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    24081 Search Results

    24081 Result Highlights (6)

    Part ECAD Model Manufacturer Description Download Buy
    54242-408101800LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    54122-408161800LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch Visit Amphenol Communications Solutions
    54122-408180800LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 18 position, 2.54mm (0.100in) pitch Visit Amphenol Communications Solutions
    10137924-0812LF Amphenol Communications Solutions Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and Hold Down Header, Tin plating, Black Color, 8 Positions, Non GW Compatible LCP. Visit Amphenol Communications Solutions
    10137924-0811LF Amphenol Communications Solutions Minitek® Pwr 3.0, Dual Row, Right Angle SMT Tails and Hold Down Header, Tin plating, Black Color, 8 Positions, GW Compatible LCP. Visit Amphenol Communications Solutions
    10122237-240812FLF Amphenol Communications Solutions HPCE-STD STRADDLE MOUNT 32P12S Visit Amphenol Communications Solutions
    SF Impression Pixel

    24081 Price and Stock

    Aker Technology Company Ltd C16-54.240-8-1530-X-R

    CRYSTAL 54.2400MHZ 8PF SMD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey C16-54.240-8-1530-X-R Reel 200 25
    • 1 -
    • 10 -
    • 100 $0.6
    • 1000 $0.38
    • 10000 $0.38
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    3M Interconnect 8124/08 100

    CBL RIBN 8COND 0.1 GRAY FOOT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 8124/08 100 180 1
    • 1 $4.16
    • 10 $3.008
    • 100 $2.1669
    • 1000 $2.1669
    • 10000 $2.1669
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    8124/08 100 Bulk 13 1
    • 1 $69.52
    • 10 $50.155
    • 100 $36.1586
    • 1000 $36.1586
    • 10000 $36.1586
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    8124/08 100 Bulk 13 1
    • 1 $4.25
    • 10 $3.073
    • 100 $2.2134
    • 1000 $2.2134
    • 10000 $2.2134
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    8124/08 100 9 1
    • 1 $240.46
    • 10 $173.719
    • 100 $138.0612
    • 1000 $138.0612
    • 10000 $138.0612
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    8124/08 100 Bulk 7 1
    • 1 $15.59
    • 10 $11.252
    • 100 $8.124
    • 1000 $8.124
    • 10000 $8.124
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    Phoenix Contact 3240810

    CABLE TIE
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 3240810 Bulk 110 1
    • 1 $0.9
    • 10 $0.861
    • 100 $0.783
    • 1000 $0.63423
    • 10000 $0.59812
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    Mouser Electronics 3240810 121
    • 1 $0.9
    • 10 $0.861
    • 100 $0.72
    • 1000 $0.634
    • 10000 $0.598
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    Master Electronics 3240810
    • 1 -
    • 10 -
    • 100 $0.873
    • 1000 $0.726
    • 10000 $0.617
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    Sager 3240810 100
    • 1 -
    • 10 -
    • 100 $0.8932
    • 1000 $0.794
    • 10000 $0.7656
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    Spartan Power BPC240815106

    BATT CHARGER DESKTOP 24V 8A
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey BPC240815106 Box 99 1
    • 1 $137.7
    • 10 $137.7
    • 100 $137.7
    • 1000 $137.7
    • 10000 $137.7
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    American Bright Optoelectronics AB-FF02408-19712-8A1-12S

    LED MOD AB-FF RGBW LNR STRIP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey AB-FF02408-19712-8A1-12S 24 1
    • 1 $16.99
    • 10 $12.814
    • 100 $10.7641
    • 1000 $9.33619
    • 10000 $9.33619
    		Buy Now
    Find more 24081 price and stock on Findchips.com

    24081 Datasheets (12)

    Part ECAD Model Manufacturer Description Curated Type PDF
    2408-1032-AL RAF Electronic Hardware HEX STANDOFFPLAIN ALUMINUM5/8 HE Original PDF
    2408-1032-B RAF Electronic Hardware HEX STANDOFFPLAIN BRASS5/8 HEX X Original PDF
    2408-1032-B-12 RAF Electronic Hardware HEX STANDOFFCLEAR ZINC5/8 HEX X Original PDF
    2408-1032-N RAF Electronic Hardware HEX STANDOFFNO FINISH - NYLON5/8 Original PDF
    2408-1032-S RAF Electronic Hardware HEX STANDOFFPLAIN STEEL5/8 HEX X Original PDF
    2408-1032-S-12 RAF Electronic Hardware HEX STANDOFFCLEAR ZINC5/8 HEX X Original PDF
    2408-1032-SS RAF Electronic Hardware HEX STANDOFFPLAIN STAINLESS STEE Original PDF
    2408-1224-AL RAF Electronic Hardware HEX STANDOFFPLAIN ALUMINUM5/8 HE Original PDF
    2408-1224-B RAF Electronic Hardware HEX STANDOFFPLAIN BRASS5/8 HEX X Original PDF
    2408-1224-N RAF Electronic Hardware HEX STANDOFFNO FINISH - NYLON5/8 Original PDF
    2408-1224-S RAF Electronic Hardware HEX STANDOFFPLAIN STEEL5/8 HEX X Original PDF
    2408-1224-SS RAF Electronic Hardware HEX STANDOFFPLAIN STAINLESS STEE Original PDF

    24081 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Athlon x4 640

    Abstract: amd bios AMD-760TM 24081 AMD athlon design guide amd athlon PIN LAYOUT AMD socket s1 athlon 64 layout Athlon 64 motherboard design guide BIOS example delay source code
    Text: Preliminary Information AMD-761 System Controller Software/BIOS Design Guide Publication # 24081 Rev: D Issue Date: February 2002 Preliminary Information 2001, 2002 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced


    Original     		PDF AMD-761TM 0x1x0x40 24bit 0000000h 24081D--February Athlon x4 640 amd bios AMD-760TM 24081 AMD athlon design guide amd athlon PIN LAYOUT AMD socket s1 athlon 64 layout Athlon 64 motherboard design guide BIOS example delay source code

    merlin gerin C60n

    Abstract: merlin gerin C60n 24338 Merlin Gerin 24403 merlin gerin C60n - 24338 merlin gerin C60n 24067 24335 C60N Merlin C60N 24406 merlin gerin 24334 24332
    Text: 6000 МЭК 898 10 кA МЭК 947.2 ГОСТ P 50345-99 C60N Автоматические выключатели Кpивые B, C и D Кол-во полюсов 1 2 3 4 Merlin Gerin Кол-во модулей Ш = 9 мм 2 4 6 8 Ном. ток A 0,5 1 2


    Original     		PDF

    240817

    Abstract: SURFACE MOUNT TECHNOLOGY
    Text: 7 Surface Mount Technology SMT 7.1 Introduction Traditional through-hole methods of assembling conventional electronic assemblies reached their limits in terms of improvements in cost, weight, volume, and reliability at approximately 68L. SMT allows production of more reliable assemblies at increased board density, reduced weight,


    Original     		PDF

    D-31675

    Abstract: 80C166 HERION C166
    Text: Development Support Microcontrollers 16 Bit Topic: All Subjects These lists do not claim for completeness and may contain typing mistakes. If You need urther information call the Mailbox: +49 89 498431 Page 1 # 2 25.07.1996 Hardware C166 family Topic: All Subjects


    Original     		PDF microSys166 80C166; mini166, D-66119 EUROS-166 C167CW-Evaluationboard, D-31675 80C166 C166-Compiler, 80C166-Board HERION C166

    sensor 40af

    Abstract: liquid float level sensor VERSAPLAST wiring diagram for float switch ls700
    Text: INTRODUCTION Float Type Level Switches Contents Single Point Small Size GEMS Level Switches operate on a direct, simple principle. In most models, a float encircling a stationary stem is equipped PERMANENT with powerful, permanent magnets. As MAGNET the float rises or lowers with liquid level,


    Original     		PDF monitor30 DT04-3P sensor 40af liquid float level sensor VERSAPLAST wiring diagram for float switch ls700

    merlin gerin NS100N

    Abstract: merlin gerin catalogue Merlin Gerin shunt trip mx merlin gerin C60 multi 9 Merlin Gerin ns160n merlin gerin C60n Merlin Gerin CIRCUIT BREAKER merlin gerin NS250h C60H Circuit Breakers Catalogue merlin gerin C60n - 24338
    Text: Catalogue 2004 Merlin Gerin Miniature circuit-breakers and earth leakage circuit-breakers MCBs/ELCBs contents page Miniature circuit-breakers RCCB / ELCB Technical information Mini pragma din kit Merlin Gerin C60a 2 C60N 3 C60H 4 C60N UL489 - DC circuit breaker


    Original     		PDF C120N C120H NC100L NC100LH NC100 UL489 SEIMC60C04 merlin gerin NS100N merlin gerin catalogue Merlin Gerin shunt trip mx merlin gerin C60 multi 9 Merlin Gerin ns160n merlin gerin C60n Merlin Gerin CIRCUIT BREAKER merlin gerin NS250h C60H Circuit Breakers Catalogue merlin gerin C60n - 24338

    C60N

    Abstract: C60N 24396 C60N c C60n Circuit Breakers Catalogue c60n tripping curves IEC60898 C60N 24334 vigi C60N C60N 3P 24334
    Text: Protect Circuit protection C60N circuit breakers B, C and D curves IEC 60898: 6000 A , IEC 60947-2: 10 kA Function b The circuit-breakers combine the following functions: v protection of circuits against short-circuit currents v protection of circuits against overload currents


    Original     		PDF 90078E C60N C60N 24396 C60N c C60n Circuit Breakers Catalogue c60n tripping curves IEC60898 C60N 24334 vigi C60N C60N 3P 24334

    ASPC2

    Abstract: PEP Modular Computers GmbH EN50170 hilscher PEP Modular Computers profibus connector siemens siemens profibus Turbo186 System On Chip P1386
    Text: PMC253 Advanced PROFIBUS Controller for Fieldbus Applications Introduction ➤ 32-bit PMC module ➤ Highly integrated EC-1 ASIC with Siemens ASPC2 Profibus technology ➤ PROFIBUS DP V1 Master class 1 and 2 or Slave ➤ Standard interface with 9-pin D-Sub connector


    Original     		PDF PMC253 32-bit PMC253 EN50170 D-87600 DS-02/2002 ASPC2 PEP Modular Computers GmbH hilscher PEP Modular Computers profibus connector siemens siemens profibus Turbo186 System On Chip P1386

    SKIIP 33 nec 125 t2

    Abstract: skiip 613 gb 123 ct RBS 6302 ericsson SKIIP 513 gb 173 ct THERMISTOR ml TDK 150M pioneer PAL 010a Project Report of smoke alarm using IC 555 doc SKiip 83 EC 125 T1 ericsson RBS 6000 series INSTALLATION MANUAL Ericsson Installation guide for RBS 6302
    Text: Discontinued and Superseded Stock Number History. This document contains Discontinued and Superseded Stock Number History. The information is listed in the following format: Stock Number: The original RS Stock Number of the item. Brief Description: The Invoice Description of the item.


    Original     		PDF 734TL UWEB-MODEM-34 HCS412/WM TLV320AIC10IPFB 100MB NEON250 GA-60XM7E BLK32X40 BLK32X42 SKIIP 33 nec 125 t2 skiip 613 gb 123 ct RBS 6302 ericsson SKIIP 513 gb 173 ct THERMISTOR ml TDK 150M pioneer PAL 010a Project Report of smoke alarm using IC 555 doc SKiip 83 EC 125 T1 ericsson RBS 6000 series INSTALLATION MANUAL Ericsson Installation guide for RBS 6302

    Ablebond 71-1

    Abstract: Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board
    Text: CHAPTER 4 PERFORMANCE CHARACTERISTICS OF IC PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTICS The following parameters are provided for Intel packages  DC resistance R of leads or pins  Capacitance (C) including lead-to-lead and loading capacitances  Inductance (L) including only self-inductance values for pins traces and wires (PGA) or


    Original     		PDF 93-WA-EEP-6 91-WA-EEP-27 91-WA-EEP-31 pp1059-1070 pp357-366 Ablebond 71-1 Nitto bimetal ABLEBONd 84-1 FR4 epoxy dielectric constant 4.4 thermal analysis on pcb tungsten slug glass diode Ablebond 71 IC Packages cpu fan pin data circuit in mother board

    intel packaging

    Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
    Text: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than


    Original     		PDF CH01WIP intel packaging CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays

    AMD Athlon II X4

    Abstract: gigabyte motherboard circuit diagram Northbridge AC494 AMD K5
    Text: Preliminary Information AMD-761 System Controller TM Data Sheet Publication # 24088 Rev: A-1 Issue Date: February 2001 Preliminary Information 2001 Advanced Micro Devices, Inc. All rights reserved. The contents of this document are provided in connection with Advanced


    Original     		PDF AMD-761 80x86 AMD-761TM 4088A-1--February AMD Athlon II X4 gigabyte motherboard circuit diagram Northbridge AC494 AMD K5

    krone TELEPHONE TAG BLOCK

    Abstract: krone telephone tag box Krone Terminal Block Elettro GiBi ctb1201 CTB1301 krone telephone connector krone telephone cable Tag Block Krone PA66
    Text: 02 Conns - terminal blocks pp53-68 24/11/05 9:58 am Page 53 2 2/3 tier 3.5/3.81mm PCB 45 degree PCB 5mm PCB 5.08mm PCB 7.5/7.62mm PCB IDC Fused Pluggable Screwless PCB Shrouded pluggable Terminal strips 59 54 58 54 57 58 54 64 59 59 65 65 02 Conns - terminal blocks pp53-68


    Original     		PDF pp53-68 krone TELEPHONE TAG BLOCK krone telephone tag box Krone Terminal Block Elettro GiBi ctb1201 CTB1301 krone telephone connector krone telephone cable Tag Block Krone PA66

    solid solubility

    Abstract: chemical control process block diagram
    Text: Component Assembly Technology 3.1 3 Introduction The packaging technologies used to manufacture or assemble Intel’s three basic types of component packages are summarized in this chapter. The package families, described in Chapter 1, provide the functional specialization and diversity


    Original     		PDF

    gold metal detectors

    Abstract: soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008
    Text: 2 3 Component Assembly Technology 1/22/97 9:49 AM CH03WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 3 COMPONENT ASSEMBLY TECHNOLOGY 3.1. INTRODUCTION The packaging technologies used to manufacture or assemble Intel’s three basic types of


    Original     		PDF CH03WIP gold metal detectors soft solder die bonding schematic diagram intel atom INCOMING RAW MATERIAL INSPECTION lead side brazed hermetic X-RAY INSPECTION ausi die attach electrical three phase schematic riser DIAGRAM epoxy adhesive paste cte table intel 24008

    Side Brazed Ceramic Dual-In-Line Packages

    Abstract: intel packaging databook Side Brazed Ceramic Dual-In-Line Packages 28 outline of the heat slug for JEDEC 64 CERAMIC LEADLESS CHIP CARRIER LCC 68 pin plcc socket view bottom BGA and QFP Package BGA package tray 64 tray tsop 1220 gate count
    Text: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than nineteen million transistors, and device count is expected to increase to 100 million by the year


    Original     		PDF

    diode E1110

    Abstract: lN4002 LN4003 ANA 618 20010 TDB 0123 km b3170 E1110 Diode UB8560D MAA723 moc 2030
    Text: elektronik-bauelem ente I WT VD AVL 1 /8 7 Bl. 2 E r l ä u t e r u n g e n z u m I n h a l t und zu d e n A n g a b e n d e r B a u e l e m e n t e - V e r g l e i c h s l i s t e D ie B a u e l e m e n t e - V e r g l e i c h s l i s t e e n t h ä l t a l l e in d e r B i l a n z v e r a n t w o r t u n g d e s V E B K o m b i n a t


    OCR Scan     		PDF

    inverseur

    Abstract: sf.f 24050 SSi mos
    Text: lil TO 116 CB-2 Complementary MOS — Gates and schmidt triggers SSI - sst M O S c o m p lé m e n ta ire s — O p éra te u rs e t triggers de S c h m id t D e s c rip tio n D e s c rip tio n Packageü B o îtie rs Type T ype T y p ic a l p ro p a g a tio n


    OCR Scan     		PDF O-116 CB-79 inverseur sf.f 24050 SSi mos

    N82593SX

    Abstract: Aromat relay i386SL Intel 82593 Intel 82593 1991 N82593 intel i3 MOTHERBOARD pcb CIRCUIT diagram 82360SL TTL 82593 s593 crystal
    Text: in tel A P ' 3 6 7 APPLICATION NOTE 8 2 5 9 3 CSMA/CD Core LAN Controller Designing Network Ready Notebook Computers Using the 82593 Ethernet* Controller RAYMOND SIT TECHNICAL MARKETING ENGINEER ’ E th e r n e t is a r e g is te r e d tr a d e m a r k o f X e r o x Cc rp o ra tio n .


    OCR Scan     		PDF 386SL N82593SX Aromat relay i386SL Intel 82593 Intel 82593 1991 N82593 intel i3 MOTHERBOARD pcb CIRCUIT diagram 82360SL TTL 82593 s593 crystal

    82360sl

    Abstract: CT674 sd4093 ca10 switch a007 LT1667 socket lga 1156 pinout 451 80 N02 LT1651 LT1665 u1620
    Text: in te i lntel386 SL MICROPROCESSOR SuperSet Highly-Integrated Static Intel386™ SL Microprocessor Complete ISA Peripheral Subsystem System-Wide Power Management — H ig h -S p ee d P erip h eral In te rfa c e Bus P l-B u s S u p p o rt — N e w id e a P o rt In te rfa c e fo r H a rd w a re


    OCR Scan     		PDF lntel386â Intel386â lntel386TM Intel386 IOCS16* MEMCS16* Ct409 Ct227 82360sl CT674 sd4093 ca10 switch a007 LT1667 socket lga 1156 pinout 451 80 N02 LT1651 LT1665 u1620

    82360SL

    Abstract: CD 2399 GP
    Text: 0 M [F § Ä Ä ? 0 M in te i Intel386 SL MICROPROCESSOR SuperSet Highly-Integrated Static Intel386™ SL Microprocessor Complete ISA Peripheral Subsystem System-Wide Power Management Static lntel386TM SL CPU — Runs MS-DOS*, W IN D O W S’ , O S /2 *


    OCR Scan     		PDF Intel386â lntel386TM Intel386 IOCS16# MEMCS16# Ct409 Ct227 82360SL CD 2399 GP

    DSA20T

    Abstract: DSA20TB DSA20TC DSA20TE DSA20TG DSA20TJ DSA20TL
    Text: Ordering number :EN2408 _ D S A 2 0 T No.2408 Diffused Junction Type Silicon Diode 2.0A Power Rectifier Junction Tem perature Storage T em perature II P eak Reverse Voltage V rm Average Rectified C urrent Io Surge Forward C urrent Ifsm rfsoo o a t Ta - 25°C


    OCR Scan     		PDF EN2408 DSA20T DSA20TB DSA20TC DSA20TE 50Hzsine DSA20TG DSA20TJ DSA20TL DSA20T

    LT1667

    Abstract: LT1665 CA10 A058 dk 300 a008 82360SL LCD CMC 116 L01 2164 intel INTEL 82360 CD 2399 GP A049 crystal
    Text: 5bE ]> • 4ÔSbl7S D i n o S M E34 « I T L 1 up/prpHLS irrte* Intel386 CORP SL MICROPROCESSOR SuperSet INTEL 'T~-(4c\ 1 7 -3 ^ Highly-Integrated Static Intel386™ SL Microprocessor Complete ISA Peripheral Subsystem System-Wide Power Management Static lntel386TM SL CPU


    OCR Scan     		PDF Intel386TMCORP Intel386TM lntel386TM Intel386 IOCS16# MEMCS16# Ctg27 LT1667 LT1665 CA10 A058 dk 300 a008 82360SL LCD CMC 116 L01 2164 intel INTEL 82360 CD 2399 GP A049 crystal

    21040-07

    Abstract: 21040-AC Scans-0025707
    Text: in t e l. 21040 4M 4,194,304 x 1 BIT DYNAMfC RAM WITH FAST PAGE MODE • Performance Range Symbol Parameters tRAC Access Time from RAS *CAC *RC 21040-07 21040-08 70 80 Access Time from CAâ 20 25 ns Read Cycle Time 130 150 ns . ■ Fast Page Mode Operation


    OCR Scan     		PDF Cycles/16mS 20-LEAP 21040-07 21040-AC Scans-0025707