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    BPM Microsystems Inc FASMH48BGAD

    Socket Module, 48 Pin BGA; B=10x
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    DigiKey FASMH48BGAD 1
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    BPM Microsystems Inc FXSMH48BGAD

    Socket Module, 48 Pin BGA; B=10x
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    DigiKey FXSMH48BGAD 1
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    BPM Microsystems Inc FX4SMH48BGAD

    Socket Module, 48 Pin BGA; B=10x
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey FX4SMH48BGAD 1
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    BPM Microsystems Inc FXASMH48BGAD

    Socket Module, 48 Pin BGA; B=10x
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey FXASMH48BGAD 1
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    BPM Microsystems Inc FX4ASMH48BGAD

    Socket Module, 48 Pin BGA; B=10x
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey FX4ASMH48BGAD 1
    • 1 $2464.97
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    48BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    MR0A16A

    Abstract: 64Kx16 SRAM 64Kx16 MR0A16ACYS35 MR0A16AVYS35 MR0A16AYS35
    Text: MR0A16A 64Kx16 MRAM Memory Features • Fast 35 ns Read/Write Cycle • SRAM Compatible Timing and Pin-out Uses Existing SRAM Controllers Without Redesign • Unlimited Read & Write Endurance • Data Always Non-volatile for >20-years at Temperature • One Memory Replaces Flash, SRAM, EEPROM and BBRAM in System


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    PDF MR0A16A 64Kx16 20-years 44-TSOP 48-BGA MR0A16A SRAM 64Kx16 MR0A16ACYS35 MR0A16AVYS35 MR0A16AYS35

    tsop 48 PIN type2

    Abstract: 48BGA MR0A16AMA35
    Text: MR0A16A FEATURES 64K x 16 MRAM Memory • + 3.3 Volt power supply • Fast 35ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Commercial, Industrial, Extended Temperatures • Data always non-volatile for >20-years at temperature


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    PDF MR0A16A 20-years MR0A16A 576-bit EST354 tsop 48 PIN type2 48BGA MR0A16AMA35

    0.35mm pitch BGA

    Abstract: MR4A08BCYS35R MR4A08B MR4A08BC mr4a08bcys MR4A08BCYS35
    Text: MR4A08B FEATURES 2M x 8 MRAM Memory • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature • RoHS-compliant small footprint BGA and TSOP2 packages


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    PDF MR4A08B 20-years AEC-Q100 MR4A08B 216-bit MR4A08B, EST356 0.35mm pitch BGA MR4A08BCYS35R MR4A08BC mr4a08bcys MR4A08BCYS35

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    23265

    Abstract: No abstract text available
    Text: NanoAmp Solutions, Inc. 670 North McCarthy Blvd. Suite 220, Milpitas, CA 95035 ph: 408-935-7777, FAX: 408-935-7770 www.nanoamp.com N02L1618C1A Advance Information 2Mb Ultra-Low Power Asynchronous CMOS SRAM 128Kx16 bit Overview Features The N02L1618C1A is an integrated memory


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    PDF N02L1618C1A 128Kx16 N02L1618C1A N02L163WN1A, 3265-A 23265

    PSEUDO SRAM

    Abstract: CS26LV32163
    Text: Low Power Pseudo SRAM 2 M Word x 16 bit CS26LV32163 Revision History Rev. No. History Issue Date 2.0 Initial issue with new naming rule Mar. 01, 2005 2.1 Revise 1. page 2 & 4: page address inputs Nov. 23, 2005 Remark 2. Add Vcc absolute max. in page 5 2.2


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    PDF CS26LV32163 48BGA-6 PSEUDO SRAM CS26LV32163

    N04L1618C2A

    Abstract: N04L1618C2AB N04L163WC1A
    Text: AMI Semiconductor, Inc. N04L1618C2A ULP Memory Solutions 670 North McCarthy Blvd. Suite 220 Milpitas, CA 95035 PH: 408-935-7777, FAX: 408-935-7770 4Mb Ultra-Low Power Asynchronous CMOS SRAM 256Kx16 bit Overview Features The N04L1618C2A is an integrated memory


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    PDF N04L1618C2A 256Kx16 N04L1618C2A N04L163WC1A, N04L1618C2AB N04L163WC1A

    DQU12

    Abstract: No abstract text available
    Text: MR0A16A FEATURES 64K x 16 MRAM Memory • 3.3 Volt power supply • Fast 35ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Commercial, Industrial, and Extended Temperatures


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    PDF MR0A16A 44-pinâ 48-ballâ 1-877-347-MRAMâ EST00354 MR0A16A 080512a DQU12

    Untitled

    Abstract: No abstract text available
    Text: MR256D08B Dual Supply 32K x 8 MRAM FEATURES • +3.3 Volt power supply • I/O Voltage range supports wide +1.65 to +3.6 Volt interfaces • Fast 45 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature


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    PDF MR256D08B 20-years MR256D08B 144-bit EST411

    TEC Driver

    Abstract: No abstract text available
    Text: DRV590 SLOS365A – AUGUST 2001 – REVISED AUGUST 2002 1.2-A HIGH-EFFICIENCY PWM POWER DRIVER FEATURES D 1.22-A DC 82% Duty Cycle Output Current D D D D D D DESCRIPTION The DRV590 is a high-efficiency power amplifier ideal for driving a wide variety of thermoelectric cooler


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    PDF DRV590 SLOS365A DRV590 TEC Driver

    125OC

    Abstract: BGA-48-0608 BS616LV2019 BS616LV2019TC 48-pin TSOP
    Text: Very Low Power CMOS SRAM 128K X 16 bit BS616LV2019 Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 3.6V Ÿ Very low power consumption : VCC = 3.0V Operation current : 16mA Max. at 70ns 2mA (Max.) at 1MHz


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    PDF BS616LV2019 x8/x16 BS616LV2019 R0201-BS616LV2019A 125OC BGA-48-0608 BS616LV2019TC 48-pin TSOP

    MX23L6423A

    Abstract: MX23L6423ATC-90G
    Text: MX23L6423A 64M-BIT PAGE MODE MASK ROM FEATURES • Bit organization - 8M x 8 byte mode - 4M x 16 (word mode) • Fast access time - Random access:90ns (max.) - Page access:25ns (max.) • Page size - 8 words per page • Current - Operating:20mA - Standby:15uA


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    PDF MX23L6423A 64M-BIT MX23L6423ATC-90G MX23L6423A MX23L6423ATC-90G

    Untitled

    Abstract: No abstract text available
    Text: MR4A08B FEATURES 2M x 8 MRAM Memory • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature • RoHS-compliant small footprint BGA and TSOP2 packages


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    PDF MR4A08B 20-years AEC-Q100 MR4A08B 216-bit EST00356

    Z04B

    Abstract: MR27V6441L MARK Z04D MR27V6441L-xxxMP Z04D 48TSOP2 ST03
    Text: OKI Semiconductor MR27V6441L PEDR27V6441L-02-03 Issue Date: April 4, 2005 Preliminary 64M x 1–Bit Serial Production Programmed ROM P2ROM GENERAL DESCRIPTION The MR27V6441L is a 64 Mbit Production Programmed Read-Only Memory, which is configured as 67,108,864 word × 1-bit. The MR27V6441L supports a simple read operation using a single 3.3V power supply


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    PDF MR27V6441L PEDR27V6441L-02-03 MR27V6441L 33MHz 20MHz 42SOJ 48BGA 28SOP Z04B MARK Z04D MR27V6441L-xxxMP Z04D 48TSOP2 ST03

    tray matrix bga

    Abstract: N02L6181AB27I
    Text: N02L6181A 2Mb Ultra-Low Power Asynchronous CMOS SRAM 128Kx16 bit Features Overview • Single Wide Power Supply Range 1.65 to 2.2 Volts The N02L6181A is an integrated memory device containing a 2 Mbit Static Random Access Memory organized as 131,072 words by 16 bits. The device


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    PDF N02L6181A 128Kx16 N02L6181A N02L63W3A, tray matrix bga N02L6181AB27I

    MR0D08B

    Abstract: No abstract text available
    Text: MR0D08B Dual Supply 128K x 8 MRAM FEATURES • +3.3 Volt power supply • I/O Voltage range supports wide +1.65 to +3.6 Volt interfaces • Fast 45 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature


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    PDF MR0D08B 20-years MR0D08B 576-bit 45nspenses, EST00370 MR0D08B,

    Untitled

    Abstract: No abstract text available
    Text: MR0A16A FEATURES 64K x 16 MRAM Memory • + 3.3 Volt power supply • Fast 35ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Commercial, Industrial, Extended Temperatures • Data always non-volatile for >20-years at temperature


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    PDF MR0A16A 20-years MR0A16A 576-bit

    BGA OUTLINE DRAWING

    Abstract: mr4a16bmys351
    Text: MR4A16B FEATURES 1M x 16 MRAM • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature • RoHS-compliant small footprint BGA and TSOP package


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    PDF MR4A16B 20-years AEC-Q100 MR4A16B 216-bit MR4A16B, EST352 BGA OUTLINE DRAWING mr4a16bmys351

    2227V

    Abstract: No abstract text available
    Text: MR256D08B Dual Supply 32K x 8 MRAM FEATURES • +3.3 Volt power supply • I/O Voltage range supports wide +1.65 to +3.6 Volt interfaces • Fast 45 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature


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    PDF MR256D08B 20-years MR256D08B 144-bit 2227V

    Z04B

    Abstract: MARK Z04D
    Text: FEDR27T1641L-02-H1 OKI Semiconductor MR27T1641L This version : Feb.28, 2005 Previous version: -.- 8M x 1–Bit Serial Production Programmed ROM P2ROM GENERAL DESCRIPTION The MR27T1641L is a 16 Mbit Production Programmed Read-Only Memory, which is configured as


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    PDF FEDR27T1641L-02-H1 MR27T1641L MR27T1641L 30MHz 20MHz 42SOJ 48BGA 28SOP Z04B MARK Z04D

    CY7C1061

    Abstract: CY7C1061AV33-12ZI
    Text: CY7C1061AV33 1M x 16 Static RAM Features WE input LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0 through I/O7), is written into the location specified on the address pins (A0 through A19). If Byte High Enable (BHE) is LOW, then data from I/O pins (I/O8 through


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    PDF CY7C1061AV33 54-pin 60-ball I/O15) 48BGA pF/10 48-Ball CY7C1061 CY7C1061AV33-12ZI

    Untitled

    Abstract: No abstract text available
    Text: Very Low Power CMOS SRAM 128K X 16 bit BS616LV2019 Pb-Free and Green package materials are compliant to RoHS n FEATURES n DESCRIPTION Ÿ Wide VCC operation voltage : 2.4V ~ 3.6V Ÿ Very low power consumption : VCC = 3.0V Operation current : 25mA Max. at 55ns


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    PDF BS616LV2019 x8/x16 BS616LV2019 R0201-BS616LV2019

    schematic diagram atx Power supply 500w

    Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
    Text: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455


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    PDF P462-ND P463-ND LNG295LFCP2U LNG395MFTP5U US2011) schematic diagram atx Power supply 500w pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS

    Untitled

    Abstract: No abstract text available
    Text: Low Power Pseudo SRAM 2 M Word x 16 bit CS26LV32163 Revision History Rev. No. History Issue Date 2.0 Initial issue with new naming rule Mar. 01, 2005 2.1 Revise 1. page 2 & 4: page address inputs Nov. 23, 2005 Remark 2. Add Vcc absolute max. in page 5 2.2


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    PDF CS26LV32163 48BGA-6 CS26LV32163 32M-bit 2MS26LV32163