600mil

Abstract: DIP28
Contextual Info: SANYO Semiconductor Dual In-line Package 28Pin Plastic DIP28 600mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

DIP28H

Contextual Info: SANYO Semiconductor Dual In-line Package with Heat sink 28Pin Plastic DIP28H 500mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

8X13

Contextual Info: SANYO Semiconductor Thin Small Outline Package 28Pin Plastic TSOP28A 8X13.4 Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

amd 2587

Abstract: ca608 Transistor BC 1078 22342 capacitor EMC2102-DZK 186 diod TRANSISTOR BC 187 2N3904 EMC2102 transistor bc 187 pin details
Contextual Info: EMC2102 RPM-Based Fan Controller with HW Thermal Shutdown PRODUCT FEATURES Datasheet GENERAL DESCRIPTION The EMC2102 is an SMBus, closed-loop, RPM-based fan controller/driver with hardware HW thermal shutdown and reset controller. The EMC2102 is packaged in a thermally enhanced, compact, 5x5, 28pin lead-free RoHS compliant QFN package.

HMD8M36M6

Abstract: HMD8M36M6G
Contextual Info: HANBit HMD8M36M6G 32Mbyte 8Mx36 72-pin SIMM FP with Parity Mode, 4K Ref. 5V Part No. HMD8M36M6, HMD8M36M6G GENERAL DESCRIPTION The HMD8M36M6 is a 8M x 36bit dynamic RAM high density memory module. The module consists of four CMOS 4M x 16 bit DRAMs in 50-pin TSOP packages and two CMOS 4M x 4bit Quad CAS DRAM in 28pin SOJ package mounted on a

UPD43257A-10L

Abstract: uPD43257A-10LL UPD43257A-12L UPD43257A-12LL UPD43257A-15L UPD43257A-85L UPD43257A-85LL uPD43257C-15L uPD43257GU-10L UPD43257GU-12L
Contextual Info: - 134256K m ¿astea * OC CMOS S t a t i c RAM 3 2 7 6 8 x 8 ) $ * 4 »> * y y # it TAAC (ns) TCAC nax (ns) TOE •ax (ns) (ns) TOD ■ax (ns) TWP min (ns) TBS ■in (ns) TDH ■in (ns) TWD ■in (ns) TWR ■ÍX (ns) TOH V D D or V C C (V) 28PIN A M IDD

HMN328D

Contextual Info: HANBit HMN328D Non-Volatile SRAM MODULE 256Kbit 32K x 8-Bit ,28Pin DIP, 5V Part No. HMN328D GENERAL DESCRIPTION The HMN328D nonvolatile SRAM is a 262,144-bit static RAM organized as 32,768 bytes by 8 bits. The HMN328D has a self-contained lithium energy source provide reliable non-volatility coupled with the unlimited write

Contextual Info: 28PIN PLASTIC SHRINK DIP 400 mil 28 15 1 14 A K L I J H F D G C N M NOTES 1) Each lead centerline is located within 0.17 mm (0.007 inch) of its true position (T.P.) at maximum material condition. 2) ltem "K" to center of leads when formed parallel. M R B

Contextual Info: 28PIN PLASTIC DIP 300 mil 15 28 14 1 A K L P I J H G M F D R C D M NOTES 1) Each lead centerline is located within 0.25 mm (0.01 inch) of its true position (T.P.) at maximum material condition. 2) Item "K" to center of leads when formed parallel. B ITEM

HSOP28HC

Contextual Info: SANYO Semiconductor Small Outline Package with Heat Sink 28Pin Plastic HSOP28HC 375mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

SOP28 package

Abstract: SOP28
Contextual Info: SANYO Semiconductor Small Outline Package 28Pin Plastic SOP28 450mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

DIP28H

Contextual Info: SANYO Semiconductor Dual In-line Package with Heat sink 28Pin Plastic DIP28H 500mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

Contextual Info: 1/5 Structure Product Name : : Silicon Monolithic Integrated Circuit Power Driver For CD Players Device Name : BA5984FP Features : • 5-ch driver comprising of 4 channels for BTL drivers and 1 channel for reversible drivers • Use of the HSOP-28PIN power package allows downsizing of the set.

28P4

Abstract: JEDEC 600Mil dip "lead material" DIP
Contextual Info: SEATING PLANE EIAJ Package Code DIP28-P-600-2.54 e b1 D b 14 1 Lead Material Alloy 42 15 Weight g 3.8 28 JEDEC Code – A L 28P4 A2 A1 A A1 A2 b b1 c D E e e1 L Symbol Plastic 28pin 600mil DIP c Dimension in Millimeters Min Nom Max – – 5.5 0.51 – –

PIC16F873

Abstract: PIC16C73PIC16C73A PIC16F84A PIC16F628 PIC16F874 PIC16C73B PIC16F84A programmer PIC16F877 PIC16C63 PIC16C73
Contextual Info: PICwriter TM Programming Adapters 28Pin SOIC Programming Adapter 40Pin ZIF Programming Adapter 18Pin/28Pin ZIF Programming Adapter 44Pin PLCC Programming Adapter #MP-SOIC28 #MP-ZIF40 #MP-ZIF18/28 #MP-PLCC44 by d 's te er r IF po mm in s. L p a t 8 r X 14

rp5c15

Abstract: Time Clock
Contextual Info: Click here for details. REAL TIME CLOCK ICs PARALLEL INTERFACE TYPE [PART No.] [PACKAGE] REAL-TIME CLOCK WITH INTERNAL RAM RP5C01A RF5C01A • 18pin DIP • 18pin SOP RP/RF/RJ5C15 REAL-TIME CLOCK RP5C15 RF5C15 RJ5C15 • 18pin DIP • 18pin SOP • 28pin PLCC

G1438

Abstract: TSSOP28
Contextual Info: G1438 Global Mixed-mode Technology Inc. 2W Stereo Audio Amplifier with DC Volume Control and Selectable Gain Features General Description „ The G1438 is a stereo audio power amplifier in both 28pin TSSOP and TQFN thermal pad package. It can deliver 2.0W continuous RMS power into 4Ω load per

vd136

Contextual Info: GMM773211OCNS/SG-6/7 LG Semicon Co.,Ltd. 2,097,152 W O R D S x 72 BIT CMOS DYNAMIC RAM MODULE Description Features T he G M M 7 7 3 2 11OCNS/SG is an 2M x 72 bits EDO D ynam ic RAM M O D U LE w hich is assem bled 9 pieces o f 2M x 8bit EDO D RA M s in 28pin SO I package, one 20bit

Contextual Info: 28PIN PLASTIC TSOP II (400 mil) 28 15 detail of lead end F E 1 14 A D M C P M S N S B K L G I J H NOTE 1. Controlling dimension millimeter. 2. Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

MD400-1A

Abstract: 20pin 28PIN MD400
Contextual Info: Unit : mm 7.5 13.5 12.5 7.0 17.9 MD400-1A, MD400-2A Length : 500 ± 2.0 Thickness : 0.5 +0.2 −0.1 ± Tolerance : 0.4 Material : Plastic with antistatic finish Applied Package Quantity (pcs) 20pin plastic DIP 17 22pin plastic DIP/ceramic DIP 17 28pin plastic DIP

28P4Y

Abstract: DIP28-P-300-2
Contextual Info: 28P4Y Plastic 28pin 300mil DIP 15 1 14 c 28 e1 JEDEC Code – Lead Material Alloy 42 E EIAJ Package Code DIP28-P-300-2.54 Weight g 1.93 Symbol L A1 A A2 D SEATING PLANE e b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 4.75

MO-047-AB

Abstract: QFJ28-P-S450-1
Contextual Info: 28P0 Plastic 28pin QFJ EIAJ Package Code QFJ28-P-S450-1.27 Weight g 1.0 Lead Material Alloy 42 e1 D e JEDEC Code MO-047AB HD D 28 e1 E 1 26 b2 4 L 25 5 e1 E E Recommended Mount Pad Symbol 19 11 12 18 A1 b1 A c HE I1 I2 b e e1 D y A A1 b b1 c D E e e1D e1E

Contextual Info: 28P3Y-M Plastic 28pin 400mil TSOP EIAJ Package Code TSOPII 28/24-P-400-1.27 Weight(g) 0.45 JEDEC Code – Lead Material Alloy 42 e b2 6 9 14 E Recommended Mount Pad Symbol 23 28 20 A 15 D L c L1 HE ME 1 I2 F e b y A2 Detail F A1 A A1 A2 b c D E e HE L

SOJ28-P-400-1

Contextual Info: 28P0N-A Plastic 28pin 400mil SOJ LOC EIAJ Package Code SOJ28-P-400-1.27 JEDEC Code – Weight(g) Lead Material Alloy 42 e D c 28 e1 HE E e1 I1 I2 15 Recommended Mount Pad Symbol 1 14 L A A1 b1 e b2 y b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 I1 I2 Dimension in Millimeters