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    80 pin simm flash

    Abstract: AM29LV017B EDI7F332MV
    Text: White Electronic Designs EDI7F332MV 2Mx32 FLASH MODULE FEATURES 2Mx32 and 2x2Mx32 Densities Data Polling and Toggle Bit feature for detection of program or erase cycle completion Based on AMD - AM29LV017B Flash Device Low Power Dissipation Fast Read Access Time - 90ns


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    PDF EDI7F332MV 2Mx32 2x2Mx32 AM29LV017B EDI7F2332MV90BNC EDI7F2332MV100BNC EDI7F2332MV120BNC 80 pin simm flash EDI7F332MV

    AM29F016

    Abstract: EDI7F332MC
    Text: White Electronic Designs EDI7F332MC 2Mx32 FLASH MODULE FEATURES „ „ 2Mx32 and 2x2Mx32 Densities „ Based on AMD - AM29F016 Flash Device „ Fast Read Access Time - 90ns „ Data Polling and Toggle Bit feature for detection of program or erase cycle completion


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    PDF EDI7F332MC 2Mx32 AM29F016 2x2Mx32 EDI7F2332MC90BNC EDI7F2332MC100BNC EDI7F2332MC120BNC EDI7F2332MC150BNC EDI7F332MC

    AM29LV017B

    Abstract: EDI7F332MV
    Text: White Electronic Designs EDI7F332MV 2Mx32 FLASH MODULE FEATURES „ Data Polling and Toggle Bit feature for detection of program or erase cycle completion „ Low Power Dissipation „ 2Mx32 and 2x2Mx32 Densities „ Based on AMD - AM29LV017B Flash Device „ Fast Read Access Time - 90ns


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    PDF EDI7F332MV 2Mx32 2x2Mx32 AM29LV017B EDI7F2332MV90BNC EDI7F2332MV100BNC EDI7F2332MV120BNC EDI7F332MV

    SIMM 80 jedec

    Abstract: 80 pin simm flash Flash SIMM 80 E28F016S5 EDI7F342MC
    Text: EDI7F342MC White Electronic Designs 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MC and EDI7F2342MC are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's E28F016S5 2Mx8 Flash device in TSOP packages which are mounted on an


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    PDF EDI7F342MC 2Mx32 EDI7F342MC EDI7F2342MC E28F016S5 EDI7F342MC-BNC: A0-A20 150ns SIMM 80 jedec 80 pin simm flash Flash SIMM 80

    28F016S3

    Abstract: EDI7F342MV 80pin-SIMM
    Text: EDI7F342MV White Electronic 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3 2Mx8 Flash device in TSOP packages which are mounted on an


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    PDF EDI7F342MV 2Mx32 EDI7F342MV 7F2342MV 28F016S3 EDI7F342MV-BNC: A0-A20 150ns 80pin-SIMM

    W72M64V-XBX

    Abstract: No abstract text available
    Text: W72M64V-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package *Preliminary FEATURES ! Access Times of 100, 120, 150ns ! Unlock Bypass Program command ! Packaging • Reduces overall programming time when issuing multiple program command sequences


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    PDF W72M64V-XBX 2Mx64 150ns 13x22mm 100ns 120ns W72M64V-XBX

    28F016S3

    Abstract: EDI7F342MV
    Text: EDI7F342MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.


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    PDF EDI7F342MV 2Mx32 EDI7F342MV 7F2342MV 28F016S3- EDI7F342MV-BNC: 150ns A0-A20 28F016S3

    bsc 60h

    Abstract: No abstract text available
    Text: White Electronic Designs W72M64V-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package *Advanced FEATURES • Access Times of 100, 120, 150ns ■ Unlock Bypass Program command ■ Packaging • • 159 PBGA, 13x22mm - 1.27mm pitch Reduces overall programming time when issuing


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    PDF W72M64V-XBX 2Mx64 150ns 13x22mm 2x2Mx32 100ns 120ns 150ns bsc 60h

    AM29LV017B

    Abstract: EDI7F332MV 15607
    Text: EDI7F332MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F332MV and EDI7F2332MV are organized as one and two banks of 2Mx32 respectively. The modules are based on AMDs AM29LV017B- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS


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    PDF EDI7F332MV 2Mx32 EDI7F332MV EDI7F2332MV AM29LV017B- EDI7F332MV-BNC: 120ns A0-A20 AM29LV017B 15607

    28F016S3

    Abstract: EDI7F342MV
    Text: EDI7F342MV 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MV and EDI 7F2342MV are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's 28F016S3- 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate.


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    PDF EDI7F342MV 2Mx32 EDI7F342MV 7F2342MV 28F016S3- EDI7F342MV-BNC: 150ns A0-A20 28F016S3

    SIMM 80 jedec

    Abstract: E28F016S5 EDI7F342MC
    Text: EDI7F342MC White Electronic 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F342MC and EDI7F2342MC are organized as one and two banks of 2Mx32 respectively. The modules are based on Intel's E28F016S5 2Mx8 Flash device in TSOP packages which are mounted on an


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    PDF EDI7F342MC 2Mx32 EDI7F342MC EDI7F2342MC E28F016S5 EDI7F342MC-BNC: A0-A20 150ns SIMM 80 jedec

    W72M64VK-XBX

    Abstract: W72M64V-XBX
    Text: White Electronic Designs W72M64VK-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package FEATURES Access Times of 90, 100, 120ns Unlock Bypass Program command Packaging • Reduces overall programming time when issuing multiple program command sequences


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    PDF W72M64VK-XBX 2Mx64 120ns 13x22mm 2Mx16 100ns W72M64VK-XBX W72M64V-XBX

    AM29F016

    Abstract: 80 pin simm flash EDI7F332MC
    Text: EDI7F332MC White Electronic Designs 2Mx32 FLASH MODULE FIG. 1 DESCRIPTION BLOCK DIAGRAMS The EDI7F332MC and EDI7F2332MC are organized as one and two banks of 2Mx32 respectively. The modules are based on AMDs AM29F016 - 2Mx8 Flash device in TSOP packages which are mounted on a FR4 substrate.


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    PDF EDI7F332MC 2Mx32 EDI7F332MC EDI7F2332MC AM29F016 EDI7F322MC-BNC: 150ns 80 pin simm flash

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W72M64VB-XBX 2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package FEATURES  Access Times of 90, 100, 120ns  Packaging  • Write protect WP# function allows protection two outermost boot sectors, regardless of sector


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    PDF W72M64VB-XBX 2Mx64 120ns 13x22mm 64-Kbyte -70ns

    MARK J3

    Abstract: AM29F016 EDI7F332MC amd AM29F016
    Text: EDI7F332MC 2Mx32 FLASH MODULE DESCRIPTION FIG. 1 The EDI7F332MC and EDI7F2332MC are organized as one and two banks of 2Mx32 respectively. The modules are based on AMDs AM29F016 - 2Mx8 Flash device in TSOP packages which are mounted on an FR4 substrate. BLOCK DIAGRAMS


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    PDF EDI7F332MC 2Mx32 EDI7F332MC EDI7F2332MC AM29F016 EDI7F332MC-BNC: 150ns A0-A20 MARK J3 amd AM29F016

    Untitled

    Abstract: No abstract text available
    Text: MITSUBISHI MEM OR Y CARD D Y N A M I C R A M C AR D S 1x2Mx32bit DRAM Card M F 1 8 M M F 1 1 6 1 M - J 5 7 A T X X - J 5 7 A T X X 2x2Mx32bit D R A M Card C o n n e c to r T y p e T w o -p ie c e 8 8 -p in D E S C R IP T IO N These DRAM CARDs are develo ped


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    PDF 1x2Mx32bit 2x2Mx32bit 68P-004 b24T62S 60P-004

    Untitled

    Abstract: No abstract text available
    Text: MITSUBISHI MEMORY CARD DYNAMIC RAM CARDS 1x2Mx32bit D R A M Card 2x2Mx32bit D R A M Card MF18M1-J57ATXX MF116M- J 5 7 A T X X Connector Type T w o-piece 88-p in / 7 DESCRIPTION These DRAM CARDs a re developed based on J E I D A D R A M C A R D G U I D E L I N E V e r . 2.1.


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    PDF 1x2Mx32bit 2x2Mx32bit MF18M1-J57ATXX MF116M- s/2048cycle) 88pin

    Untitled

    Abstract: No abstract text available
    Text: a WHITE /MICROELECTRONICS 2x2Mx32 5V FLASH S IM M WPF4M32XA-90PSC5 PRELIMINARY* FEATURES • ■ A cce ss T im e o f 90ns ■ 1 00 ,00 0 E ra se/P ro gra m C ycles Packaging: ■ O rganized as tw o banks o f 2 M x3 2 • 8 0-p in S IM M ■ C o m m e rcia l T e m p e ra tu re Range


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    PDF 2x2Mx32 WPF4M32XA-90PSC5

    Am29f

    Abstract: No abstract text available
    Text: I/VHITE /M ICROELECTRONICS ç a 2x2Mx32 5V FLASH SIMM WPF4M32XA-90PSC5 P R ELIM IN A R Y * FEATURES • A ccess Tim e o f 90ns ■ 100,000 Erase/Program Cycles ■ Packaging: ■ Organized as tw o banks o f 2 M x 3 2 • 80-pin S IM M ■ C om m ercial Te m p e ra tu re Range


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    PDF WPF4M32XA-90PSC5 2x2Mx32 80-pin Am29f

    29F016-90

    Abstract: No abstract text available
    Text: WPF4M32XA-90PSC5 2x2Mx32 5V FLASH SIMM p r e l im in a r y * FEATURES • ■ 100,000 Erase/Program Cycles A cce ss Time of 90ns Packaging: Organized as two banks of 2M x32 • 80-pin SIM M Com m ercial Temperature Range • The module is m anufactured w ith eight 2M x8 CM O S Flash


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    PDF WPF4M32XA-90PSC5 2x2Mx32 80-pin Am29F016 29F016-90

    Untitled

    Abstract: No abstract text available
    Text: MITSUBISHI M EM ORY CARD DYNAMIC RAM CARDS 1x2Mx32bit D RAM Card M F 1 8 M 1 - L 5 7 A T X X M F 1 1 6 M - L 5 7 A T X X 2x2Mx32bit DRAM Card Connector Type T w o - p ie c e 8 8 -p in ✓ """ D E S C R IP T IO N These D R A M C A R D s are developed based


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    PDF 1x2Mx32bit 2x2Mx32bit 88pin 68P-004 35PIN 34PIN b2MT62S 68P-005 60P-004 lfl25

    L88-Pin

    Abstract: 24D40
    Text: MITSUBISHI M EM O RY CAR D D Y N A M I C R A M CARDS 1x2Mx32bit D R A M Card MF18M1-L57ATXX MF116M-L57ATXX 2x2Mx32bit D R A M Card Connector Type T w o - p ie c e 8 8 - p i n / — ^ DESCRIPTION These D R A M C A R D s are developed based on J E I D A D R A M C A R D G U I D E L I N E Ver. 2. 1.


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    PDF 1x2Mx32bit 2x2Mx32bit MF18M1-L57ATXX MF116M-L57ATXX 88pin K/32ms> 2K/32ms> L88-Pin 24D40

    Untitled

    Abstract: No abstract text available
    Text: WHITE /MICROELECTRONICS 2x2Mx325V FLASH SIMM W PF4M 32XA-90PSC5 PRELIMINARY* FEATURES • A ccess Tim e of 90ns ■ Packaging: • 80-pin S IM M • The m odule is m a nufa cture d w ith eigh t 2 M x8 CMOS Rash ■ 100,000 E rase/Program Cycles ■ O rganized as tw o banks of 2M x32


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    PDF 2x2Mx325V 80-pin 29F016-90 32XA-90PSC5

    Untitled

    Abstract: No abstract text available
    Text: c H/HITE /MICROELECTRONICS a 2x2Mx32 5V FLASH S IM M WPF4M32XA-90PSC5 PRELIMINARY* FEATURES • ■ A c c e s s Tim e of 9 0 n s ■ 100,000 Erase/Program C ycles Packaging: ■ O rganized a s tw o b a n ks of 2 M x 3 2 • 80-pin S I M M ■ Com m ercial Tem perature R ange


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    PDF 2x2Mx32 WPF4M32XA-90PSC5 80-pin