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    153BGA

    Abstract: No abstract text available
    Text: 128K x 72 SSRAM Multi-Chip Package WEDPY128K72V-XBX Optimum Density and Performance in one Package WEDPY128K72V-XBX* • Designed as L2 Cache for the PowerPC 750 see page 2 for typical application block diagram • PACKAGE: 14x22mm, 153 Plastic Ball Grid Array (PBGA), 308mm2


    Original     		PDF WEDPY128K72V-XBX WEDPY128K72V-XBX* 750TM 14x22mm, 308mm2 616mm2 50MHz 153BGA

    Untitled

    Abstract: No abstract text available
    Text: 256K x 72 SSRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPY256K72V-XBX* • Designed as L2 Cache for advanced processors see other side for typical application block diagram Performance Features AR Y Fast clock speeds: 200, 166, 150, 133 and 100MHz


    Original     		PDF WEDPY256K72V-XBX* 100MHz WEDPY256K72V MIF2012

    Untitled

    Abstract: No abstract text available
    Text: 256K x 72 SSRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPY256K72V-XBX* • Designed as L2 Cache for advanced processors see other side for typical application block diagram Fast clock speeds: 200, 166, 150, 133 and 100MHz High performance 2-1-1-1 access rate


    Original     		PDF WEDPY256K72V-XBX* 100MHz 256KX72pkgdim WEDPY256K72V MIF2012

    WEDPY256K72V-XBX

    Abstract: No abstract text available
    Text: 256K x 72 SSRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPY256K72V-XBX* Designed as L2 Cache for advanced processors see other side for typical application block diagram Performance Features • Fast clock speeds: 200, 166, 150, 133 and 100MHz


    Original     		PDF WEDPY256K72V-XBX* 100MHz 200mm2 560mm2 308mm WEDPY256K72V MIF2012 WEDPY256K72V-XBX

    NEC VR4300

    Abstract: JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28
    Text: High Performance! Contents 目次 1. BGA とは？ ―――――――――――――― 3 2. NEC の BGA は？ ―――――――――――― 3 3. 特徴 ―――――――――――――――――― 4 4. パッケージ写真 ――――――――――――― 6


    Original     		PDF 208QFP 225BGA 20down 56down 225BGA C13550JJ1V0PF00 NEC VR4300 JIS-Z0202 EDR-7315 225PBGA HG7900 nec bga BGA313 QFP28

    GS78108A

    Abstract: GS78108AB GS78108AB-10 GS78108AB-10I GS78108AB-12 GS78108AB-12I GS78108AB-15I GS78108AB-8 GS78108AB-8I
    Text: GS78108AB 1M x 8 8Mb Asynchronous SRAM BGA Commercial Temp Industrial Temp Features • Fast access time: 8, 10, 12 ns • CMOS low power operation: 240/190/170 mA at minimum cycle time • Single 3.3 V ± 0.3 V power supply • All inputs and outputs are TTL-compatible


    Original     		PDF GS78108AB 119-bump, GS78108A GS78108AB-15I 119-Bump GS78108AB-12T GS78108AB GS78108AB-10 GS78108AB-10I GS78108AB-12 GS78108AB-12I GS78108AB-15I GS78108AB-8 GS78108AB-8I

    GS78108AGB-10

    Abstract: GS78108AGB-8 78108A GS78108A GS78108AB GS78108AB-10 GS78108AB-10I GS78108AB-12 GS78108AB-12I GS78108AB-15I
    Text: GS78108AB 1M x 8 8Mb Asynchronous SRAM BGA Commercial Temp Industrial Temp Features 8, 10, 12 ns 3.3 V VDD Symbol Pin Descriptions Description A0 to A19 Address input DQ1 to DQ8 Data input/output CE Chip enable input WE Write enable input OE Output enable input


    Original     		PDF GS78108AB GS78108A 576-words GS78108operates GS7810A8 12Format GS78108AGB-10 GS78108AGB-8 78108A GS78108AB GS78108AB-10 GS78108AB-10I GS78108AB-12 GS78108AB-12I GS78108AB-15I

    Untitled

    Abstract: No abstract text available
    Text: 256K x 72 SSRAM Multi-Chip Package ▼ Optimum Density and Performance in One Package WEDPY256K72V-XBX* Designed as L2 Cache for advanced processors see other sidefor typical application block diagram Performance Features • • • • • • • •


    Original     		PDF WEDPY256K72V-XBX* 100MHz 256KX72sbd WEDPY256K72V MIF2012

    GS78108A

    Abstract: GS78108AB GS78108AB-10 GS78108AB-10I GS78108AB-12 GS78108AB-12I GS78108AB-15I GS78108AB-8 GS78108AB-8I
    Text: Preliminary GS78108AB BGA Commercial Temp Industrial Temp 1M x 8 8Mb Asynchronous SRAM Features • Fast access time: 8, 10, 12 ns • CMOS low power operation: 240/190/170 mA at minimum cycle time • Single 3.3 V ± 0.3 V power supply • All inputs and outputs are TTL-compatible


    Original     		PDF GS78108AB 119-bump, GS78108A GS78108AB-15I GS78108AB-12T GS78108AB GS78108AB-10 GS78108AB-10I GS78108AB-12 GS78108AB-12I GS78108AB-15I GS78108AB-8 GS78108AB-8I

    Untitled

    Abstract: No abstract text available
    Text: IS61LV12824 128K x 24 HIGH-SPEED CMOS STATIC RAM WITH 3.3V SUPPLY FEATURES • High-speed access time: 8, 9, 10, 12 ns • CMOS low power operation — 720 mW typical operating @ 9 ns — 36 mW (typical) standby @ 9 ns • TTL compatible interface levels


    Original     		PDF IS61LV12824 119-pin 14x22mm IS61LV12824 IS61LV12824-8B IS61LV12824-9B IS61LV12824-10B IS61LV12824-12B SR021-0B

    graphic card circuit diagram

    Abstract: SMART ASIC bga HJ945010BP SH3-DSP hitachi sh3 network 7729R hitachi sh3 MCP market SH7729 hm52256
    Text: EP-MT-01002A-02 Hitachi MCM/MCP Products Hitachi MCM/MCP Products Feb.1st, 2001 Multi Chip Module Products Design Dept. DRAM Business Division Semiconductor & Integrated Circuits Hitachi Ltd. EP-MT-01002A-02 Hitachi MCM/MCP Products 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright,


    Original     		PDF EP-MT-01002A-02 SH7709A, SH7709S SH7729 SH7729R ADE-A03-006D graphic card circuit diagram SMART ASIC bga HJ945010BP SH3-DSP hitachi sh3 network 7729R hitachi sh3 MCP market hm52256

    SH3-DSP

    Abstract: 7729R HJ945020 sdram pcb gerber hitachi sh3 HJ945010BP HJ945010 SH7729 SH7750 hitachi sh4
    Text: EP-MT-01001A-02 Hitachi MCM/MCP Products 日立 MCM/MCP プロダクツ 2001年 3月1日 株式会社 日立製作所 半導体グループ DRAM事業部 MCM設計部 製品技術Gr. Hitachi MCM/MCP Products EP-MT-01001A-02 1. 本書に記載の製品及び技術のうち「外国為替及び外国貿易法」に基づき安全保障貿易管理関連貨物・技術に該当するものを輸出する


    Original     		PDF EP-MT-01001A-02 512Mbit M/128Mbit 128M/256M SH7750 SH3-DSP 7729R HJ945020 sdram pcb gerber hitachi sh3 HJ945010BP HJ945010 SH7729 hitachi sh4

    Untitled

    Abstract: No abstract text available
    Text: 256K x 72 SSRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPY256K72V-XBX* Designed as L2 Cache for advanced processors see other side for typical application block diagram Performance Features • Fast clock speeds: 200, 166, 150, 133 and 100MHz


    Original     		PDF WEDPY256K72V-XBX* 100MHz 200mm2 560mm2 308mm WEDPY256K72V MIF2012

    35 x 35 PBGA, 580 100 balls

    Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
    Text: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8


    Original     		PDF C13550EJ1V0PF00 35 x 35 PBGA, 580 100 balls Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP

    WEDPY256K72V-XBX

    Abstract: No abstract text available
    Text: 256K x 72 SSRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPY256K72V-XBX* • Designed as L2 Cache for advanced processors see other side for typical application block diagram Performance Features • • • • • • • •


    Original     		PDF WEDPY256K72V-XBX* 100MHz 256KX72sbd WEDPY256K72V MIF2012 WEDPY256K72V-XBX

    Untitled

    Abstract: No abstract text available
    Text: GS78108AB 1M x 8 8Mb Asynchronous SRAM BGA Commercial Temp Industrial Temp Features • Fast access time: 8, 10, 12 ns • CMOS low power operation: 240/190/170 mA at minimum cycle time • Single 3.3 V ± 0.3 V power supply • All inputs and outputs are TTL-compatible


    Original     		PDF GS78108AB 119-bump, GS78108A 576-words

    Untitled

    Abstract: No abstract text available
    Text: GS78108AB BGA Commercial Temp Industrial Temp 1M x 8 8Mb Asynchronous SRAM 8, 10, 12 ns 3.3 V VDD Features Symbol Pin Descriptions Description A0 to A19 Address input DQ1 to DQ8 Data input/output CE Chip enable input WE Write enable input OE Output enable input


    Original     		PDF GS78108AB GS78108A 576-words GS78108operates GS7810A8

    WEDPY256K72V-XBX

    Abstract: No abstract text available
    Text: 256K x 72 SSRAM Multi-Chip Package Optimum Density and Performance in One Package WEDPY256K72V-XBX* • Designed as L2 Cache for advanced processors see other side for typical application block diagram Fast clock speeds: 200, 166, 150, 133 and 100MHz High performance 2-1-1-1 access rate


    Original     		PDF WEDPY256K72V-XBX* 100MHz 256KX72pkgdim WEDPY256K72V MIF2012 WEDPY256K72V-XBX