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    300MIL TRAYS Search Results

    300MIL TRAYS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10067847-001TLF Amphenol Communications Solutions 10067847-001TLF-SD CARD TRAY PACKAGING Visit Amphenol Communications Solutions
    U77A11282001 Amphenol Communications Solutions 1X1 CAGE FOR H/S NI TRAY Visit Amphenol Communications Solutions
    U77A11282021 Amphenol Communications Solutions 1X1 CAGE FOR H/S NI TRAY Visit Amphenol Communications Solutions
    U77A61142001 Amphenol Communications Solutions SFP 1X6 CAGE NI TRAY Visit Amphenol Communications Solutions
    U77A11181D01 Amphenol Communications Solutions SFP CAGE 1X1 TIN TRAY D/C Visit Amphenol Communications Solutions

    300MIL TRAYS Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    324pc

    Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
    Text: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension


    Original     		240mil SP050PC 340mil SP070PC 440mil 12P9B 14P5A 16P5A 20P5A 24P5A 324pc L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881 PDF

    tqfp 10x10 tray

    Abstract: tqfp 14x14 tray QFN tray Tube 4-400 tray tqfp 14x14 1.4 156 QFN 12X12 LQFP 48 Package Box A7 SOT-89 HS-2000-1 QFN Shipping Trays
    Text: The Operation Instruction of Packing Materials Purpose Warehouse and subcontractors according to the instruction for purchasing and incoming inspection , formulate the Operation Instruction of Packing Materials. Scope Related all packing materials in warehouse.


    Original     		PDF

    antistatic epe foam

    Abstract: mark JS sot-25 V7100 sot89 MARK JB 150MIL 300MIL 600MIL SOT-25 JB QFP Shipping Trays TTO-220
    Text: The Operation Instruction of Packing Materials PURPOSE Warehouse and Subcontractors according to the instruction for purchaseing and incoming inspection, formulate the Operation Instruction of Packing Materials. SCOPE Related all packing materials in warehouse.


    Original     		200mm 150mm 118MIL 150MIL 300MIL antistatic epe foam mark JS sot-25 V7100 sot89 MARK JB 150MIL 300MIL 600MIL SOT-25 JB QFP Shipping Trays TTO-220 PDF

    sot89 MARK JB

    Abstract: V7100 TSOP 66 Package mark JS sot-25 YB SOT-25 150MIL 300MIL 600MIL TO-220t qfn 8 x 8 TRAY
    Text: 成品倉庫封裝材料規格規範手冊 目的 制定成品倉庫相關封裝材料收料標準，作為成品倉庫及外包廠採購及驗收遵循依據。 適用範圍 成品倉庫所有相關封裝材料。 內容 包材資料 WAFER 包裝用材料 參表一


    Original     		200mm( 150mm( 520mm( 690mm( 179mm( 230mm( 180mm( sot89 MARK JB V7100 TSOP 66 Package mark JS sot-25 YB SOT-25 150MIL 300MIL 600MIL TO-220t qfn 8 x 8 TRAY PDF

    msm5232

    Abstract: d2b bus MSM5230 MSM6920 MSM7731-02 2016 RAM MSM66P589 MSM6411 18QFJ 3ch-10bit
    Text: Semiconductor Shortform Catalogue June 1999 Taupo Bay, New Zealand Foreword Strong Partnerships http://www.arm.com/ http://www.rambus.com/ http://www.elan.fr/ http://www.dialogic.com/ http://www.symbionics.co.uk/ http://www.vividsemi.com/ Oki Semiconductor Websites


    Original     		99J595RB msm5232 d2b bus MSM5230 MSM6920 MSM7731-02 2016 RAM MSM66P589 MSM6411 18QFJ 3ch-10bit PDF

    IC 50061

    Abstract: LFBGA 50-P-400 QFP128-P-1420-0 qfp304 QFP304 tray size QSJ-44440 P-LFBGA84-0909-0 P-LFBGA224-1515-0 SOJ32-P-400-1
    Text: This version: Apr. 2001 Previous version: Jun. 1997 PACKAGE INFORMATION 7. PACKING This document is Chapter 7 of the package information document consisting of 8 chapters in total. PACKAGE INFORMATION 7. PACKING 7. PACKING 7.1 Packing Type 7.1.1 Ordinary Packing


    Original     		PDF

    IOW24PV-P

    Abstract: IOW24-P IOW24-S IOW56-MOD IOW56-DG SSOP-48 IOW24P MLFP56 IOW40-S IOW24
    Text: IO-Warrior Pricing Code Mercenaries IO-Warrior Pricelist Starter Kit: Starter Kits are sold unassembled. The kit comes with all components and a CD with the SDK. Ordering number for IO-Warrior 56 starter kit: IOWKIT56, price per unit: Euro 69 Ordering number for IO-Warrior 40 starter kit: IOWKIT40, price per unit: Euro 49


    Original     		IOWKIT56, IOWKIT40, IOWKIT24, IOW40KIT SSOP48 DIL40 DIP40 IOW40-S IOW24PV-P IOW24-P IOW24-S IOW56-MOD IOW56-DG SSOP-48 IOW24P MLFP56 IOW40-S IOW24 PDF

    MSM7731-02

    Abstract: P-BGA313-3535-1 TBA 931 MsM82C59 MSM66 arm processor msm5299 SSOP20-P-250-0 QFJ28-P-S450-1 MSM65524A
    Text: Datasheet CD-ROM Ver 1.23, July 1999 Bay of Islands, New Zealand Attention Please! People to People Technology 1. Regarding Operation • This is NOT a music CD. Please do not play it on an ordinary music CD player. It may cause damage to your ears and loudspeakers.


    Original     		270MB ML670100 D-41460 MSM7731-02 P-BGA313-3535-1 TBA 931 MsM82C59 MSM66 arm processor msm5299 SSOP20-P-250-0 QFJ28-P-S450-1 MSM65524A PDF

    Q67100-Q2156

    Abstract: Q67100-Q2157
    Text: 4M x 32-Bit EDO-DRAM Module HYM 324025S/GS-50/-60 Advanced Information • 4 194 304 words by 32-bit organization • Fast access and cycle time 50 ns access time 84 ns cycle time -50 version 60 ns access time 104 ns cycle time (-60 version) • Hyper page mode (EDO) capability


    Original     		32-Bit 324025S/GS-50/-60 324025S/GS-50) 324025S/GS-60) GLS05835 L-SIM-72-12 Q67100-Q2156 Q67100-Q2157 PDF

    LGA 1156 PIN OUT diagram

    Abstract: QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram
    Text: DIP8-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.46 TYP. 2/Dec. 11, 1996 DIP14-P-300-2.54 5 Package material Lead frame material Pin treatment Package weight (g)


    Original     		DIP8-P-300-2 DIP14-P-300-2 DIP16-P-300-2 DIP18-P-300-2 MIL-M-38510 MIL-STD-883 LGA 1156 PIN OUT diagram QSJ-44403 LGA 1150 Socket PIN diagram LGA 1155 Socket PIN diagram IC107-26035-20-G LGA 1151 PIN diagram REFLOW lga socket 1155 IC107-3204-G TB 2929 H alternative LGA 1155 pin diagram PDF

    Untitled

    Abstract: No abstract text available
    Text: SIEMENS 4M X 32-Bit EDO-DRAM Module HYM 324025S/GS-50/-60 Advanced Information • 4 194 304 words by 32-bit organization • Fast access and cycle time 50 ns access time 84 ns cycle time -50 version 60 ns access time 104 ns cycle time (-60 version) • Hyper page mode (EDO) capability


    OCR Scan     		32-Bit 324025S/GS-50/-60 324025S/GS-50) 324025S/GS-60) fiE35bà GGA5345 6235b05 PDF

    300mil-wide trays

    Abstract: No abstract text available
    Text: SIEMENS 4M X 32-Bit EDO-DRAM Module HYM 324025S/GS-50/-60 Advanced Information • 4 194 304 words by 32-bit organization • Fast access and cycle time 50 ns access time 84 ns cycle time -50 version 60 ns access time 104 ns cycle time (-60 version) • Hyper page mode (EDO) capability


    OCR Scan     		32-Bit 324025S/GS-50/-60 324025S/GS-50) 324025S/GS-60) L-SIM-72-12 324025S/GS-50/-60 300mil-wide trays PDF

    Samsung EOL

    Abstract: IS42S81600F is42s16320 IS43DR16320 IS42S32200L IS49NLC36800 IS43R32400E IS46R Mobile SDRAM IS42S32200E
    Text: Industrial Grade Memory Products Selecting the Right ISSI Industrial Grade Memory Fastest Random Access Access <20ns 288-576Mb Memory No DRC* Lower cost/bit 18-72Mb RLDRAM 10-20ns Easy Interface, Low Power Higher Density Ultra Low Power Synch SRAM <5ns Asynch SRAM


    Original     		288-576Mb 10-20ns 18-72Mb 64Kb-16Mb 8Mb-64Mb 16Mb-512Mb 16Mb-1Gb 256Mb-2Gb 200Mhz -40oC Samsung EOL IS42S81600F is42s16320 IS43DR16320 IS42S32200L IS49NLC36800 IS43R32400E IS46R Mobile SDRAM IS42S32200E PDF

    300mil-wide trays

    Abstract: Q67100-Q2156 Q67100-Q2157
    Text: SIEM EN S 4M X 32-Bit EDO-DRAM Module HYM 324025S/GS-50/-60 Advanced Information • 4 194 304 words by 32-bit organization • Fast access and cycle tim e 50 ns access time 84 ns cycle tim e -50 version 60 ns access tim e 104 ns cycle tim e (-60 version)


    OCR Scan     		32-Bit 324025S/GS-50/-60 324025S/GS-50) 324025S/GS-60) ModufiE35bD5 L-SIM-72-12 B235b05 300mil-wide trays Q67100-Q2156 Q67100-Q2157 PDF

    bt 33 f

    Abstract: No abstract text available
    Text: SIEM EN S 4M x 4-Bit Dynamic RAM 2k & 4k Refresh Fast Page Mode HYB 5116400BJ-50/-60 HYB 5117400BJ-50/-60 HYB 3116400BJ/BT-50/-60 HYB 3117400BJ-50/-60 Advanced Information • 4 194 304 words by 4-bit organization • 0 to 70 °C operating temperature •


    OCR Scan     		5116400BJ-50/-60 5117400BJ-50/-60 3116400BJ/BT-50/-60 3117400BJ-50/-60 400BJ-50/-60 400BJ/BT-50/-60 P-TSOPII-26/24-1 GPX05857 bt 33 f PDF

    Untitled

    Abstract: No abstract text available
    Text: SIEM EN S 4M x 4-Bit Dynamic RAM 2k & 4k Refresh Hyper Page Mode - EDO HYB 5116405BJ-50/-60 HYB 5117405BJ-50/-60 HYB 3116405BJ/BT(L)-50/-60 HYB 3117405BJ/BT-50/-60 Advanced Information • 4 194 304 words by 4-bit organization • 0 to 70 °C operating temperature


    OCR Scan     		5116405BJ-50/-60 5117405BJ-50/-60 3116405BJ/BT 3117405BJ/BT-50/-60 -5J-26/24-1 300mil) 405BJ-50/-60 405BJ/BT PDF

    JM7000

    Abstract: static ram 2015
    Text: BS EN ISO 9001:2000 accreditation AS9100 REV B Certificate No. RS 216900 SCD # QM6055 Source Control Drawing Upscreening/Manufacturing Specification P/N FT22C12DMB 1 2 3 3.1 3.2 3.3 3.4 3.5 4 4.1 4.11 5 5.1 6 6.1 7 8 8.1 8.2 8.3 Title Page .


    Original     		AS9100 QM6055 FT22C12DMB Dec-09 JM7000 static ram 2015 PDF

    WCs MARKING

    Abstract: SMD MARKING code ASC SMD MARKING CODE RAC 5117400
    Text: 4M x 4-Bit Dynamic RAM 2k & 4k Refresh Fast Page Mode HYB 5116400BJ-50/-60 HYB 5117400BJ-50/-60 HYB 3116400BJ/BT-50/-60 HYB 3117400BJ-50/-60 Advanced Information • 4 194 304 words by 4-bit organization • 0 to 70 °C operating temperature • Fast Page Mode operation


    Original     		5116400BJ-50/-60 5117400BJ-50/-60 3116400BJ/BT-50/-60 3117400BJ-50/-60 400BJ-50/-60 400BJ/BT-50/-60 P-TSOPII-26/24-1 GPX05857 WCs MARKING SMD MARKING code ASC SMD MARKING CODE RAC 5117400 PDF

    SPT0305

    Abstract: Q67100-Q1101 q67100-q1102 WCs MARKING SMD MARKING code ASC code marking rah
    Text: 4M x 4-Bit Dynamic RAM 2k & 4k Refresh Hyper Page Mode - EDO HYB 5116405BJ-50/-60 HYB 5117405BJ-50/-60 HYB 3116405BJ/BT(L)-50/-60 HYB 3117405BJ/BT-50/-60 Advanced Information • 4 194 304 words by 4-bit organization • 0 to 70 °C operating temperature


    Original     		5116405BJ-50/-60 5117405BJ-50/-60 3116405BJ/BT 3117405BJ/BT-50/-60 405BJ-50/-60 405BJ/BT P-TSOPII-26/24-1 GPX05857 SPT0305 Q67100-Q1101 q67100-q1102 WCs MARKING SMD MARKING code ASC code marking rah PDF

    is62c51216al

    Abstract: IS43LR16320B IS66WVE4M16BLL is66wve2m16 IS43DR16640A BGA60 IS66WVE4M16ALL TSOP2-44 IS42SM16400G is45vs16160d
    Text: To our valued customers, At ISSI we design, develop and market high performance integrated circuits for the following key markets: i automotive electronics (ii) networking/telecommunications infrastructure, (iii) industrial/military/medical electronics (iv) mobile communications and digital


    Original     		PDF

    Automotive Product Selector Guide

    Abstract: products automotive IS61WV51216 IS61WV512 DDR RAM 512M is66wve2m16 IS61LPS2048 IS61WV25632 BGA165 VFBGA package tray
    Text: Automotive Market Support Introduction ISSI has been supporting the Automotive Market since 1999. In 2001, ISSI began to broaden its support of the market by introducing the Automotive Business Unit. The purpose of this business unit is to provide cross-functional unit support within ISSI to continually enhance the Automotive Infrastructure from


    Original     		PDF

    S1D15719

    Abstract: S1D15722D01B S1D15719D22B S1D15714D01E s1d13517 S1D15722 Matrix CCD "line sensor" Epson epd driving S1D15712 S1D15721D01B
    Text: CMOS LSIs Product Catalog 2009 SEIKO EPSON CORPORATION CMOS LSIs Contents Configuration of product number . 2 1 ASICs Application Specific IC 1-1 Gate Arrays . 4


    Original     		S1L70000 S1L60000 S1L50000 S1L30000 16-bit 32-bit S1D15719 S1D15722D01B S1D15719D22B S1D15714D01E s1d13517 S1D15722 Matrix CCD "line sensor" Epson epd driving S1D15712 S1D15721D01B PDF

    d1884

    Abstract: TSOP infrared TQFP80-P-1212-0 MSM6779BAV-Z-01 MARK W1 TSOP MSM6778BAV-Z-01 DIP14-P-300-2 DIP20-P-300-2 3360D 8400B
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		50mil 100mil 70mil 40PQFP d1884 TSOP infrared TQFP80-P-1212-0 MSM6779BAV-Z-01 MARK W1 TSOP MSM6778BAV-Z-01 DIP14-P-300-2 DIP20-P-300-2 3360D 8400B PDF

    DIP24-P-600-2

    Abstract: oki qfp tray SEPT24
    Text: Package Overview I Type Typical Sample Semiconductor Pin Counts Pitches [mm] OKI Suffix DIP Dual-in-line Package 8, 14, 16, 18, 20, 22, 24, 28, 32, 36, 40, 42, 48 2.54 RA SDIP (Shrink Dual-in-line Package) 30, 42, 64 1.778 ZIP (Zig-Zag In-line Package) 20, 24, 28, 40


    Original     		100mil 70mil 50mil 40PQFP DIP24-P-600-2 oki qfp tray SEPT24 PDF