Untitled
Abstract: No abstract text available
Text: Product Number: 587-10-484-13-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 484-13-005 26 X 26 # Of Pins Mill-Max Part Number 484 587-10-484-13-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737
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Original
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C36000)
C/885
2002/95Annex
64-56A
64-22A/31A
65-17A
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PDF
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Untitled
Abstract: No abstract text available
Text: Product Number: 599-10-484-11-000429 Description: BGA Header 0.8mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 484-11-000 22 X 22 # Of Pins Mill-Max Part Number 484 599-10-484-11-000429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929
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Original
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C36000)
C/885
2002/95Annex
64-56A
64-22A/31A
65-17A
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PDF
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ep2c20
Abstract: EPC2 EP1C12 EP2C5 EP2C15A EP2C35 EP2C50 EPC16 EPCS16 EPCS64
Text: Thin Quad Flat Pack T Plastic Quad Flat Pack (Q) FineLine BGA (F) 100-Pin TQFP 144-Pin TQFP 208-Pin PQFP 240-Pin PQFP 256-Pin FBGA 324-Pin FBGA 400-Pin FBGA 484-Pin FBGA 484-Pin UFBGA2 672-Pin FBGA 896-Pin FBGA 1 “A” devices differ only in reduced
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Original
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100-Pin
144-Pin
208-Pin
240-Pin
256-Pin
324-Pin
400-Pin
484-Pin
672-Pin
ep2c20
EPC2
EP1C12
EP2C5
EP2C15A
EP2C35
EP2C50
EPC16
EPCS16
EPCS64
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PDF
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BGA-484P-M09
Abstract: No abstract text available
Text: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 484 PIN PLASTIC BGA-484P-M09 484-pin plastic TEBGA Ball pitch 1.00 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.36 mm Max
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Original
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BGA-484P-M09
484-pin
BGA-484P-M09)
BGA484009Sc-1-1
BGA-484P-M09
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PDF
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PBGA 484P
Abstract: BGA484PM07 BGA-484P-M07 2400010
Text: PLASTIC BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 484 PIN PLASTIC BGA-484P-M07 484-pin plastic PBGA Ball pitch 1.00 mm Package width x package length 27.00 mm × 27.00 mm Lead shape Ball Sealing method Plastic mold Mounting height 2.36 mm Max
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Original
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BGA-484P-M07
484-pin
BGA-484P-M07)
BGA484007Sc-2-2
PBGA 484P
BGA484PM07
BGA-484P-M07
2400010
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PDF
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AF14
Abstract: AC22 AE23 EPF10K200S AE10-AE11 AE20-AE21 AJ43
Text: EPF10K200S Device Pin-Outs ver. 1.0 Pin Name 1 240-Pin RQFP 356-Pin FineLine BGA 484-Pin FineLine BGA 599-Pin PGA 600-Pin BGA 672-Pin FineLine BGA MSEL0 (2) MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4)
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Original
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EPF10K200S
240-Pin
356-Pin
484-Pin
599-Pin
600-Pin
672-Pin
AF14
AC22
AE23
AE10-AE11
AE20-AE21
AJ43
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PDF
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t25 4 J9
Abstract: t25 4 j5 T25 4 E8 t25 4 F6 EPF10K200S T25 4 E5 t35 4 c8 af14 ba43 bf44
Text: EPF10K200S Device Pin-Outs ver. 1.0 Pin Name 1 240-Pin RQFP 356-Pin FineLine BGA 484-Pin FineLine BGA 599-Pin PGA 600-Pin BGA 672-Pin FineLine BGA MSEL0 (2) MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4)
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Original
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EPF10K200S
240-Pin
356-Pin
484-Pin
599-Pin
600-Pin
672-Pin
t25 4 J9
t25 4 j5
T25 4 E8
t25 4 F6
T25 4 E5
t35 4 c8
af14
ba43
bf44
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PDF
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t25 4 J9
Abstract: be37 AR-17 BA41 AA43 t25 4 L9 BA43 t25 4 F6 t25 4 H9 BE43
Text: EPF10K200S Device Pin-Outs ver. 1.1 Pin Name 1 240-Pin RQFP 356-Pin FineLine BGA 484-Pin FineLine BGA 599-Pin PGA 600-Pin BGA 672-Pin FineLine BGA MSEL0 (2) MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4)
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Original
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EPF10K200S
240-Pin
356-Pin
484-Pin
599-Pin
600-Pin
672-Pin
t25 4 J9
be37
AR-17
BA41
AA43
t25 4 L9
BA43
t25 4 F6
t25 4 H9
BE43
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PDF
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am3 pins
Abstract: diode t25 4 F6 am3 Pin Package Ac32 g4 diode t25 4 H9 AC32 AD32 AC22 AE23 AF14
Text: EPF10K100A Device Pin-Outs ver. 1.0 Pin Name 240-Pin PQFP/RQFP 356-Pin BGA 484-Pin FineLine BGA 600-Pin BGA MSEL0 2 MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4) nCS (4) CS (4) RDYnBSY (4) CLKUSR (4)
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Original
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EPF10K100A
240-Pin
356-Pin
484-Pin
600-Pin
am3 pins
diode t25 4 F6
am3 Pin Package
Ac32 g4
diode t25 4 H9
AC32
AD32
AC22
AE23
AF14
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PDF
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337 BGA
Abstract: U212-25 AA10 AA23 EP20K200C E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
Text: EP20K200C I/O Pin-Outs ver. 1.0 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA 652-Pin BGA 672-Pin FineLine BGA 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 –
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Original
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EP20K200C
208-Pin
240-Pin
484-Pin
356-Pin
652-Pin
672-Pin
337 BGA
U212-25
AA10
AA23
E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
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PDF
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AA23
Abstract: AC25 EP20K160E
Text: EP20K160E I/O Pins ver. 1.3 I/O & Pad Pin/Pad VREF Number Function Bank Orientation 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 356-Pin BGA 484-Pin FineLine BGA 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8
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Original
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EP20K160E
144-Pin
208-Pin
240-Pin
356-Pin
484-Pin
AA23
AC25
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PDF
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AA23
Abstract: AC25 EP20K160E
Text: EP20K160E I/O Pins ver. 1.4 I/O & Pad Number Pin/Pad VREF Orientation Function Bank 144-Pin TQFP 1 208-Pin PQFP (1) 240-Pin PQFP (1) 356-Pin BGA 484-Pin FineLine BGA 8 8 8 8 – – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8
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Original
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EP20K160E
144-Pin
208-Pin
240-Pin
356-Pin
484-Pin
AA23
AC25
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PDF
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AA15
Abstract: AB14 AB16 AB17 EP1M120
Text: EP1M120 I/O Pins ver. 2.0 Table 1 shows all pins for the EP1M120 484-pin FineLine BGA package. Table 1. EP1M120 Device Pin-Outs I/O and VREF Maximum GTL+ Pin Name/Function Bank Current Subgroup 1 1 I/O 1 I/O 1 I/O 1 I/O 1 HSDI_CLK1p 1 I/O 1 I/O 1 I/O 1 I/O
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Original
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EP1M120
484-pin
AA15
AB14
AB16
AB17
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PDF
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EP1M120
Abstract: AA15 AB14 AB16 AB17 VCCIO13
Text: EP1M120 I/O Pins ver. 4.1 Table 1 shows all pins for the EP1M120 484-pin FineLine BGA package. Table 1. EP1M120 Device Pin-Outs Maximum GTL+ I/O and VREF Pin Name/Function Current Bank Subgroup 1 1 I/O 1 I/O 1 I/O 1 I/O 1 HSDI_CLK1p 1 I/O 1 I/O 1 I/O 1 I/O
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Original
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EP1M120
484-pin
AA15
AB14
AB16
AB17
VCCIO13
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PDF
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AA10
Abstract: AA23 EP20K200E E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
Text: EP20K200E I/O Pins ver. 1.0 I/O & VREF Bank 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – 8 8 8 8 8 – Pad Number Orientation Pin/Pad Function 208-Pin PQFP 1 240-Pin PQFP (1) 484-Pin 356-Pin FineLine BGA BGA
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Original
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EP20K200E
208-Pin
240-Pin
484-Pin
356-Pin
652-Pin
672-Pin
AA10
AA23
E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
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PDF
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C4228
Abstract: No abstract text available
Text: 7.15mm [0.281"] A1 7.15mm [0.281"] 26X26X5 + 8X8 ARRAY 25mm 39.3mm [0.984"] [1.547"] 41.9mm [1.650"] 1mm [0.039"] Top View 41.9mm [1.650"] DETAIL A Lead coplanarity 0.005" max. 2.78mm [0.109"] 0.5mm Side View Description: BGA to QFP package converter 484 position BGA surface mount pads to 256 QFP, 0.5mm gull-wing leads. Pin assignment as per Actel requirements.
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Original
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26X26X5
C4228
PC-BGA/QFP-SX32A-S-01
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PDF
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QFP Package 80 lead
Abstract: C4002 256-QFP 256QFP
Text: 7.15mm [0.281"] A1 7.15mm [0.281"] 26X26X5 + 8X8 ARRAY 25mm 39.3mm [0.984"] [1.547"] 41.9mm [1.650"] 1mm [0.039"] Top View 41.9mm [1.650"] DETAIL A Lead coplanarity 0.005" max. 2.78mm [0.109"] 0.5mm Side View Description: BGA to QFP package converter 484 position BGA surface mount pads to 256 QFP, 0.5mm gull-wing leads. Pin assignment as per Actel requirements.
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Original
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26X26X5
C4002
PC-BGA/QFP-SX72A-S-01
QFP Package 80 lead
256-QFP
256QFP
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PDF
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EQFP 144 PACKAGE
Abstract: BGA and eQFP Package TQFP 144 PACKAGE altera micro fineline BGA eQFP EPC16
Text: Package dimensions selector guide FineLine BGA FBGA ; Hybrid FineLine BGA (HFBGA) as noted 1,932 1,760 45.00 x 45.00 1.00 1,517 43.00 x 43.00 1.00 1,020 40.00 x 40.00 1.00 896 33.00 x 33.00 1.00 1,508 780 31.00 x 31.00 1.00 40.00 x 40.00 1.00 35.00 x 35.00
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Original
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PDF
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7075-T6 aluminum
Abstract: 7075-T6 high current pogo pin aluminium 7075 180C SBT-BGA-7000 high current high temperature pogo pin
Text: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features 10 14 9 7 8 6 • • • • • • 5 13 12 4 15 3 1 2 11 Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches from true position
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Original
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7075-T6
SBT-BGA-7000
7075-T6 aluminum
high current pogo pin
aluminium 7075
180C
high current high temperature pogo pin
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PDF
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SG-BGA-6046
Abstract: SG-MLF-7004 156 QFN 12X12 diode sg 87 1mm pitch BGA socket SG-BGA-6094 BGA Solder Ball compressive force 17X17* BGA 289 SG-MLF-7003 SG-BGA-6033
Text: Ironwood Electronics GHz BGA and MLF Sockets SG.1 Our GHz BGA sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.5mm. We typically ship within 3 to 5 days ARO.
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Original
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025mm
FR4/G10
Sn63Pb37
SG-BGA-6046
SG-MLF-7004
156 QFN 12X12
diode sg 87
1mm pitch BGA socket
SG-BGA-6094
BGA Solder Ball compressive force
17X17* BGA 289
SG-MLF-7003
SG-BGA-6033
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PDF
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Untitled
Abstract: No abstract text available
Text: BGA Socketing and Test Products Features_ • Capable of monitoring signals while Ball Grid Array BGA package is operational ■ Customized to match specific BGA footprints ■ Accommodates up to 26x26 BGA arrays ■ Performs with minimum delays and
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OCR Scan
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26x26
15X15
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PDF
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bga 484 0.8mm pitch
Abstract: land pattern 484 BGA SF-BGA484B-B-11 BGA484B
Text: D Package Code: BGA484B C .0225" dia. tooling holes X2 non plated (optional) 0.624mm See BGA pattern code to the right for actual pattern layout Y 0.878mm 0.025" dia. pad X 31.75mm Top View (reference only) 2 1.27mm [0.050"] 0.36mm [0.014"] dia. 0.635mm
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Original
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BGA484B
624mm
878mm
635mm
882mm
FR4/G10
26X26X5
SF-BGA484B-B-11
bga 484 0.8mm pitch
land pattern 484 BGA
BGA484B
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PDF
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land pattern 484 BGA
Abstract: 0.4mm pitch BGA pitch 0.4mm BGA 22X22 SF-BGA484C-B-11
Text: C Package Code: BGA484C D Ø 0.4mm x2 [Ø 0.0156"] (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 21.00mm [0.827"] 1.00mm pitch typ. X Top View (reference only) 0.50mm [0.020"] 3.74mm [0.147"] 0.30mm [0.012"] dia. 0.508 mm [0.020"]
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Original
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BGA484C
FR4/G10
22X22
SF-BGA484C-B-11
land pattern 484 BGA
0.4mm pitch BGA
pitch 0.4mm BGA
22X22
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PDF
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HXC125
Abstract: mm1764 1-1640294-0 1mm pitch BGA socket 1024 ball bga 1640302-3 MM1089 441 ball bga bga 1296
Text: Matrix Series BGA Sockets Featuring HXC Material System DESCRIPTION Tyco Electronics is pleased to announce the Matrix Series of BGA Sockets utilizing HXC 125 polymer. The sockets are fully arrayed matrixes of contacts available on 0.80mm, 1.00mm, and 1.27mm pitch. The
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Original
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1654563-CC
CE-PDF-07-08
HXC125
mm1764
1-1640294-0
1mm pitch BGA socket
1024 ball bga
1640302-3
MM1089
441 ball bga
bga 1296
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PDF
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