QFN108
Abstract: QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
Text: v 11. 2 Package Mechanical Drawings Ceramic Pin Grid Array 84-Pin CPGA Top View 0.050" ± 0.010" Pin #1 ID 0.045" 0.055" 0.015" 0.018" ± 0.002" 0.100" BSC 1.100" ± 0.020" square 0.072" 0.088" L 0.120" 0.140" Side View K J H G F 1.000" BSC E D C B A 1 2 3
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84-Pin
A1010B
A1020B
100-Pin
QFN108
QFN-132
kl1-v1
208 pin rqfp drawing
qfn132
RT3PE3000L CQ256
DIMENSIONS pqfp 100
actel package mechanical drawing
Actel A40MX04
PBGA 23X23 0.8 pitch
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MS-034-AAn-1
Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel
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Q1-02
BF957
BG225
BG256
BG352
BG432
BG492
BG560
BG575
BG728
MS-034-AAn-1
ak 957
MS-034 1152 BGA
BGA 31 x 31 mm
MO-047
MS026-ACD
MO-113-AA-AD
MS-034-AAU-1
MO-151 AAL-1
OPD0002
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48LD
Abstract: No abstract text available
Text: LP62S16256F-I Series 256K X 16 BIT LOW VOLTAGE CMOS SRAM Document Title 256K X 16 BIT LOW VOLTAGE CMOS SRAM Revision History History Issue Date Remark 0.0 Initial issue November 22, 2002 Preliminary 0.1 Change ICC2 from 15mA to 8mA April 18, 2003 0.2 Modify 48LD CSP bottom view outline drawing
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LP62S16256F-I
MO192
48LD
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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TAIYO PSR 4000
Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).
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Untitled
Abstract: No abstract text available
Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch
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330mm
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CBG064-052A
Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability
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LGA 1150
Abstract: No abstract text available
Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch
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330mm
LGA 1150
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639X
Abstract: LGA 1150
Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter 150mm for SBGA and contain between 250 and 2500 devices.
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330mm
150mm
639X
LGA 1150
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taiyo PSR4000
Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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fBGA package tray 12 x 19
Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2
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116-Pin
Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size
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C13185EJ1V0PF00
116-Pin
PBGA 256 reflow profile
semiconductor cross index
Lead Free reflow soldering profile BGA
reflow soldering profile BGA
224-pin plastic ball grid array 0.8mm
JIS-Z0202
tray qfp 14x14 1.4
tray bga 10x10
pcb warpage after reflow
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Theta JC of FBGA
Abstract: cpga dimensions cpga weight 84 pin plcc ic base
Text: v3.0 Package Characteristics and Mechanical Drawings Pa c ka ge T he r m a l C ha r a ct e r i s t i c s Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)
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W-CSP footprint
Abstract: MO-211-C DM056 wcsp package reliability WLCSP stencil design EH11 wcsp wcsp qualification WAN0158
Text: w WAN_0202 Guidelines on How to Use W-CSP Packages and Create Associated PCB Footprints INTRODUCTION The Wolfson Wafer level ChipScale Package W-CSP is a die-sized package, which obtains electrical contact via solder bumps on the bottom surface of the device to a Printed Circuit Board
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY CM1442 LCD and Camera EMI Filter Array with ESD Protection Features Product Description • The CM1442 is a family of pi-style EMI filter arrays with ESD protection, which integrates six and eight filters C-R-C in Chip Scale Package form factor with
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CM1442
CM1442
15pF-100â
-15pF
120MHz
48Mbps.
CM1442-08
178mm
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CM1300
Abstract: CM1300-03CP CM1300-03CS CSPRC032A 250 micro solder ball
Text: CM1300 4 Channel EMI Filter Network Features Product Description • • The CM1300 is a 4-channel low pass EMI filter R-C-R configuration manufactured in a Chip Scale Package (CSP). Many portable applications require the attenuation of signals in the 800-3000 MHz band. California
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CM1300
CM1300
CSPRC032A
485mm
985mm
178mm
CM1300-03CP
CM1300-03CS
CSPRC032A
250 micro solder ball
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Untitled
Abstract: No abstract text available
Text: CM1440 6 Channel EMI Filter Array with ESD Protection Features Product Description • • The CM1440 is a six channel low-pass EMI filter array with ESD protection that reduces EMI/RFI emissions while providing robust protection from ESD strikes. Each EMI filter channel integrates a high quality pistyle filter 30pF-100Ω-30pF which provides greater
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CM1440
CM1440
30pF-100â
-30pF)
800MHz
178mm
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY CM1440 6 Channel EMI Filter Array with ESD Protection Features Product Description • • The CM1440 is a six channel low-pass EMI filter array with ESD protection that reduces EMI/RFI emissions while providing robust protection from ESD strikes.
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CM1440
CM1440
30pF-100â
-30pF)
800MHz
178mm
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ms-029
Abstract: FBGA1152
Text: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)
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N406
Abstract: CM1440 CM1440-06CP CM1440-06CS
Text: CM1440 6 Channel EMI Filter Array with ESD Protection Features Product Description • • The CM1440 is a six channel low-pass EMI filter array with ESD protection that reduces EMI/RFI emissions while providing robust protection from ESD strikes. Each EMI filter channel integrates a high quality pistyle filter 30pF-100Ω-30pF which provides greater
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CM1440
CM1440
30pF-100-30pF)
800MHz
178mm
N406
CM1440-06CP
CM1440-06CS
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY CM1441 4-Channel EMI Filter Array w/ ESD + 4-channel ESD Array Features Product Description • The CM1441 is a multichannel EMI/ESD array consisting of four low-pass filter + ESD channels to reduce EMI emissions on data ports and lines and four dedicated ESD-only channels. Each EMI filter channel integrates a high quality pi-style filter 30pF-100Ω-30pF
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CM1441
CM1441
30pF-100â
-30pF)
800MHz
178mm
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250 micro solder ball
Abstract: 5 ball csp drawing EMI/RFI filter schematic diagram CM1441 CM1441-07CP marking B4 diode
Text: CM1441 4-Channel EMI Filter Array w/ ESD + 4-channel ESD Array Features Product Description • The CM1441 is a multichannel EMI/ESD array consisting of four low-pass filter + ESD channels to reduce EMI emissions on data ports and lines and four dedicated ESD-only channels. Each EMI filter channel integrates a high quality pi-style filter 30pF-100Ω-30pF
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CM1441
CM1441
30pF-100-30pF)
800MHz
178mm
250 micro solder ball
5 ball csp drawing
EMI/RFI filter schematic diagram
CM1441-07CP
marking B4 diode
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CM1441
Abstract: CM1441-07CP CM1441-07CS n417
Text: CM1441 4-Channel EMI Filter Array w/ ESD + 4-channel ESD Array Features Product Description • The CM1441 is a multichannel EMI/ESD array consisting of four low-pass filter + ESD channels to reduce EMI emissions on data ports and lines and four dedicated ESD-only channels. Each EMI filter channel integrates a high quality pi-style filter 30pF-100Ω-30pF
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CM1441
CM1441
30pF-100-30pF)
800MHz
178mm
CM1441-07CP
CM1441-07CS
n417
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00984a2
Abstract: top side marking b2 PACDN1404C PACDN1404CG PACDN1408C PACDN1408CG PACDN1416C PACDN1416CG 1416C
Text: PACDN1404C/1408C/1416C ESD Protection Arrays, Chip Scale Package Features Product Description • The PACDN1404C, PACDN1408C and PACDN1416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD.
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PACDN1404C/1408C/1416C
PACDN1404C,
PACDN1408C
PACDN1416C
MILSTD-883D
178mm
00984a2
top side marking b2
PACDN1404C
PACDN1404CG
PACDN1408CG
PACDN1416C
PACDN1416CG
1416C
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