Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    2M X 32 CHIP BLOCK DIAGRAM Search Results

    2M X 32 CHIP BLOCK DIAGRAM Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM2195C2A333JE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    2M X 32 CHIP BLOCK DIAGRAM Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    as8flc2m32b

    Abstract: DQ0-DQ14
    Text: FLASH AS8FLC2M32 FIGURE 1: PIN ASSIGNMENT Top View Hermetic, Multi-Chip Module (MCM) 64Mb, 2M x 32, 3.3Volt Boot Block FLASH Array • MIL-PRF-38534, Class H FEATURES • • • • • • • • • • • • • • • 64Mb device, total density, organized as 2M x 32


    Original     		PDF AS8FLC2M32 MIL-PRF-38534, 2Mx32, AS8FLC2M32B DQ0-DQ14

    JED-STD-020

    Abstract: 125OC we3266
    Text: Issue 5.1 April 2001 Description The PUMA 68FV64006X is a 2M x 32 Flash Module housed in a 68 ‘J’ Leaded Surface mount package with access times of 90, 120 and 150ns. A 70ns variant is under development Block Diagram A0~A20 /OE /WE /RESET The Output width is user configurable as 8, 16 or 32


    Original     		PDF 68FV64006X 150ns. JED-STD-020. 200pcs 183OC 225OC 219OC JED-STD-020 125OC we3266

    2A193

    Abstract: 125OC JED-STD-020 D2250
    Text: Issue 5.1 April 2001 Description The PUMA 68F64006X is a 2M x 32 Flash Module housed in a 68 ‘J’ Leaded Surface mount package with access times of 90, 120 and 150ns. A 70ns variant is under development Block Diagram A0~A20 /OE /WE /RESET The Output width is user configurable as 8, 16 or 32


    Original     		PDF 68F64006X 150ns. JED-STD-020. 200pcs 183OC 225OC 219OC 2A193 125OC JED-STD-020 D2250

    I-012

    Abstract: No abstract text available
    Text: Issue 1.1 November 2002 Description The PUMA 84 range of devices provide a high density, surface mount memory solution with density up to twice that of standard monolithic devices. Block Diagram A0 ~A20 /OE /CS1 /WE1 2M x 8 /CS2 /WE2 2M x 8 The device is available to commercial and industrial


    Original     		PDF PUMA84SV64000 2Mx32 84SV64000 I-012 I-012

    Untitled

    Abstract: No abstract text available
    Text: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square


    Original     		PDF WF2M32-XXX5 2Mx32 150ns 64KBytes WF2M32U-XG2UX 64KByte

    WF2M32-XXX5

    Abstract: No abstract text available
    Text: WF2M32-XXX5 HI-RELIABILITY PRODUCT 2Mx32 5V FLASH MODULE, SMD 5962-97531 pending PRELIMINARY* FEATURES • Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP (Package 401). • 68 lead, Hermetic CQFP (G2U), 22.4mm (0.880") square


    Original     		PDF WF2M32-XXX5 2Mx32 150ns 64KBytes 2Mx32 64KByte 01HXX* 120ns WF2M32-XXX5

    toshiba toggle mode nand

    Abstract: TC518128 TC518129 TC551001 equivalent 551664 TC518512 sgs-thomson power supply Toggle DDR NAND flash jeida 38 norm APPLE A5 CHIP
    Text: DRAM Technology n TOSHIBA DRAM TECHNOLOGY Toshiba DRAM Technology 2 DRAM Technology n DRAM TECHNOLOGY TRENDS Density Design Rule 64M→128M →256M →512M →1G 0.35µm →0.25 µm →0.20 µm →0.175 µm Cost Down, Yield Improvement High Bandwidth Multi - bit


    Original     		PDF 64M128M 66MHz 100MHz 200MHz) 500/600MHz 800MHz 400MHz 800MHz) X16/X18X32 PhotoPC550 toshiba toggle mode nand TC518128 TC518129 TC551001 equivalent 551664 TC518512 sgs-thomson power supply Toggle DDR NAND flash jeida 38 norm APPLE A5 CHIP

    O28 Package

    Abstract: WF2M32-XXX5 WF2M32U-XG2UX 68 lead CQFJ
    Text: White Electronic Designs WF2M32-XXX5 2Mx32 5V Flash Module FEATURES Access Time of 90, 120, 150ns Organized as 2Mx32 Packaging: Commercial, Industrial, and Military Temperature Ranges • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .


    Original     		PDF WF2M32-XXX5 2Mx32 150ns 2Mx32 64KBytes WF2M32U-XG2UX O28 Package WF2M32-XXX5 68 lead CQFJ

    WF2M32-XXX5

    Abstract: No abstract text available
    Text: White Electronic Designs WF2M32-XXX5 2Mx32 5V Flash Module FEATURES „ „ Access Time of 90, 120, 150ns „ Organized as 2Mx32 Packaging: „ • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 . Commercial, Industrial, and Military Temperature Ranges


    Original     		PDF WF2M32-XXX5 2Mx32 150ns 2Mx32 64KBytes WF2M32U-XG2UX WF2M32-XXX5

    WF2M32-XXX5

    Abstract: No abstract text available
    Text: WF2M32-XXX5 2Mx32 5V NOR FLASH MODULE FEATURES  Access Time of 90, 120, 150ns  5 Volt Read and Write  Packaging:  Low Power CMOS  Data# Polling and Toggle Bit feature for detection of program or erase cycle completion. • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP


    Original     		PDF WF2M32-XXX5 2Mx32 150ns WF2M32-XXX5

    4MX32

    Abstract: WF4M32-XXX5 01HXX IO30
    Text: WF4M32-XXX5 White Electronic Designs 4MX32 5V FLASH MODULE, SMD 5962-97612 pending PRELIMINARY* FEATURES n Organized as 4Mx32 n Access Times of 100, 120, 150ns n Packaging: n User configurable as 8Mx16 or 16Mx8 in HIP and G4T packages. n Commercial, Industrial, and Military Temperature Ranges


    Original     		PDF WF4M32-XXX5 4MX32 4Mx32 150ns 8Mx16 16Mx8 03HXX* 64KByte 01HXX* WF4M32-XXX5 01HXX IO30

    Untitled

    Abstract: No abstract text available
    Text: WF2M32-XXX5 2Mx32 5V NOR FLASH MODULE FEATURES  Access Time of 90, 120, 150ns  Commercial, Industrial, and Military Temperature Ranges  Packaging:  5 Volt Read and Write. 5V ± 10% Supply.  Low Power CMOS • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP


    Original     		PDF WF2M32-XXX5 2Mx32 150ns 64KBytes 2Mx32

    Untitled

    Abstract: No abstract text available
    Text: WF2M32-XXX5 2Mx32 5V NOR FLASH MODULE FEATURES  Access Time of 90, 120, 150ns  5 Volt Read and Write  Packaging:  Low Power CMOS  Data# Polling and Toggle Bit feature for detection of program or erase cycle completion. • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP


    Original     		PDF WF2M32-XXX5 2Mx32 150ns MIL-STD-883 MIL-PRF-38534

    4MX32

    Abstract: WF4M32-XXX5
    Text: WF4M32-XXX5 HI-RELIABILITY PRODUCT 4MX32 5V FLASH MODULE, SMD 5962-97612 pending PRELIMINARY* FEATURES • Access Times of 100, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP (Package 402). ■ User configurable as 8Mx16 or 16Mx8 in HIP and G4T


    Original     		PDF WF4M32-XXX5 4MX32 150ns 8Mx16 16Mx8 03HXX* 64KByte 01HXX* WF4M32-XXX5

    Untitled

    Abstract: No abstract text available
    Text: A67P1618/A67P0636 Series 2M X 18, 1M X 36 LVTTL, Pipelined ZeBLTM SRAM Preliminary Document Title 2M X 18, 1M X 36 LVTTL, Pipelined ZeBLTM SRAM Revision History History Issue Date Remark 0.0 Initial issue March 25, 2004 Preliminary 0.1 Error Correction: delete BWE pin in block diagram


    Original     		PDF A67P1618/A67P0636 250/227/200/166/150/133MHz)

    Untitled

    Abstract: No abstract text available
    Text: A67P1618/A67P0636 Series 2M X 18, 1M X 36 LVTTL, Pipelined ZeBLTM SRAM Preliminary Document Title 2M X 18, 1M X 36 LVTTL, Pipelined ZeBLTM SRAM Revision History History Issue Date Remark 0.0 Initial issue March 25, 2004 Preliminary 0.1 Error Correction: delete BWE pin in block diagram


    Original     		PDF A67P1618/A67P0636 250/227/200/166/150/133MHz)

    Untitled

    Abstract: No abstract text available
    Text: A67P1618/A67P0636 Series 2M X 18, 1M X 36 LVTTL, Pipelined ZeBLTM SRAM Document Title 2M X 18, 1M X 36 LVTTL, Pipelined ZeBLTM SRAM Revision History History Issue Date Remark 0.0 Initial issue March 25, 2004 Preliminary 0.1 Error Correction: delete BWE pin in block diagram


    Original     		PDF A67P1618/A67P0636

    Untitled

    Abstract: No abstract text available
    Text: 2M x 64 Flash Multi-Chip Package Optimum Density and Performance in One Package W72M64V-XBX Features Designed to complement PowerPC high performance memory controllers see page 2 for typical application block diagram Performance Features • Simultaneous Read/Write operations


    Original     		PDF W72M64V-XBX 16MByte 128Mb) 2Mx64 150ns x64/x72 W72M64V-XBX MIF2033

    Untitled

    Abstract: No abstract text available
    Text: WF2M32-XXX5 White Electronic Designs 2Mx32 5V Flash Module PRELIMINARY* FEATURES • Commercial, Industrial, and Extended Temperature Ranges ■ Access Time of 90, 120, 150ns ■ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .


    Original     		PDF 2Mx32 150ns 64KBytes WF2M32-XXX5 WF2M32U-XG2UX

    footprint cqfp 240

    Abstract: No abstract text available
    Text: WF2M32-XXX5 White Electronic Designs 2Mx32 5V Flash Module PRELIMINARY* FEATURES „ Commercial, Industrial, and Military „ Access Time of 90, 120, 150ns Temperature Ranges „ Packaging: • 66 pin, PGA Type, 1.185" square, Hermetic Ceramic HIP Package 401 .


    Original     		PDF 2Mx32 150ns WF2M32-XXX5 WF2M32U-XG2UX footprint cqfp 240

    WF4M32-XXX5

    Abstract: No abstract text available
    Text: WF4M32-XXX5 White Electronic Designs PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES „ „ „ „ „ Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package


    Original     		PDF WF4M32-XXX5 4Mx32 150ns 990CQFJ 64KBytes 4Mx32 2x4Mx16 WF4M32-XXX5

    WF4M32-XXX5

    Abstract: No abstract text available
    Text: White Electronic Designs WF4M32-XXX5 PRELIMINARY* 4Mx32 5V FLASH MODULE FEATURES Access Times of 100, 120, 150ns Packaging: • 66 pin, PGA Type, 1.385" square, Hermetic Ceramic HIP Package 402 . • 68 lead, 40mm Low Profile CQFP (Package 502), 3.5mm (0.140") height.


    Original     		PDF WF4M32-XXX5 4Mx32 150ns 990CQFJ 64KBytes 4Mx32 2x4Mx16 WF4M32-XXX5

    PCMCIA CARD, Static Memory, write protect switch

    Abstract: 32-PIN LH28F020SU-L LH28F020SUN-L12
    Text: LH28F020SU-L FEATURES • 256K x 8 Bit Configuration • 5 V Write/Erase 3.3 V VCC • Access Time – For 3.3 V Read: 150 ns • Minimum 2.7 V Read Capability – 180 ns Maximum Access Time (VCC = 2.7 V) • 16 Independently Lockable Blocks (16K Blocks)


    Original     		PDF LH28F020SU-L 32-PIN J63428 SMT96103 PCMCIA CARD, Static Memory, write protect switch LH28F020SU-L LH28F020SUN-L12

    32-PIN

    Abstract: LH28F008SA LH28F020SU-N TSOP032-P-0820 28F020SUN80-20
    Text: LH28F020SU-N FEATURES • 256K x 8 Bit Configuration • 5 V Write/Erase Operation 5 V VPP – No Requirement for DC/DC Converter to Write Erase • • • • 2M (256K × 8) Flash Memory 32-PIN TSOP TOP VIEW A11 1 32 A9 2 31 A10 A8 3 30 CE OE A13 4 29


    Original     		PDF LH28F020SU-N 32-PIN J63428 SMT96104 LH28F008SA LH28F020SU-N TSOP032-P-0820 28F020SUN80-20