Untitled
Abstract: No abstract text available
Text: 风 华 高 科 PNS系列 功 率 电 感 PNS SERIES Radial Choke Inductors 特征 FEATURES 高效 率及高 饱和 电流 。 High reliability,efficien cy and saturation. 屏蔽 结构。 M agnetic shielded. 应用APPLICATION： 打印 机/液 晶电视/复印 机
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PNS1619
-221MB
-271MB
-331MB
-391MB
-471MB
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CIC10P121
Abstract: CIC21P300 CIS21J121 CIS41P600 CIC31P121 CIB21P260 capacitor 10nj CIB31P310 korchip CIM10U121
Text: October 2005 � Head Office 314, Maetan 3 - dong, Youngtong - gu, Suwon, Kyonggi Province 442 - 743, Korea Europe Te l: +82- 31- 210 - 6803 E-mail:wesley.roh@samsung.com � Asia sales office � Shanghai Office 200336Rm 1408 Shanghai international trade center No 2201 Yan an W RD
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200336Rm
CIC10P121
CIC21P300
CIS21J121
CIS41P600
CIC31P121
CIB21P260
capacitor 10nj
CIB31P310
korchip
CIM10U121
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CW20C104K
Abstract: CL31B104KBNC CY20C104M 474j capacitor CL31B102KBNC UP36BA0350 CW15C103K ECPU01105MA5 CL21B104KBNC CW20C473K
Text: Cornell Dubilier Electronics, Inc. - Complete Capacitor Cross Reference AERO M, AEROVOX, ARCO, ASC, ATC, AVX, BC/PHILIPS, BISHOP, CAL-CHIP, CENTRALAB, COOPER, ELECTROCUB, ELECTRONIC CONCEPTS, ELNA, EVOX, GE, HOBART, IBM, ILLINOIS CAP, JOHANSON, KEMET, KINGSTON, KOA, KORCHIP, KYOCERA, LELAND, LENNOX, MALLORY/NACC,
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AGA100M050
SKA100M050
AGA100M063
SKA100M063
AFK477M10F24T
AFK686M16D16T
AFK107M16D16T
AFK157M16X16T
AFK158M16H32T
AFK226M16C12T
CW20C104K
CL31B104KBNC
CY20C104M
474j capacitor
CL31B102KBNC
UP36BA0350
CW15C103K
ECPU01105MA5
CL21B104KBNC
CW20C473K
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Untitled
Abstract: No abstract text available
Text: EIN UNTERNEHMEN VON Roederstein Keramik-Kondensatoren fur die Unterhattungs-Elektronik Ceramic Capacitors for entertainment electronics Keram ische Hochspannungs-Scheibenkondensatonen, Klasse 2 C eram ic high voltage disc capacitors, class 2 Ausfiihrung / Design:
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sd 4841 p
Abstract: sd 4841
Text: A COMPANY OF M O DEL LPE-4841 In d u c to rs S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d F E A TU R ES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled
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LPE-4841
EIA-481
sd 4841 p
sd 4841
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sd 4841 p
Abstract: sd 4841 DALE 100MB 471mb marking 333*A
Text: A COMPANY OF M O DEL LPE-4841 In d u c to rs S u rfa c e M ount, G apped and U ngapped FE A T U R E S • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints
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LPE-4841
EIA-481
EIA-481
LPE-4841
sd 4841 p
sd 4841
DALE 100MB
471mb
marking 333*A
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Untitled
Abstract: No abstract text available
Text: MODEL LPE-6855 Inductors S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d FEATURES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost Qualification data available
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LPE-6855
EIA-481
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Untitled
Abstract: No abstract text available
Text: MODEL LPE-5047 Inductors S u rfa c e M o u n t, G a p p e d an d U n g a p p e d FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available
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LPE-5047
EIA-481
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102MB
Abstract: No abstract text available
Text: M ODEL LPE-4841 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost
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LPE-4841
EIA-481
102MB
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o 103na
Abstract: PENI Ci HP 2200
Text: A COMPANY MODEL LPE-6855 Inductors . O A L E OF , Surface Mount, Gapped and Ungapped FE A T U R E S • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints UL Class B materials + 130°C
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LPE-6855
EIA-481
EIA-481
LPE-6855
o 103na
PENI
Ci HP 2200
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CLS62-100NC
Abstract: CLS62 CLS62-470 SPC715
Text: REVISIONS REVISIONS DATE 19 9 3 . 1 2 .2 5 1 9 9 4 .0 4 .2 7 1 9 9 4 .0 9 .2 6 A A SPC964 CLIENT NO.21 •D .C .R ^ JË 5 /6 2 4 R & D 2 Æ S K ft) 6.64 fì(5.31 fì) < 5.60 fì(4 .4 8 Q) SPC715 b ^ x . (P. 5 /6 ) R&D2 feBiM) SPC 1637 (102KC)D. C. R. fTïH (P. 5 /6 )
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SPC964
SPC715
SPC1637
102KC
PG00-1476
PG01-0900
PG05-D192
S-074-497
CLS62
CLS62-392KB
CLS62-100NC
CLS62
CLS62-470
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Untitled
Abstract: No abstract text available
Text: M ODEL LPE-6562 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost Qualification data available
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LPE-6562
EIA-481
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Untitled
Abstract: No abstract text available
Text: MODEL LPE-6855 Inductors Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available • Short lead times
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LPE-6855
EIA-481
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cl 6562
Abstract: o 103na DALE ELECTRONICS 154NA
Text: A COMPANY M O D EL L P E -6 562 In d u c to rs . a M C OF , Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available
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EIA-481
LPE-6562
cl 6562
o 103na
DALE ELECTRONICS
154NA
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Untitled
Abstract: No abstract text available
Text: A COMPANY OF M O DEL L P E -5047 In d u c to rs S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d F E A TU R ES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints
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EIA-481
LPE-5047
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LPE-3325
Abstract: No abstract text available
Text: A COMPANY OF M O DEL L P E -3325 In d u c to rs Surface Mount, Gapped and Ungapped FE A T U R E S • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled Tape packaging per EIA-481 Low cost
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EIA-481
LPE-3325
LPE-3325
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Untitled
Abstract: No abstract text available
Text: A COMPANY OF MODEL LPE-6855 Inductors S u rfa c e M o u n t, G a p p e d a n d U n g a p p e d FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints
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OCR Scan
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LPE-6855
EIA-481
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Untitled
Abstract: No abstract text available
Text: M ODEL LPE-3325 Inductors Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available • Short lead times
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LPE-3325
EIA-481
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Untitled
Abstract: No abstract text available
Text: M ODEL LPE-4841 Inductors Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available • Short lead times
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LPE-4841
EIA-481
101NA
151NA
221NA
102NA
152NA
222NA
332NA
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o 103na
Abstract: No abstract text available
Text: M ODEL LPE-5047 Inductors Surface Mount, Gapped and Ungapped FEATURES • • • • • • • • • Low DCR vs inductance Hot tin dipped terminations Compatible with reflow solder processes Industry standard footprints UL Class B materials + 130°C
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OCR Scan
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PDF
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LPE-5047
EIA-481
EIA-481
o 103na
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Untitled
Abstract: No abstract text available
Text: MODEL LPE-4841 Inductors Surface Mount, Gapped and Ungapped FEATURES • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost • Qualification data available • Short lead times
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OCR Scan
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LPE-4841
EIA-481
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Untitled
Abstract: No abstract text available
Text: M O DEL L P E -6562 In d u c to rs S u rfa c e M o u n t, G a p p e d an d U n g a p p e d FEATURES • • • • • • • • • • • • • • • • • Totally integrated manufacturing Pick and place compatible Statistical process controlled
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OCR Scan
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PDF
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EIA-481
LPE-6562
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Untitled
Abstract: No abstract text available
Text: M ODEL LPE-5047 Inductors Surface Mount, Gapped and Ungapped j m i O FEATURES • • • • • • • • • Totally integrated manufacturing • Pick and place compatible • Statistical process controlled • Tape packaging per EIA-481 • Low cost
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LPE-5047
EIA-481
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