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    Untitled

    Abstract: No abstract text available
    Text: HRB0502A Silicon Schottky Barrier Diode for Rectifying REJ03G0047-0200Z Rev.2.00 Sep.01.2003 Features • Low forward voltage drop and suitable for high efficiency rectifying. • CMPAK Package is suitable for high density surface mounting and high speed assembly.


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    PDF HRB0502A REJ03G0047-0200Z

    Untitled

    Abstract: No abstract text available
    Text: HRW0702A Silicon Schottky Barrier Diode for Rectifying REJ03G0159-0600Z Previous: ADE-208-109E Rev.6.00 Jan.06.2004 Features • Low forward voltage drop and suitable for high efficiency rectifying. • MPAK Package is suitable for high density surface mounting and high speed assembly.


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    PDF HRW0702A REJ03G0159-0600Z ADE-208-109E)

    HZC10

    Abstract: HZC11 HZC12 HZC13 HZC15 HZC16 HZC18 HZC20 HZC22 HZC24
    Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


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    PDF D-85622 D-85619 HZC10 HZC11 HZC12 HZC13 HZC15 HZC16 HZC18 HZC20 HZC22 HZC24

    HRU0103A

    Abstract: No abstract text available
    Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


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    PDF

    HRW0202A

    Abstract: SC-59A
    Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


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    HRC0203B

    Abstract: DSA003644
    Text: HRC0203B Silicon Schottky Barrier Diode for Rectifying ADE-208-800 Z Rev. 0 Jun. 1999 Features • Low forward voltage drop and suitable for high effifiency rectifying. • Ultra small Flat Package (UFP) is suitable for surface mount design. Ordering Information


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    PDF HRC0203B ADE-208-800 HRC0203B DSA003644

    HRC0103A

    Abstract: DSA003643
    Text: HRC0103A Silicon Schottky Barrier Diode for Rectifying ADE-208-624 Z Rev. 0 May. 1998 Features • Low forward voltage drop and suitable for high effifiency rectifying. • Ultra small Flat Package (UFP) is suitable for surface mount design. Ordering Information


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    PDF HRC0103A ADE-208-624 HRC0103A DSA003643

    HRB0103A

    Abstract: DSA003642
    Text: HRB0103A Silicon Schottky Barrier Diode for Low Voltage High Speed Switching , Rectifying ADE-208-490 Z Rev 0 Apr. 1997 Features • Low forward voltage drop and suitable for high effifiency forward current. • CMPAK package is suitable for high density surface mounting and high speed assembly.


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    PDF HRB0103A ADE-208-490 HRB0103A DSA003642

    HRU0203A

    Abstract: No abstract text available
    Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog


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    PDF

    hitachi S17

    Abstract: HRW0202A SC-59A DSA003641
    Text: HRW0202A Silicon Schottky Barrier Diode for Rectifying ADE-208-209E Z Rev. 5 Jul. 1998 Features • Low forward voltage drop and suitable for high effifiency rectifying. • MPAK Package is suitable for high density surface mounting and high speed assembly.


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    PDF HRW0202A ADE-208-209E hitachi S17 HRW0202A SC-59A DSA003641

    HRW0502A

    Abstract: SC-59A DSA003637
    Text: HRW0502A Silicon Schottky Barrier Diode for Rectifying ADE-208-108E Z Rev. 5 Oct. 1997 Features • Low forward voltage drop and suitable for high effifiency rectifying. • MPAK Package is suitable for high density surface mounting and high speed assembly.


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    PDF HRW0502A ADE-208-108E HRW0502A SC-59A DSA003637

    Hitachi DSA0045

    Abstract: SC-59A HRW0302A
    Text: HRW0302A Silicon Schottky Barrier Diode for Rectifying ADE-208-015G Z Rev 7 Jul. 1998 Features • Low forward voltage drop and suitable for high effifiency rectifying. • MPAK Package is suitable for high density surface mounting and high speed assembly.


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    PDF HRW0302A ADE-208-015G Hitachi DSA0045 SC-59A HRW0302A

    HRU0103A

    Abstract: Hitachi DSA0045
    Text: HRU0103A Silicon Schottky Barrier Diode for Rectifying ADE-208-450A Z Rev 1 Oct. 1997 Features • Low forward voltage drop and suitable for high effifiency rectifying. • Ultra small Resin Package (URP) is suitable for high density surface mounting and high speed


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    PDF HRU0103A ADE-208-450A HRU0103A Hitachi DSA0045

    HRC0203C

    Abstract: No abstract text available
    Text: HRC0203C Silicon Schottky Barrier Diode for Rectifying REJ03G0619-0300 Previous: ADE-208-1518B Rev.3.00 May 20, 2005 Features • Low forward voltage drop and suitable for high efficiency rectifying. • Ultra small Flat Lead Package (UFP) is suitable for surface mount design.


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    PDF HRC0203C REJ03G0619-0300 ADE-208-1518B) PWSF0002ZA-A rect5-900 Unit2607 HRC0203C

    Hitachi DSA00359

    Abstract: No abstract text available
    Text: HZM4.3FA Silicon Epitaxial Planar Zener Diode for Surge Absorb ADE-208-468 Z Rev 0 Features • HZM4.3FA has four devices, and can absorb external + and -surge. • MPAK-5 Package is suitable for high density surface mounting and high speed assembly. Ordering Information


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    PDF ADE-208-468 Hitachi DSA00359

    DSA00285350

    Abstract: HRL0103C HRL0103C-N hrl0103
    Text: HRL0103C Silicon Schottky Barrier Diode for Rectifying REJ03G0367-0200 Rev.2.00 Mar 05, 2007 Features • Low reverse voltage drop and suitable for high efficiency reverse current. • Lineup of environmental friendly Halogen free type HRL0103C-N • Extremely small Flat Lead Package (EFP) is suitable for surface mount design.


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    PDF HRL0103C REJ03G0367-0200 HRL0103C-N) HRL0103C-N PXSF0002ZA-A REJ03G0367-0200 DSA00285350 HRL0103C HRL0103C-N hrl0103

    Untitled

    Abstract: No abstract text available
    Text: HRC0203C Silicon Schottky Barrier Diode for Rectifying REJ03G0619-0300 Previous: ADE-208-1518B Rev.3.00 May 20, 2005 Features • Low forward voltage drop and suitable for high efficiency rectifying. • Ultra small Flat Lead Package (UFP) is suitable for surface mount design.


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    PDF HRC0203C REJ03G0619-0300 ADE-208-1518B) PWSF0002ZA-A

    Untitled

    Abstract: No abstract text available
    Text: HRC0201A Silicon Schottky Barrier Diode for Rectifying REJ03G0618-0200 Rev.2.00 Jan 09, 2009 Features • Low forward voltage drop and suitable for high efficiency rectifying. • Ultra small Flat Lead Package UFP is suitable for compact and high-density surface mount design.


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    PDF HRC0201A REJ03G0618-0200 HRC0201ATRF PWSF0002ZA-A REJ03G0618-0200

    ADE-208-016C

    Abstract: Hitachi DSA002789
    Text: HRW0503A Silicon Schottky Barrier Diode for Rectifying ADE-208-016C Z Rev 3 Features • Low forward voltage drop and suitable for high effifiency rectifying. • MPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information


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    PDF HRW0503A ADE-208-016C HRW0503A SC-59A ADE-208-016C Hitachi DSA002789

    Hitachi DSA002748

    Abstract: No abstract text available
    Text: HRU0302A Silicon Schottky Barrier Diode for Rectifying ADE-208-235G Z Rev 7 Jul. 1998 Features • Low forward voltage drop and suitable for high effifiency rectifying. • Ultra small Resin Package (URP) is suitablefor high density surface mounting and high speed


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    PDF HRU0302A ADE-208-235G HRU0302A Hitachi DSA002748

    HRL0103C

    Abstract: hrl0103
    Text: HRL0103C Silicon Schottky Barrier Diode for Rectifying REJ03G0367-0100 Rev.1.00 Aug 19, 2004 Features • Low reverse voltage drop and suitable for high efficiency reverse current. • Extremely small Flat Package EFP is suitable for surface mount design.


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    PDF HRL0103C REJ03G0367-0100 HRL0103C hrl0103

    HRC0103A

    Abstract: No abstract text available
    Text: HRC0103A Silicon Schottky Barrier Diode for Rectifying REJ03G0146-0100Z Previous: ADE-208-624 Rev.1.00 Nov.26.2003 Features • Low forward voltage drop and suitable for high efficiency rectifying. • Ultra small Flat Package (UFP) is suitable for surface mount design.


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    PDF HRC0103A REJ03G0146-0100Z ADE-208-624) HRC0103A

    HRC0203B

    Abstract: No abstract text available
    Text: HRC0203B Silicon Schottky Barrier Diode for Rectifying REJ03G0148-0100Z Previous: ADE-208-800 Rev.1.00 Nov.26.2003 Features • Low forward voltage drop and suitable for high efficiency rectifying. • Ultra small Flat Package (UFP) is suitable for surface mount design.


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    PDF HRC0203B REJ03G0148-0100Z ADE-208-800) HRC0203B

    Untitled

    Abstract: No abstract text available
    Text: HZM4.3FA Silicon Epitaxial Planar Zener Diode for Surge Absorb ADE-208-468 Z Rev 0 Features • • HZM4.3FA has four devices, and can absorb external + and -surge. MPAK-5 Package is suitable for high density surface mounting and high speed assembly. Ordering Information


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    PDF ADE-208-468 20hx15wx0