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Catalog Datasheet	MFG & Type	PDF	Document Tags
DPS512X8MKN3 Abstract: No abstract text available Text: DENSE-PAC 4 Megabit High Speed CM OS SRAM DPS512X8MKN3 MICROSYSTEMS PRELIMINARY DESC R IPTIO N : The DPS512X8MKN3 High Speed SRAM "STACK" devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired	OCR Scan	PDF	DPS512X8MKN3 DPS512X8MKN3 600-mil-wide, 32-pin 500mV 30a129-11 27SRM1S

Catalog Datasheet

MFG & Type

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DPS512X8MKN3

Abstract: No abstract text available
Text: DENSE-PAC 4 Megabit High Speed CM OS SRAM DPS512X8MKN3 MICROSYSTEMS PRELIMINARY DESC R IPTIO N : The DPS512X8MKN3 High Speed SRAM "STACK" devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired

OCR Scan

PDF

DPS512X8MKN3 DPS512X8MKN3 600-mil-wide, 32-pin 500mV 30a129-11 27SRM1S