pmi ref 02
Abstract: PK-70873-0259
Text: 10 PLATING: NOTES: 1 - HOUSING M ATERIAL: LCP G LAS S FILLED UL 94V-0 COLOR: BLACK. 15u70.38um MIN. GOLD P L A T E IN CONTACT A R E A 75u71.9um MIN. TIN IN SOLDER AR EA . BOTH OVER 50u71.27um MIN. NICKEL O VERALL. 2 - TERM INAL M ATERIAL: PHOSPHOR BRONZE 3 - SEE S H E E T 2 FOR CIRCUIT SIZE,
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PS-79107.
PK-70873-0217
PK-70873-0259.
SD-79109-001
pmi ref 02
PK-70873-0259
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Untitled
Abstract: No abstract text available
Text: 12 11 10 7 8 74320 NOTES: 1.MATERIALS: FRONT SHIELD — DEEP DRAW STEEL. BACK SHIELD — STAINLESS STEEL. HOUSING —GLASS FILLED POLYMER,WHITE/NATURE.UL 94V-0. TAIL ALIGNER — GLASS FILLED POLYMER.WHITE/NATURE.UL 94V -0. CONTACT — COPPER ALLOY. MICROCROSS GROUND — COPPER ALLOY.
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PS-74320-001
30u70
100u72
50u71
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A7910
Abstract: No abstract text available
Text: 10 2.00 ± 0 .0 8 NON-ACCUM 0 0 .7 1 1 0 .0 8 ROW A RECOMMENDED PCB LAYOUT ROW B NOTES: 1 HOUSING MATERIAL: GLASS FILLED HIGH TEMP THERMOPLASTIC, COLOR: BLACK 2) TERMINAL MATERIAL: PHOSPHOR BRONZE 3) SEE SHT 2 FOR CKT SIZE, PART NUMBERS AND OVERALL DIMENSIONS, SEE SHT 3 FOR VOIDS.
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PS-79107
PK-70873-0180
30u70
75u71
50u71
15u70
A7910
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Untitled
Abstract: No abstract text available
Text: 10 87758 VIEW P 0.50 TYP BOTH S ID E ' 4.00 GOLD REF MEAS POINT A A PART NUMBER CKT SIZE 8 7 7 5 8 -0 0 0 8 8 A I/ B 7.90 6.00 \& \0 O 2 O \X \Ÿ \ A NOTES: 1. MATERIAL: HOUSING: 30% G.F. NYLON 46. 9 4 V -0 . COLOR: BLACK PIN: 0.50mm SO. PHOSPHOR BRONZE 510
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15u70
75u71
50u71
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SD-87693-202
Abstract: No abstract text available
Text: 10 •141.00 ■ I- 7.50 | 2:.6V .6 v j|[ ianonooononononnnnnononononoD onooononoon i ODOQOQDQOQOQOQODODOQOQOQOQOQDQOQDOOQOQDDm PIN 1- ■165.0 MAX. ■148.0 MAX.
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n0n0n0n0n0n0nDnDnDn0n0n0D0D0B000000000Da2
30u70
79u72uM
SD-87693-202
SD-87693-202
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Untitled
Abstract: No abstract text available
Text: 12 11 10 9 8 7 6 5 4 2 3 74320 NOTES: •36.83 1. M ATERIALS: FRONT SHIELD — BACK SHIELD — DEEP DRAW STEEL. STAIN LES S STEEL. HOUSING — G LASS FILLED POLYMER,W HITE/NATURE.UL 9 4 V -0 . TA IL ALIGNER — CONTACT — G LASS FILLED POLYMER.W HITE/NATURE.UL 9 4 V -0 .
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SD-74320-051
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LA 7693
Abstract: No abstract text available
Text: 10 •141.00 ■ i - 7.50 Iw p a n o D O D O D O D o n o D o n o D o n o D n D n n o D o o o o o D O D O D O B O o o o o n o o o p iU B v ta D O D o n o D o n o D O D o n n n o n o n o n o p o n o n o n n D O D O P a H [E H 3j 1
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Untitled
Abstract: No abstract text available
Text: 87693 10 28.93 MAX. — I i P.0.25 T 1. CARD SLOT ACCEPTS 1.27i0.10 MODULE THICKNESS. [MEASURED OVER P.C.PADS 2. RECOMMENDED MODULE LAYOUT SHALL BE PER SHEET 2. THIS DESIGN IS BASED ON DESIGN OBJECTIVES 3. RECOMMENDED PLATING ON MODULE PADS: 30u70.76uM AND IS STRICTLY TEN TA TIVE. IT MAY CHANGE
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30u70
15ulN>
60ulN)
SD-87693-001
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Untitled
Abstract: No abstract text available
Text: 10 2.00 ±0.08 NON-ACCUM. 0 0.71 ±0.08 2.00 ±0.08 ROW 4.19 A RECOMMENDED PCB LA Y O U T 2.00 NOTES: 1 HOUSING MATERIAL: GLASS FILLED HIGH TEMP THERMOPLASTIC, COLOR: BLACK 2) TERMINAL MATERIAL: PHOSPHOR BRONZE 3) SEE SHT 2 FOR CKT SIZE, PART NUMBERS AND OVERALL DIMENSIONS, SEE SHT 3 FOR VOIDS.
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PS-79107
PK-70873-0180
30u70
50u71
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Untitled
Abstract: No abstract text available
Text: 10 •B - 2.0 0 ±0.08 NON-ACCUM. -A 0 0.71 ±0.08 ROW A 4.19 2.00 mm RECOMMENDED PCB LAYOUT ROW B 25 NOTES: 1 HOUSING M ATER IAL: G LA S S FILLED HIGH TEMP THERM OPLASTIC, COLOR: BLACK 2) TERM IN AL M ATER IAL: PHOSPHOR BRONZE SEE TAB LE 7) 3) S E E S H T 2 & 3 FOR CKT SIZE, P A R T NUMBERS
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PS-79107
PS-79107.
PK-70873-0180
75u71
50u71
SDA-79107-*
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79107-7024
Abstract: 79107-7012 79107-0054
Text: 10 2.0 0 ± 0.08 0 0 .7 1 1 0 .0 8 NON-ACCUM a 1/ NJ Tr + i| ¡I I f / n •4 I ROW A I ROW B / I RECOMMENDED PCB LAYOUT f a SECTION B-B NOTES: 1) HOUSING M ATE R IA L: G LA S S FILLED HIGH TEMP THERM OPLASTIC, COLOR: BLACK 2) TERM IN AL M ATER IAL: PHOSPHOR BRONZE
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PS-79107
PS-79107.
PK-70873-0180
30u70
75u71
50u71
25uNJ
SDA-79107-*
79107-7024
79107-7012
79107-0054
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Untitled
Abstract: No abstract text available
Text: 10 2 .0 0 ± 0.08 N O N -A C C U M . t0 .0 8 2.0 0 ±0.08 ROW A R E C O M M E N D E D PCB L A Y O U T NOTES: 1 HODSING NATERIAD: GDASS FIDDED HIGH TENP THERNOPDASTIC, CODOR: BDACK 2) TERMINAD MATERIAD: PHOSPHOR BRONZE 3) SEE SHT 2 FOR CKT SIZE, PA R T NDNBERS
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30u70
15u70
75u71
50u71
40u71
40uV1
SDA-79107-*
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Untitled
Abstract: No abstract text available
Text: 12 10 11 8 74320 NOTES: - 3 6 .8 3 - f I 18 62 7 FRONT SHIELD — DEEP DRAW STEEL. 9 w •Jrt 18 33 1.MATERIALS: - BACK SHIELD — STAIN LES S STEEL. HOUSING — G LASS FILLED POLYMER,W HITE/NATURE,UL 9 4 V -0 .
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100u72
50u71
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Untitled
Abstract: No abstract text available
Text: 87693 10 28.93 MAX. — I P .0.25 T NOTES: 1. CARD SLOT ACCEPTS 1.27i0.10 MODULE THICKNESS. [MEASURED OVER P.C.PADS 2. RECOMMENDED MODULE LAYOUT SHALL BE PER SHEET 2. THIS DESIGN IS BASED ON DESIGN OBJECTIVES 3. RECOMMENDED PLATING ON MODULE PADS: 30u70.76uM
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30u70
15ulN>
60ulN)
50ulN>
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Untitled
Abstract: No abstract text available
Text: 12 11 10 7 8 74320 NOTES: 1. MATERIALS: FRONT SHIELD — DEEP DRAW STEEL. BACK SHIELD — STA IN LESS STEEL. HOUSING — G LASS FILLED POLYMER.WHITE/NATURE.UL 94V-0. TAIL ALIGNER — G LASS FILLED POLYMER,WHITE/NATURE.UL 94V-0. CONTACT — COPPER ALLOY. MICROCROSS GROUND — COPPER ALLOY.
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PS-74320-001
PK-74320-044.
PS-74320-001
SD-74320-133
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cd 1619
Abstract: No abstract text available
Text: 10 2.0 0 ± 0.08 0 0 .7 1 1 0 .0 8 NON-ACCUM / 1/ n / NJ Tr + i| ¡I I f a •4 I ROW A I ROW B I RECOMMENDED PCB LAYOUT f a SECTION B-B SEE TAB LE 7) ■(2.00) PLATING OPTION: 0.38 "O " NOTES: 1) HOUSING MATERIAL: GLASS FILLED HIGH TEMP THERMOPLASTIC, COLOR: BLACK
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PS-79107
PS-79107.
PK-70873-0180
30u70
75u71
50u71
SDA-79107-*
cd 1619
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