TLA-6T121
Abstract: TLA-6T102-T TLA-6T103 TLA-6T118 6T115 78Q2120 DP83843 ICS1890 LXT970A ML6673
Text: 1/18 001-01 / 20020221 / ed415_tla6t.fm LAN Components TLA-6T102/103/106/107/109/110/111/112/115/116/117/ 118/119/120/121/122/124/401/402/403/404/405 10/100BASE-TX Pulse Transformers TLA-6T102 FEATURES • 16-pin SOP package(1.27mm=50mil pin pitch). • Excellent common-mode noise suppression.
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10/100BASE-TX
TLA-6T102
16-pin
50mil
100kHz]
DP83843,
ML6673,
ICS1890,
78Q2120.
TLA-6T102-T:
TLA-6T121
TLA-6T102-T
TLA-6T103
TLA-6T118
6T115
78Q2120
DP83843
ICS1890
LXT970A
ML6673
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE 32 PIN PLASTIC FPT-32P-M02 EIAJ code : ∗SOP032-P-0450-1 32-pin plastic SOP Lead pitch 50mil Nominal dimensions 50mil Standard Conforms with EIAJ:TYPE IV Lead shape Gullwing Sealing method Plastic mold FPT-32P-M02 32-pin plastic SOP
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FPT-32P-M02
OP032-P-0450-1
50mil
450mil
32-pin
FPT-32P-M02)
1994IAJ
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE 24 PIN CERAMIC FPT-24C-A01 24-pin ceramic SOP Lead pitch 50mil Lead shape Straight Sealing method Metal seal FPT-24C-A01 24-pin ceramic SOP (FPT-24C-A01) 0.25(.010)MIN 6.99±0.64 (.275±.025) 10.16±0.18 (.400±.007) 7.11(.280) 23.04(.907)
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FPT-24C-A01
50mil
24-pin
FPT-24C-A01)
F24006SC-2-2
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LCC 44
Abstract: CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 44 LCC Package PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC WQFN044-G-S650-1
Text: LEADLESS CHIP CARRIER 44 PAD CERAMIC LCC-44C-F01 EIAJ code : WQFN044-G-S650-1 Lead pitch 50mil Package width x package length 650 × 50mil Sealing method Frit seal 44-pad ceramic LCC LCC-44C-F01 44-pad ceramic LCC (LCC-44C-F01) R0.23(.009)TYP (44 PLCS)
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LCC-44C-F01
WQFN044-G-S650-1
50mil
650mil
44-pad
LCC-44C-F01)
C44001SC-2-2
LCC 44
CERAMIC LEADLESS CHIP CARRIER
CERAMIC LEADLESS CHIP CARRIER LCC 44
LCC Package
PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC
WQFN044-G-S650-1
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991066
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE 18 PIN CERAMIC FPT-18C-C01 18-pin ceramic SOP Lead pitch 50mil Lead shape Straight Sealing method Cerdip FPT-18C-C01 18-pin ceramic SOP (FPT-18C-C01) +0.33 11.10 –0.05 +.013 .437 –.002 0.64(.025)MAX 0.97±0.18 (.038±.007) 7.06±0.51
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FPT-18C-C01
50mil
18-pin
FPT-18C-C01)
F18001SC-2-2
991066
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a06 transistor
Abstract: PGA-441C-A06 441pin 441-pin
Text: PIN GRID ARRAY PACKAGE 441 PIN CERAMIC PGA-441C-A06 441-pin ceramic PGA Lead pitch 50mil Pin matrix 27 Sealing method Metal seal PGA-441C-A06 441-pin ceramic PGA (PGA-441C-A06) 0.20 ± 0.05 DIA. (.008 ± .002) C 0.50 (.020) TYP. (3 PLCS) 25.40 ± 0.50 SQ
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PGA-441C-A06
50mil
441-pin
PGA-441C-A06)
R441006SC-1-2
a06 transistor
PGA-441C-A06
441pin
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PGA257-C-S19U-1
Abstract: 256c 256-PIN
Text: PIN GRID ARRAY PACKAGE 256 PIN CERAMIC PGA-256C-A01 EIAJ code : ∗PGA257-C-S19U-1 256-pin ceramic PGA Number of pins 257 pins includes extra index pin Lead pitch 50mil Pin matrix 19 Sealing method Metal seal (PGA-256C-A01) 256-pin ceramic PGA (PGA-256C-A01)
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PGA-256C-A01
PGA257-C-S19U-1
50mil
256-pin
PGA-256C-A01)
R256001SC-5-3
PGA257-C-S19U-1
256c
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TSOP032-P-0400-1
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 32 PIN PLASTIC FPT-32P-M17 EIAJ code : TSOP032-P-0400-1 Lead pitch 50mil Package width 400mil Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold 32-pin plastic TSOP II (FPT-32P-M17) * : Resin protrusion. (Each side : 0.15 (.006) Max)
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FPT-32P-M17
TSOP032-P-0400-1
50mil
400mil
32-pin
FPT-32P-M17)
TSOP032-P-0400-1
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Untitled
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 26 PIN PLASTIC FPT-26P-M02 Lead pitch 50mil Package width 300mil Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold 26-pin plastic TSOP II (FPT-26P-M02) * : Resin protrusion. (Each side : 0.15 (.006) Max)
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FPT-26P-M02
50mil
300mil
26-pin
FPT-26P-M02)
F26002S-3C-3
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209MIL
Abstract: No abstract text available
Text: SMALL OUTLINE PACKAGE 16 PIN CERAMIC FPT-16C-C02 16-pin ceramic SOP Lead pitch 50mil Row spacing 209mil Lead shape Gullwing Sealing method Cerdip FPT-16C-C02 16-pin ceramic SOP (FPT-16C-C02) 0.43±0.05 (.0170±.002) 2.41(.095) MAX 0.05(.002) MIN 0.76(.030)
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FPT-16C-C02
50mil
209mil
16-pin
FPT-16C-C02)
F16016SC-1-2
209MIL
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LCC 18 Pin Package
Abstract: QFJ044-P-S653-2
Text: PLASTIC LEADED CHIP CARRIER 44 PIN PLASTIC LCC-44P-M02 EIAJ code : ∗QFJ044-P-S653-2 Lead pitch 50mil Package width x package length 653 × 653mil Lead shape J bend Sealing method Plastic mold 44-pin plastic QFJ PLCC (LCC-44P-M02) 44-pin plastic QFJ (PLCC)
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LCC-44P-M02
QFJ044-P-S653-2
50mil
653mil
44-pin
LCC-44P-M02)
LCC 18 Pin Package
QFJ044-P-S653-2
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE 16 PIN PLASTIC FPT-16P-M03 EIAJ code : ∗SOP016-P-0375-1 16-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-16P-M03 16-pin plastic SOP
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FPT-16P-M03
OP016-P-0375-1
50mil
375mil
16-pin
FPT-16P-M03)
00pitch
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FPT-24P-M01
Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE 24 PIN PLASTIC FPT-24P-M01 EIAJ code : ∗SOP024-P-0300-1 Lead pitch 50mil Nominal dimensions 300mil Standard Conforms with EIAJ:TYPE II Lead shape Gullwing Sealing method Plastic mold 24-pin plastic SOP FPT-24P-M01 24-pin plastic SOP
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FPT-24P-M01
OP024-P-0300-1
50mil
300mil
24-pin
FPT-24P-M01)
FPT-24P-M01
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m7207
Abstract: No abstract text available
Text: SINGLE IN-LINE TYPE MODULE 72 PIN PLASTIC MSS-72P-P76 Lead pitch 50mil Motherboard material Plastic Mounted package material Plastic Pin plating Gold 72-pin plastic SIMM socket type (MSS-72P-P76) 72-pin plastic SIMM (socket type) (MSS-72P-P76) 107.95±0.13
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MSS-72P-P76
50mil
72-pin
MSS-72P-P76)
m7207
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Untitled
Abstract: No abstract text available
Text: SINGLE IN-LINE TYPE MODULE 72 PIN PLASTIC MSS-72P-P74 Lead pitch 50mil Motherboard material Plastic Mounted package material Plastic Pin plating Gold 72-pin plastic SIMM socket type (MSS-72P-P74) 72-pin plastic SIMM (socket type) (MSS-72P-P74) 107.95±0.13
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MSS-72P-P74
50mil
72-pin
MSS-72P-P74)
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE J-LEADED PACKAGE 32 PIN PLASTIC LCC-32P-M03 EIAJ code : ∗SOJ032-P-0400-1 32-pin plastic SOJ Lead pitch 50mil Package width 400mil Lead shape J bend Sealing method Plastic mold LCC-32P-M03 32-pin plastic SOJ (LCC-32P-M03) * : Resin protrusion. (Each side : 0.15 (.006) max)
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LCC-32P-M03
SOJ032-P-0400-1
50mil
400mil
32-pin
LCC-32P-M03)
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diode s453
Abstract: QFJ028-P-S453-2 LCC-28P-M03
Text: PLASTIC LEADED CHIP CARRIER 28 PIN PLASTIC LCC-28P-M03 EIAJ code : ∗QFJ028-P-S453-2 Lead pitch 50mil Package width x package length 453 × 453mil Lead shape J bend Sealing method Plastic mold 28-pin plastic QFJ PLCC (LCC-28P-M03) 28-pin plastic QFJ (PLCC)
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LCC-28P-M03
QFJ028-P-S453-2
50mil
453mil
28-pin
LCC-28P-M03)
diode s453
QFJ028-P-S453-2
LCC-28P-M03
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SIMM 30-pin
Abstract: p03 transistor MSS-30P-P03 30-pin
Text: SINGLE IN-LINE TYPE MODULE 30 PIN PLASTIC MSS-30P-P03 Lead pitch 50mil Motherboard material Plastic Mounted package material Plastic Pin plating Solder 30-pin plastic SIMM socket type (MSS-30P-P03) 30-pin plastic SIMM (socket type) (MSS-30P-P03) 88.90 ±0.13(3.500 ±.005)
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MSS-30P-P03
50mil
30-pin
MSS-30P-P03)
SIMM 30-pin
p03 transistor
MSS-30P-P03
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE 24 PIN PLASTIC FPT-24P-M02 EIAJ code : ∗SOP024-P-0375-1 24-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-24P-M02 24-pin plastic SOP
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FPT-24P-M02
OP024-P-0375-1
50mil
375mil
24-pin
FPT-24P-M02)
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Untitled
Abstract: No abstract text available
Text: SINGLE IN-LINE TYPE MODULE 72 PIN PLASTIC MSS-72P-P24 Lead pitch 50mil Motherboard material Plastic Mounted package material Plastic Pin plating Solder 72-pin plastic SIMM socket type (MSS-72P-P24) 72-pin plastic SIMM (socket type) (MSS-72P-P24) 107.95±0.13(4.250±.005)
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MSS-72P-P24
50mil
72-pin
MSS-72P-P24)
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE 20 PIN PLASTIC FPT-20P-M05 EIAJ code : ∗SOP020-P-0375-2 20-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-20P-M05 20-pin plastic SOP
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FPT-20P-M05
OP020-P-0375-2
50mil
375mil
20-pin
FPT-20P-M05)
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE 16 PIN PLASTIC FPT-16P-M04 EIAJ code : ∗SOP016-P-0225-1 Lead pitch 50mil Nominal dimensions 225mil Standard Conforms with EIAJ: TYPE I Lead shape Gullwing Sealing method Plastic mold 16-pin plastic SOP FPT-16P-M04 16-pin plastic SOP
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FPT-16P-M04
OP016-P-0225-1
50mil
225mil
16-pin
FPT-16P-M04)
00pitch
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CERAMIC LEADLESS CHIP CARRIER
Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 52 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC LCC-16C-F01
Text: LEADLESS CHIP CARRIER 16 PAD CERAMIC LCC-16C-F01 EIAJ code : ∗QFN016-G-S250-1 16-pad ceramic LCC Lead pitch 50mil Package width x package length 250 × 50mil Sealing method Frit seal LCC-16C-F01 *Shape of PIN NO.1 INDEX : Subject to change without notice.
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LCC-16C-F01
QFN016-G-S250-1
50mil
250mil
16-pad
LCC-16C-F01)
C16003SC-2-2
CERAMIC LEADLESS CHIP CARRIER
CERAMIC LEADLESS CHIP CARRIER LCC 52
PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC
LCC-16C-F01
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quad flat j-leaded package
Abstract: QFJ-44C-C01
Text: QUAD FLAT J-LEADED PACKAGE 44 PIN CERAMIC QFJ-44C-C01 44-pin ceramic QFJ Lead pitch 50mil Package width x package length 650 × 50mil Lead shape J bend Sealing method Cerdip QFJ-44C-C01 44-pin ceramic QFJ (QFJ-44C-C01) 17.53±0.13SQ (.690±.005) +0.25
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QFJ-44C-C01
50mil
650mil
44-pin
QFJ-44C-C01)
J44001SC-4-2
quad flat j-leaded package
QFJ-44C-C01
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