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    LPS200

    Abstract: MIL-HDBK-263 LPS-200
    Text: LPS200 HIGH PERFORMANCE LOW NOISE PHEMT • FEATURES ♦ 1.0 dB Noise Figure at 18 GHz ♦ 10 dB Associated Gain at 18 GHz ♦ Low DC Power Consumption GATE BOND PAD 2X DRAIN BOND PAD (2X) SOURCE BOND PAD (2x) DIE SIZE: 12.6X10.2mils (320x260 µm) DIE THICKNESS: 3.9 mils (100 µm)


    Original     		PDF LPS200 320x260 85x65 LPS200 MIL-HDBK-263 LPS-200

    bond wire gold

    Abstract: LPD200 MIL-HDBK-263
    Text: LPD200 HIGH PERFORMANCE PHEMT • FEATURES ♦ 21 dBm Output Power at 1-dB Compression at 18 GHz ♦ 12 dB Power Gain at 18 GHz ♦ 1.0 dB Noise Figure at 18 GHz ♦ 55% Power-Added Efficiency DRAIN BOND PAD 2X GATE BOND PAD (2X) SOURCE BOND PAD (2x) DIE SIZE: 12.6X10.2mils (320x260 µm)


    Original     		PDF LPD200 320x260 85x65 LPD200 bond wire gold MIL-HDBK-263

    Untitled

    Abstract: No abstract text available
    Text: LCD/Touchscreen Interface Boards for StackableUSB USB3201, USB3202, USB3203 Features The USB3200 series provides OEMs with a small, simple, cost-effective graphical user interface for rugged embedded systems. The LCD/Touchscreen and interface board can operate as a standalone controller with


    Original     		PDF USB3201, USB3202, USB3203 512Kx* PIC32 USB3201 320x260 USB3202 USB3203 320x240)