GET56NGBB22GVE
Abstract: 100-CG2293 ITE888 Q211 GET16RFWB12GVE 100-CG2198 GET40EFSB22GVE T48E amd radeon hd circuit pin diagram G-T16R
Text: EMBEDDED SOLUTIONS AM D EM BEDDE D G-SE RIE S PLATFO RM The world’s first combination of low-power CPU and advanced GPU integrated into a single embedded device. PRODUCT OVERVIEW FEATURES AND BENEFITS The AMD Embedded G-Series processor is the world’s first
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49282I
GET56NGBB22GVE
100-CG2293
ITE888
Q211
GET16RFWB12GVE
100-CG2198
GET40EFSB22GVE
T48E
amd radeon hd circuit pin diagram
G-T16R
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8041
Abstract: common mode choke surface mount common mode choke
Text: CHOKE Surface Mount Common Mode Choke 8041 • 4 Line Common Mode Choke • Reduce radiated EMI emissions • Filters common mode noise for EMI reduction • Common mode attenuation from 100 kHz to 500 MHz • 500 Vrms Isolation • PCMCIA package MECHANICAL AND SCHEMATIC
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100kHz
10MHz
30MHz
50MHz
100MHz
300MHz
500HMz
8041
common mode choke
surface mount common mode choke
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POWR1014
Abstract: Power1014
Text: MANAGING POWER SEQUENCING FOR THE LatticeSC FPGA A Lattice Semiconductor White Paper February 2007 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com 1 Managing Power Sequencing for the LatticeSC FPGA
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POWR1014:
POWR1014
POWR1014
Power1014
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E4690
Abstract: GET56NGBB22GVE GDDR5 phy AMD Athlon 64 X2 dual 4800 pin out E6460 E6760 TEN54LSDV23GME 100-CG2293 6970M RADEON e2400
Text: A M D EM BE DDE D SOLUTIONS: Product Selection Guide AMD Embedded: The Next Generation of Embedded Computing AMD helps deliver the right balance of CPU, GPU and chipset capabilities, to give designers the solutions they need to create the next generation of embedded applications. Along with a broad range
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43838Q
E4690
GET56NGBB22GVE
GDDR5 phy
AMD Athlon 64 X2 dual 4800 pin out
E6460
E6760
TEN54LSDV23GME
100-CG2293
6970M
RADEON e2400
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Untitled
Abstract: No abstract text available
Text: PBW J GEC PLESSEY CT3193-1.4 PLANAR INSERTED FERRITE SUBSTRATES FOR MICROWAVE INTEGRATED CIRCUITS GPS have the capability to supply a variety of metalised substrates manufactured using the state-of-the-art pattern plating technique. * FILMS: ADHESION LAYER
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OCR Scan
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CT3193-1
500HMz
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