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201211A Abstract: IPC-6012B DESIGN RULE PCB skyworks solutions S1880 S1881 thermal pcb guidelines Text: APPLICATION NOTE PCB Design Guidelines for High Power Dissipation Packages Introduction This Application Note provides PCB design guidelines for high power dissipation packages that ensure adequate solder coverage and optimize heat transfer. As a general rule, high power	Original	PDF	01211A 201211A IPC-6012B DESIGN RULE PCB skyworks solutions S1880 S1881 thermal pcb guidelines

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PDF

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201211A

Abstract: IPC-6012B DESIGN RULE PCB skyworks solutions S1880 S1881 thermal pcb guidelines
Text: APPLICATION NOTE PCB Design Guidelines for High Power Dissipation Packages Introduction This Application Note provides PCB design guidelines for high power dissipation packages that ensure adequate solder coverage and optimize heat transfer. As a general rule, high power

Original

PDF

01211A 201211A IPC-6012B DESIGN RULE PCB skyworks solutions S1880 S1881 thermal pcb guidelines