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    3500S35 Search Results

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    3500S35 Price and Stock

    The Bergquist Company GF3500S35-07-60-50CC

    LIQUID GAP FILLER THERMAL CONDU
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey GF3500S35-07-60-50CC Bulk 4 1
    • 1 $78.87
    • 10 $74.229
    • 100 $64.9507
    • 1000 $64.9507
    • 10000 $64.9507
    		Buy Now
    Mouser Electronics GF3500S35-07-60-50CC 236
    • 1 $80.45
    • 10 $75.72
    • 100 $66.25
    • 1000 $66.25
    • 10000 $66.25
    		Buy Now

    The Bergquist Company GF3500S35-00-60-50CC

    GF3500S35 50CC DUAL CARTRIDGE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey GF3500S35-00-60-50CC Box 1
    • 1 $101.17
    • 10 $80.579
    • 100 $63.9567
    • 1000 $63.9567
    • 10000 $63.9567
    		Buy Now
    Interstate Connecting Components GF3500S35-00-60-50CC 5
    • 1 $85.325
    • 10 $65.6346
    • 100 $64.3962
    • 1000 $64.3962
    • 10000 $64.3962
    		Buy Now
    Neutron USA GF3500S35-00-60-50CC 50
    • 1 $168.7
    • 10 $168.7
    • 100 $168.7
    • 1000 $168.7
    • 10000 $168.7
    		Buy Now

    Orbel Corporation GRVC-3500S3500-0200X

    COVER RF SHIELD GROOVE LOC 3.5
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey GRVC-3500S3500-0200X Box 100
    • 1 -
    • 10 -
    • 100 $13.3032
    • 1000 $13.3032
    • 10000 $13.3032
    		Buy Now

    The Bergquist Company GF3500S35-00-60-400CC

    LIQUID GAP FILLER THERMAL CONDUC
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey GF3500S35-00-60-400CC Bulk 1
    • 1 $383.91
    • 10 $304.918
    • 100 $277.8728
    • 1000 $277.8728
    • 10000 $277.8728
    		Buy Now
    Mouser Electronics GF3500S35-00-60-400CC
    • 1 $558.12
    • 10 $525.3
    • 100 $525.3
    • 1000 $525.3
    • 10000 $525.3
    		Get Quote

    Vishay Intertechnologies ACASA3500S3500P500

    ACAS 0612 350R S 350R P5 - Tape and Reel (Alt: ACASA3500S3500P500)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas ACASA3500S3500P500 Reel 10 Weeks 5,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.21462
    		Buy Now
    Find more 3500S35 price and stock on Findchips.com

    3500S35 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    gf3500s35

    Abstract: GF-3500 D2196 3500S35 GF35 D149 D150 D2240 D257 D792
    Text: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 3500S35 • Thermal conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage


    Original     		PDF 3500S35 D2196 E1269 3500S35 gf3500s35 GF-3500 D2196 GF35 D149 D150 D2240 D257 D792

    Untitled

    Abstract: No abstract text available
    Text: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits T YPICAL PROPERT IES OF GAP FILLER 3500S35 PROPERTY Color / Part A • Thermal Conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage


    Original     		PDF 3500S35 D2196 3500S35

    bergquist

    Abstract: No abstract text available
    Text: Gap Filler 3500S35 Two-Part Thermally Conductive Liquid Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP FILLER 3500S35 PROPERTY Color / Part A • Thermal Conductivity: 3.6 W/m-K • Thixotropic nature makes it easy to dispense • Two-part formulation for easy storage


    Original     		PDF 3500S35 D2196 3500S35 bergquist

    GDDR5 pinout

    Abstract: coprocessor
    Text: Intel Xeon Phi Coprocessor Datasheet April 2014 Document ID Number: 328209 003EN By using this document, in addition to any agreements you have with Intel, you accept the terms set forth below. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel


    Original     		PDF 003EN GDDR5 pinout coprocessor

    Untitled

    Abstract: No abstract text available
    Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE


    Original     		PDF

    FC-BGA

    Abstract: T0812012 daewon tray
    Text: Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array AN-659-1.0 Application Note This application note provides guidance on thermal management and mechanical handling of lidless flip chip ball-grid array FCBGA for Altera devices.


    Original     		PDF AN-659-1 FC-BGA T0812012 daewon tray

    KS-886H

    Abstract: Kostat tray
    Text: Thermal Management and Mechanical Handling for Altera TCFCBGA Devices AN-657-1.1 Application Note This application note describes the thermal composite flip chip ball-grid array TCFCBGA package for the Arria V device family. TCFCBGA improves board real-estate use by allowing closer spacing between passive


    Original     		PDF AN-657-1 KS-886H Kostat tray