Abstract: 2CV3
Text: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS 128X32CV3/D PS 128X3 2 BV3 D E SC R IPT IO N : The DPS!2CV3/DPS128X32BV3 "VERSA-STACK" module isa revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ