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    ADLINK Technology Inc eUPG Carrier Board,170x170mm(mini-ITX)

    ADLINK Technology eUPG Carrier Board,170x170mm(mini-ITX)/Type6/1*INTEL I211/2*USB/1*PCIE/1*PCIEx4
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    Mouser Electronics eUPG Carrier Board,170x170mm(mini-ITX)
    • 1 $621.63
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    • 100 $621.63
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    170X170 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    HD965

    Abstract: 2SD965 transistor 2sd965
    Text: NPN 汕头华汕电子器件有限公司 SILICON TRANSISTOR 对应国外型号 2SD965 HD965 █ 芯片简介 █ 芯片图 芯片尺寸:4 英寸(100mm) 芯片代码:C089AJ-00-XXX 芯片厚度:240±20µm 管芯尺寸:890x890µm 2 焊位尺寸:B 极 230×230µm;E 极 170×170µm


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    PDF 2SD965 HD965 100mm C089AJ-00-XXX 10AIC HD965 2SD965 transistor 2sd965

    M/TNC-75

    Abstract: No abstract text available
    Text: Cobham Antenna Systems Microwave Antennas Specialist Antenna Design and Manufacture CATALOGUE 2012 The most important thing we build is trust DEFENCE SECURITY ANTENNAS ANTENNAS SATELLITE COMMUNICATION ANTENNAS COMMERCIAL ANTENNAS Cobham Antenna Systems Microwave Antennas - Newmarket


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    PDF Link16 M/TNC-75

    IRF540

    Abstract: IRF540CHIP IRF540 application
    Text: 30E D m 7 ^ 5 3 7 00303.35 S G S -T H O M S O N R • _ S G S-THOMSON IlL iM M » IRF540 CHIP N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR IN DIE FORM DIE SIZE: 170x170 mils METALLIZATION: Top Al Back A u/C r/N i/A u BACKSIDE THICKNESS: 6100 A DIE THICKNESS:


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    PDF IRF540 170x170 47x51 15x18 IRF540CHIP IRF540 application

    IRF540

    Abstract: IRF540CHIP
    Text: SGS-THOMSON itl ¥»HD S IRF540 CHIP N - CHANNEL ENHANCEMENT MODE POWER MOS TRANSISTOR IN DIE FORM DIE SIZE: 170x170 mils METALLIZATION: Top Al Back Au/C r/N i/A u BACKSIDE THICKNESS: 6100 A DIE THICKNESS: 16 ± 2 mils PASSIVATION: P-Vapox BONDING PAD SIZE:


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    PDF IRF540 170x170 15x18 MC-0075 IRF540CHIP

    MOSFET Termination Structure

    Abstract: No abstract text available
    Text: rz7 SGS-THOMSON ^ 7 Mm [ j ^ 0 [ K ] Q i [ L [ l © i r [ Ë ] W 0© S A P P L IC A T IO N N O T E HIGH DENSITY POWER MOSFETS Fig. 1 - SGS POWER MOSFET structure INTRODUCTION POWER MOSFET-transistor are fabricated using VLSI technology. A simple chip contains thousands


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    PDF STVHD90. STVHD90 MOSFET Termination Structure

    Untitled

    Abstract: No abstract text available
    Text: SSDI TRANSISTORS* - THE NPN TRANSISTORS CHIP TYPE INDUSTRY REFERENCE C AMPS hFE b v ceo (VOLTS) ^ 40-450 10-100(50mA,5V) IC’ VCE^ C6E 2N3738,9 0.5 C6T 2N5010-15 0.5 500-lK(CER) 30-180(25mA,10V) 2N5092,5,7 1.0 350-450 10-100(.2A,5V) SPT5502,3 1.0 70.0-800 (CER)


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    PDF 2N3738 2N5010-15 500-lK 2N5092 SPT5502 SPT6502 2N4300 2N5152 2N4150 2N3996-9

    sgs mosfet

    Abstract: buz11 application note FZJ 101
    Text: rZ J *> 7# . S C S -T H O M S O N l«BËl5i i [ L i e ï » H 0 g i APPLICATION NOTE HIGH DENSITY POWER MOSFETS Fig. 1 - SGS POWER MOSFET structure INTRODUCTION POWER MOSFET'transistor are fabricated using VLSI technology. A simple chip contains thousands


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    PDF STVHD90. STVHD90 sgs mosfet buz11 application note FZJ 101