1N4474
Abstract: 4661N 1N1492 1N44B 1N4460 1N4471 1N4479
Text: 1N 4460 thru 1N4496 and 1N6485 thru 1N6491 Microisemi Corp. $ The diQite SC O TTSD A LE , A Z ☆JANS* 1.5 WATT G LASS ZEN ER DIODES FEATURES • Microminiature package. • High perform ance characteristics. • Stable operation at temperatures to 200°C.
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1N4496
1N6485
1N6491
MIL-S-19500/406.
1N4460
1N4474
4661N
1N1492
1N44B
1N4471
1N4479
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1N4474
Abstract: 1N4475 2B25 1N4478 1N4460 1N4469 1N4467 1N4466
Text: 1 N 4 4 6 0 thru 1N 4496 and 1 N 6 4 8 5 thru 1N6491 Microsemi Corp. sco riM K iu :. a / s i \ / ! I \ i r,i ☆ ¡ANS* I or m o r e m in i m a im n v . iil' f 7 l4 i FEATURES • • • • • • • • 1.5 WATT GLASS ZENER DIODES M icrom iniature package.
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1N6491
IL-S-19500/406.
N6491
1N4474
1N4475
2B25
1N4478
1N4460
1N4469
1N4467
1N4466
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RCA SK CROSS-REFERENCE
Abstract: CD4003 2N2505 TF408 1N4465 250PA120 2N3017 pt 3570 trw rf pa189 Semicon volume 1
Text: 1969 o < 00 x ic e uo <r\ *—4 rO O CM u J 'r < o o o CO r aJ. rfrr.~> y -< z X— < P“ -J Sem iconductor Annual At .0008" Dia. . . . there is no second source phire orifice insert. Tempress also created and supplied the tungsten carbide ultrasonic bonding tool and pioneered
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TXD10K40
Abstract: TXD10K60 BT1690 BT808 1N5004 TXD10H60 mp8706 TXC10K40 BSTC1026 BT13G
Text: N AMER PHILIPS/DISCRETE 86 BSE D • X'Ql-oX bbS3131 QOlbSbH 4 ■ General Information CROSS REFERENCE GUIDE INDUSTRY PART NUMBER PG. NEAREST EQUIV. NO. 0105-50 0204-50 0510-25 12F5 12F5R BLU52 BLU52 BLV97 BYX99-300 BYX99-300R 12F10 12F10R 12F20 12F20R 12F40
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bbS3131
BLU52
1N321
BYW56
1N321A
BLV97
1N322
TXD10K40
TXD10K60
BT1690
BT808
1N5004
TXD10H60
mp8706
TXC10K40
BSTC1026
BT13G
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