text available Text: White Electronic Designs WEDPN16M72V-XB2X 16Mx72 Synchronous DRAM FEATURES GENERAL DESCRIPTION High Frequency = 100, 125MHz Package: • 219 Plastic Ball Grid Array PBGA , 21 x 25mm Single 3.3V ±0.3V power supply Fully Synchronous; all signals registered on positive	Original	WEDPN16M72V-XB2X 16Mx72 125MHz WEDPN16M72V-XB2X 128MByte 525mm2	PDF
cga motorola Abstract: WED3C750A8M-200BX 7410 7410E WED3C7410E16M-400BX TQFP 100 PACKAGE footprint we400 Motorola PowerPC 7410 WED3C7410E16M-400 Multi-Chip Modules motorola Text: PowerPC 7410E AltiVec™/2M Byte SSRAM Multi-Chip Package Optimum Density and Performance in One Package WED3C7410E16M-400BX Features • • • • • A 400 MHz 7410 AltiVec™ µProcessor 16 Mbit of Synchronous pipeline burst SRAM configured as 256Kx72 L2 Cache	Original	7410E WED3C7410E16M-400BX* 256Kx72 WED3C7410 MIF2009 cga motorola WED3C750A8M-200BX 7410 WED3C7410E16M-400BX TQFP 100 PACKAGE footprint we*400 Motorola PowerPC 7410 WED3C7410E16M-400 Multi-Chip Modules motorola	PDF
Untitled Abstract: No abstract text available Text: White Electronic Designs W3E16M64S-XBX 16Mx64 DDR SDRAM FEATURES BENEFITS DDR Data Rate = 200, 250, 266Mbps 50% SPACE SAVINGS Package: • 219 Plastic Ball Grid Array PBGA , 21 x 25mm Reduced part count Reduced I/O count • 17% I/O Reduction 2.5V ±0.2V core power supply	Original	W3E16M64S-XBX 16Mx64 266Mbps W3E32M64S-XBX) 25x21mm	PDF
Untitled Abstract: No abstract text available Text: WEDPN16M72V-XB2X 16Mx72 SYNCHRONOUS DRAM FEATURES GENERAL DESCRIPTION  High Frequency = 100, 125, 133MHz The 128MByte 1Gb SDRAM is a high-speed CMOS, dynamic random-access, memory using 5 chips containing 268,435,456 bits. Each chip is internally configured as a quad-bank DRAM with	Original	WEDPN16M72V-XB2X 16Mx72 133MHz 128MByte 864-bit 525mm2 133MHz	PDF
Untitled Abstract: No abstract text available Text: WEDPN8M72V-XB2X 8Mx72 Synchronous DRAM FEATURES GENERAL DESCRIPTION  High Frequency = 100, 125, 133MHz  Package: • 219 Plastic Ball Grid Array PBGA , 21 x 25mm  Single 3.3V ± 0.3V power supply  Fully Synchronous; all signals registered on positive edge	Original	WEDPN8M72V-XB2X 8Mx72 133MHz WEDPN8M72V-XB2X 64MByte 512Mb)	PDF
Untitled Abstract: No abstract text available Text: W3E16M64S-XBX 16Mx64 DDR SDRAM FEATURES BENEFITS  DDR Data Rate = 200, 250, 266Mbps  50% SPACE SAVINGS  Package: • 219 Plastic Ball Grid Array PBGA , 21 x 25mm  Reduced part count  2.5V ±0.2V core power supply  Reduced I/O count	Original	W3E16M64S-XBX 16Mx64 266Mbps	PDF
with or without underfill Abstract: WED3C7410E16M-400BX WED3C750A8M-200BX WED3C7558M-XBX WED3C755E8M-XBX 21mmx25mm Text: PowerPC 755E/8Mbit SSRAM Multi-Chip Package Optimum Density and Performance in One Package WED3C755E8M-XBX Features • 300 or 350 MHz 755E Rev RISC µProcessor • 8 Mbit of Synchronous pipeline burst SRAM configured as 128Kx72 L2 Cache • Extended temperature modules 2.0V (Core)/3.3V (I/0) for	Original	755E/8Mbit WED3C755E8M-XBX 128Kx72 25x21mm, 525mm2. WED3C755E8M-XBX x64/x72 WED3C755E8M MIF2032 with or without underfill WED3C7410E16M-400BX WED3C750A8M-200BX WED3C7558M-XBX 21mmx25mm	PDF

525MM2 Search Results

525MM2 Price and Stock

Cinch Connectivity Solutions 415-0525-MM250

Cinch Connectivity Solutions 415-0525-MM200

Bel Fuse 415-0525-MM250

Bel Fuse 415-0525-MM200

IPT TERMOPAD SP450-SB-1.5 25MM 25M

525MM2 Datasheets Context Search

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7410

CI 7410

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W3E16M64S-XBX

WED3C750A8M-200BX

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WEDPN16M72V-XB2X

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sram 1mbyte 3.3v

ATMEL 322

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WED3C7508M-200BX

WEDPN16M72V-XB2X

cga motorola

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with or without underfill