cdr 03a
Abstract: PESTO MCC 90-15 Dense-Pac Microsystems T-46-23-74 836 mgc
Text: DENSE-PAC MICROSYSTEMS 2ÖE J> • 275=1415 ODGG7ÖO 2 « D P C DPS1MS8A3 Dense-Pac M k ro iy siem s jn c ^ 1024 |<X 8 BUFFERED/DECODED C M O S SRAM M O D ULE PRELIM IN A RY_ 7^V4-23-W D ESCRIPTIO N: The DPS1MS8A3 "DENSE-STACK" module is a revolutionary new memory
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1024K
500mV
30A04001
cdr 03a
PESTO
MCC 90-15
Dense-Pac Microsystems
T-46-23-74
836 mgc
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Untitled
Abstract: No abstract text available
Text: DPS1MS8A3 Dense-Pac Microsystems, I n c . 1Q24K X 8 BUFFERED/DECODED CMOS SRAM MODULE PRELIMINARY D E S C R IP T IO N : The DPS1M S8A3 "DEN SE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip
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1Q24K
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Untitled
Abstract: No abstract text available
Text: □PM DPS1MS8A3 Dense-Pac Microsystems, Inc. 0 102 4 K X 8 B U F F E R E D / D E C O D E D C M O S S R A M M O D U L E PRELIMINARY DESCRIPTION: The D P S 1 M S 8 A 3 "D E N SE -ST A C K " module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip
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I/05A
I/03B
I/04A
I/07A
I/03A
I/06A
I/07B
I/02B
I/07B
30A040-01
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Untitled
Abstract: No abstract text available
Text: COPM V Dense-Pac Microsystems, Inc^ DPS1MS8A3 1024K X 8 BUFFERED/DECODED CM OS SRAM M ODULE PRELIMINARY DESCRIPTION: The DPS1MS8A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC along with memory interface logic and capacitors mounted
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OCR Scan
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PDF
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1024K
30A04001
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Untitled
Abstract: No abstract text available
Text: □PM DPS1MS8A3 Dense-Pac M ic r o s y s te m s jn ç ^ 1024K X 8 BUFFERED/DECODED C M O S SRAM M O D U LE PRELIMINARY DESCRIPTION: The DPS1MS8A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip
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OCR Scan
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PDF
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1024K
I/05B
30A04001
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