pw-2n
Abstract: pw2n PS331 TMS 3748 LC723748 LC723732 LC723740 LC723756 LC723764 QIP100E
Text: 注文コード No. N 5 9 3 1 A LC723732, 723740, 723748, 723756, 723764 N5931A 22003 半導体ニューズ No. ※ 5931 とさしかえてください。 LC723732, 723740 LC723748, 723756 LC723764 CMOS LSI ETR コントローラ LC723700 シリーズは命令実行時間 1.33µs を達成し、最大プログラム ROM 容量 64K バイト , RAM2K バイトま
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LC723732,
N5931A
LC723748,
LC723764
LC723700
BANK00
LC723732-ROM
LC723740-ROM
LC723748-ROM
pw-2n
pw2n
PS331
TMS 3748
LC723748
LC723732
LC723740
LC723756
LC723764
QIP100E
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A934
Abstract: No abstract text available
Text: ^EDI EDI9F3420C ELECTRONIC DESIGNS INC.- Combination SRAM/FLASH/EEPROM Module Pin Configuration and Block Diagram Mixed Technology Memory Module 28Kx16 SRAM, 28Kx16 Flash and 32Kx16 EEPROM A0-A16 vss vcc Features Mixed Technology Memory Module with !28Kx16 bit CMOS SRAM,
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EDI9F3420C
128Kx16
32Kx16
120ns
150ns
EDI9F3420C
A934
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Untitled
Abstract: No abstract text available
Text: A fS í *' î c DPMÍ D P Z 1 M W 1 6 A 3 a^nseHPac^Microsyítems, Inc. 0 _1 MEC X 16 FLASH EEPROM DENSE-STACK MODULE PRELIMINARY D E SC R IP T IO N : The DPZ1MW16A3 "DENSE-STACK" module is a revolutionary new memory subsystem using DensePac Microsystems' ceramic Stackable Leadless Chip
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DPZ1MW16A3
DPZ1MW16A3
200ns
250ns
30A067-00
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Untitled
Abstract: No abstract text available
Text: DPE6434 64K X 32 CMOS EEPROM MODULE DESCRIPTION: The DPE6434 is a high-performance Electrically Erasable and Programmable Read O nly M emory EEPRO M module and may be organized as 64K X 32, 128K X 16 or 256K X 8. The module is built with eight low-power C M O S 32K X 8
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DPE6434
DPE6434
PE6434
16-bit
32-bit
E6434
64-BW
500mV
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Untitled
Abstract: No abstract text available
Text: rrrinO^ DPS128X16AA3 • - T . P V * DenserPac M icro systems, Inc., 0 H IC H SPEED C ERA M IC 128K X 16 C M O S SRAM M O D U LE D ESCRIPTIO N : The DPS128X16AA3 "DENSE-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems'
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P181A3
DPS128X16AA3
DPS128X16AA3
30A045-21
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ERL+35 BN3
Abstract: No abstract text available
Text: DENSE-PAC 2 Megabit High Speed CMOS SRAM DPS128X16Cn3/DPS128X16Bn3 MICROSYSTEMS DESCRIPTION: The DPS128X16Cn3/DPS128X16Bn3 High Speed SRAM "STACK” modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .
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DPS128X16Cn3/DPS128X16Bn3
DPS128X16Cn3/DPS128X16Bn3
50-pin
6Cn3/DPS128X1
ERL+35 BN3
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48-PIN
Abstract: No abstract text available
Text: REFERENCE SIZE SRAM 1 M egabit PART NUMBER 3 M egabit SPEED ns PACKAGE 128Kx8 7 0 ", 85, 100, 120, 150 32-Pin D IP 32-Pin F LA T P A C 15 128Kx8, 64Kx16, 32Kx32 25, 35, 45, 55, 70 66-Pin P G A 23 2 0 *, 25, 30, 35, 45 48-Pin SLC C 48-Pin ° r Lead 48-Pin y Lead
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PS128M
PS3232V
DPS128X16CJ3/BJ3
PS128X16CH
DPS128X16Y3
PS128X16H
PS128X24BH
PS512S8BN
PS512S8N
48-PIN
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