FCH30A09
Abstract: No abstract text available
Text: SBD T y p e : FCH30 FCH30A 30A09 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol Repetitive Peak Reverse Voltage
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FCH30A09
FCH30
O-220AB
Electri180°
FCH30A09
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Untitled
Abstract: No abstract text available
Text: 256Kx8/128Kx16, 20 - 45ns, STACK/PGA 30A097-32 E 2 Megabit High Speed CMOS SRAM DPS128X16Cn3/DPS128X16Bn3 DESCRIPTION: The DPS128X16Cn3/DPS128X16Bn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .
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256Kx8/128Kx16,
30A097-32
DPS128X16Cn3/DPS128X16Bn3
50-pin
DPS128X16Cn3/DPS128X16Bn3
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GCH30A09
Abstract: No abstract text available
Text: SBD T y p e : GCH30 CH30A 30A09 OUTLINE DRAWING FEATURES *Similar to TO-220AB Case *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.9g Symbol Repetitive Peak Reverse Voltage
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GCH30A09
O-220AB
GCH30A09
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FCH30A09
Abstract: No abstract text available
Text: SBD T y p e : FCH30 FCH30A 30A09 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol Repetitive Peak Reverse Voltage
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Original
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FCH30
FCH30A09
O-220AB
FCH30A09
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Untitled
Abstract: No abstract text available
Text: 256Kx8/128Kx16, 20 - 45ns, STACK/PGA 30A097-32 E 2 Megabit High Speed CMOS SRAM DPS128X16Cn3/DPS128X16Bn3 DESCRIPTION: The DPS128X16Cn3/DPS128X16Bn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .
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256Kx8/128Kx16,
30A097-32
DPS128X16Cn3/DPS128X16Bn3
DPS128X16Cn3/DPS128X16Bn3
50-pin
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PDF
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Untitled
Abstract: No abstract text available
Text: SBD T y p e : FCH30 FCH30A 30A09 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol Repetitive Peak Reverse Voltage
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Original
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FCH30
FCH30A
30A09
O-220AB
FCH30A09
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PDF
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Untitled
Abstract: No abstract text available
Text: SBD T y p e : GCH30 CH30A 30A09 OUTLINE DRAWING FEATURES *Similar to TO-220AB Case *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.9g Symbol Repetitive Peak Reverse Voltage
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Original
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GCH30
CH30A
30A09
O-220AB
GCH30A09
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GCH30A09
Abstract: No abstract text available
Text: SBD T y p e : GCH30 CH30A 30A09 OUTLINE DRAWING FEATURES *Similar to TO-220AB Case *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.9g Symbol Repetitive Peak Reverse Voltage
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GCH30A09
O-220AB
GCH30A09
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30021
Abstract: L48C L41C IC L44C DATASHEET L30C l31c L43C ORSO42G5 ORSO82G5 ORT42G5
Text: ORCA ORSO42G5 and ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSCs August 2005 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO42G5 and ORSO82G5 devices. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO42G5 and
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ORSO42G5
ORSO82G5
ORSO82G5
ORSO42G5-1BMN484I
ORSO82G5-2FN680I
30021
L48C
L41C
IC L44C DATASHEET
L30C
l31c
L43C
ORT42G5
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Untitled
Abstract: No abstract text available
Text: 1 Megabit High Speed CMOS SRAM DPS128M8CnY/BnY, DPS128X8CA3/BA3 DESCRIPTION: The DPS128M8CnY/BnY, DPS128X8CA3/BA3 High Speed SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .
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DPS128M8CnY/BnY,
DPS128X8CA3/BA3
DPS128X8CA3/BA3
50-pin
DPS128V.
30A097-31
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PDF
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Untitled
Abstract: No abstract text available
Text: 8 Megabit High Speed CMOS SRAM DPS512X16Cn3/DPS512X16Bn3 DESCRIPTION: The DPS512X16Cn3/DPS512X16Bn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .
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DPS512X16Cn3/DPS512X16Bn3
DPS512X16Cn3/DPS512X16Bn3
50-pin
30A097-38
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Untitled
Abstract: No abstract text available
Text: 4 Megabit High Speed CMOS SRAM DPS256X16Cn3/DPS256X16Bn3 DESCRIPTION: The DPS256X16Cn3/DPS256X16Bn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .
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DPS256X16Cn3/DPS256X16Bn3
DPS256X16Cn3/DPS256X16Bn3
50-pin
30A097-34
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AL437
Abstract: L97c L235C L103T L41C L140C L94C l165c L239C L43C
Text: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC November 2003 Preliminary Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two
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8b/10b
OIF-SPI4-02
ORSPI4-1FE1036IES
ORSPI4-F1156IES
ORSPI4-2FE1036CES
ORSPI4-1FE1036CES
ORSPI4-2F1156CES
ORSPI4-1F1156CES
AL437
L97c
L235C
L103T
L41C
L140C
L94C
l165c
L239C
L43C
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PDF
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Untitled
Abstract: No abstract text available
Text: 1 Megabit CMOS SRAM DPS128M8n3/DPS128X8A3 DESCRIPTION: The DPS128M8nY & DPS128X8A3 SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages, or mounted on a 50-pin PGA
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DPS128M8n3/DPS128X8A3
DPS128M8nY
DPS128X8A3
50-pin
30A097-01
DPS128M8n3/DPS128X8A3
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PDF
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50-PIN
Abstract: DPS256X
Text: DENSE-PAC MICROSYSTEMS 4 Megabit CM OS SRAM DPS256X16n3 DESCRIPTION: The DPS256X16n3SRAM "S T A C K " modules are a revolutionarynew memory subsystem using Dense-Pac Microsystems'ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, " j " leaded
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OCR Scan
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DPS256X16n3
DPS256X16n3SRAM
50-pin
DPS256X16n3
256Kx16
512Kx8
125-C
100ns
120ns
150ns
DPS256X
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256kx8 sram 5v
Abstract: 50-PIN
Text: DENSE-PAC 2 Megabit High Speed CM OS SRAM MICROSYSTEMS DPS128X16Cn3/DPSl 28X16Bn3 D E S C R IP T IO N : The DPS128X16Cn3/DPS128X16Bn3 High Speed SRAM "S T A C K " modules area revolutionary new memory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC .
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OCR Scan
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DPS128X16Cn3/DPSl
28X16Bn3
DPS128X16Cn3/DPS128X16Bn3
50-pin
-40-C
125-C
30A097-32
256kx8 sram 5v
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PDF
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lem HA
Abstract: 50-PIN dps128m8bny
Text: DENSE-PAC 1 Megabit High Speed CMOS SRAM M I C R O S Y S T E M S DPS128M8CnY/BnY, DPS128X8CA3/BA3 DESCRIPTION: The DPS 128M8CnY/BnY, DPS128X8CA3/BA3 H igh Speed SRAM devices are a revolutionary new m em ory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless C hip Carriers SLCC .
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OCR Scan
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DPS128M8CnY/BnY,
DPS128X8CA3/BA3
128M8CnY/BnY,
28X8CA3/BA3
50-pin
California92841-1428
OA097-31
lem HA
dps128m8bny
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PDF
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50-PIN
Abstract: DPS512X16A3
Text: DENSE-PAC MICROSYSTEMS 8 Megabits CM OS SRAM DPS512Xl6n3 D ESCRIPTIO N ; The DPS512X16n3 SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded
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OCR Scan
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DPS512Xl6n3
DPS512X16n3
50-pin
512Kx16
-40-C
125-C
100ns
120ns
DPS512X16A3
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PDF
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Untitled
Abstract: No abstract text available
Text: 8 Megabit High Speed CMOS SRAM DPS1MS8EJ4/EL4/RJ4/RL4 Dense-Pac Microsystems, Ina 0 DESCRIPTION: The DPS1M S8EJ4/EL4/RJ4/RL4 surface mount SRAM m odules are a revolutionary memory subsystems using Dense-Pac Microsystems' new 2nd Generation Stacking Technology. The module
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OCR Scan
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128Kx8
512Kx8
400-mil
500mV
3QA09002
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PDF
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 3 Megabit High Speed CMOS SRAM DPS128X24Bn3 DESCRIPTION: The DPST28X24Bn3 High Speed SRAM "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded or gullwing leaded
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OCR Scan
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DPS128X24Bn3
DPST28X24Bn3
50-pin
DPS128X24Bn3
3QAD97-33
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PDF
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DPS512S8
Abstract: No abstract text available
Text: DENSE-PAC 4 Megabit High Speed CMOS SRAM DPS512S8 EJ4/E L4/RJ4/RL4 M I C R O S Y S T E M S DESCRIPTION: The DPS512S8EJ4/EL4/RJ4/RL4 surface mount SRAM modules are a revolutionary memory subsystems using Dense-Pac Microsystems' new 2nd Generation Stacking Technology. The module combines four
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OCR Scan
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DPS512S8
DPS512S8EJ4/EL4/RJ4/RL4
128Kx8
512Kx8
400-mil
32-PIN
36-PIN
3QA090-0D
DPS512S8EJ4/EL4/RJ4/RL4
32-PIN
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PDF
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC 8 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X 16Cn3/DPS512X 16Bn3 DESCRIPTION: The DPS512X16Cn3/DPS512X16Bn3 High Speed SRAM “ STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .
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OCR Scan
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DPS512X
16Cn3/DPS512X
16Bn3
DPS512X16Cn3/DPS512X16Bn3
50-pin
-t-85
3QA097-38
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PDF
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128depth
Abstract: No abstract text available
Text: D E N S E -P A C 2 Megabit CMOS SRAM M I C R O S Y S T E M S D PS128X16n3 DESCRIPTION: The DPS128X16n3 SRAM "STACK" modules area revolutionary new memory subsystem using Dense-Pac Microsystems'ceramic Stackable Leadless Chip Carriers SLCQ. Available in straight leaded, "J" leaded
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OCR Scan
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PS128X16n3
DPS128X16n3
50-pin
100ns
120ns
150ns
128depth
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PDF
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Untitled
Abstract: No abstract text available
Text: DENSE-PAC MICROSYSTEMS 2 Megabit High Speed C M O S SRAM DPS256S8EJ4/EL4/RJ4/RL4 DESCRIPTION: The DPS256S8EJ4/EL4/RJ4/RL4 surface mount SR A M modules are a revolutionary memory subsystems using Dense-Pac Microsystems' new 2nd Generation Stacking Technology. The module combines two
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OCR Scan
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DPS256S8EJ4/EL4/RJ4/RL4
DPS256S8EJ4/EL4/RJ4/RL4
128Kx8
400-mil
30A090-04
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PDF
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