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    225FAC Price and Stock

    Vishay Intertechnologies VR68000004225FAC00

    Resistor High Voltage Metal Glaze 42.2M Ohm 1% 1W ±200ppm/K Ceramic Axial T/R - Ammo Pack (Alt: VR68000004225FAC00)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas VR68000004225FAC00 Ammo Pack 24 Weeks 500
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    Mouser Electronics VR68000004225FAC00
    • 1 $1.37
    • 10 $1.22
    • 100 $0.887
    • 1000 $0.524
    • 10000 $0.491
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    The Bergquist Company HF225FAC-0.004-AC-0404

    Hi-Flow 225F-Ac .004 4"x4" Sheet; Insulator Body Material:-; Thermal Conductivity:1W/M.k; Breakdown Voltage Vbr:-; Thickness:0.102Mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:-; Product Range:-; Svhc:No Svhc Rohs Compliant: Yes |Bergquist HF225FAC-0.004-AC-0404
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    Newark HF225FAC-0.004-AC-0404 Bulk 1
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    225FAC Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 2 Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E SPDG_Cover_0511 v7.qxp 6/22/2011 12:25 PM Page 3 June 2011 All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Hi-Flow 225F-AC Reinforced,Phase Change Thermal Interface Material Features and Benefits T YPICAL PROPERT IES OF H I-FLOW 225F-AC PROPERTY Color • Thermal impedance: 0.10°C-in 2/W @25 psi • Can be manually or automatically applied to the surfaces of room-temperature


    Original     		PDF 225F-AC D3418

    TRANSISTOR REPLACEMENT GUIDE d882

    Abstract: transistor D1876 TRANSISTOR D412 7403-09FR d1876 transistor SIL-PAD 2000 density transistors D1876 SIL-PAD 3223 Sil Pad A2000 0.015 TR-NWT-000930
    Text: Thermally Conductive Interface Materials for Cooling Electronic Assemblies Sil-Pad S E L E C T I O N G U I D E All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES,


    Original     		PDF

    ASTM D374

    Abstract: D374 ASTM D5470
    Text: Hi-Flow 225F-AC Reinforced, Phase Change Thermal Interface Material Features and Benefits • Thermal impedance: 0.10°C-in2/W @25 psi • Can be manually or automatically applied to the surfaces of room-temperature heat sinks • Foil reinforced, adhesive-coated


    Original     		PDF 225F-AC 225FAC ASTM D374 D374 ASTM D5470