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    API Delevan 1331-471H

    FIXED IND 470NH 460MA 210MOHM SM
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    DigiKey 1331-471H Reel 500
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    Mouser Electronics 1331-471H
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    API Delevan 1641-471H

    FIXED IND 470NH 580MA 250MOHM TH
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 1641-471H Reel 2,500
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    Mouser Electronics 1641-471H
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    Brady Worldwide Inc 7147-1HV-PK

    B946 7147-1HV BK/YW 5PK
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    DigiKey 7147-1HV-PK Bulk 1
    • 1 $33.5
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    RS 7147-1HV-PK Package 4 Weeks 1
    • 1 $32.89
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    Vishay Beyschlag UMA02040G1471HAU00

    UMA 0204-05 0.02% AU 1K47
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    DigiKey UMA02040G1471HAU00 Box 100
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    Pulse Electronics Corporation PGL6721.471HLT

    POWDER MOLDED IND (Alt: PGL6721.471HLT)
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    Avnet Asia PGL6721.471HLT 2,100 14 Weeks 1,500
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    1471H Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    NEC asu

    Abstract: 13E3h 1442H
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		PDF R8C/22 R8C/23 REJ09B0251-0200 NEC asu 13E3h 1442H

    13CD

    Abstract: MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0020 Rev.0.20 Sep 29, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is


    Original     		PDF R8C/22, R8C/23 16-BIT REJ03B0097-0020 48-pin 13CD MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H

    1N44H

    Abstract: 1a5ah 1178H 1N60H 1171H 1A86H 0m02 1b7ah 19C1H 1N14H
    Text: SONET/SDH Payload Extractor/Aligner SPECTRA-4x155 Production PM5316 SPECTRA 4x155 SONET/SDH Payload Extractor/Aligner 4 x 155 Mbit/s Datasheet Proprietary and Confidential Production Issue 4: March 2001 Proprietary and Confidential to PMC-Sierra, Inc. and for its customers’ internal use


    Original     		PDF SPECTRA-4x155) PM5316 4x155 PMC-1990822, 1n31h PMC-1990822 1N44H 1a5ah 1178H 1N60H 1171H 1A86H 0m02 1b7ah 19C1H 1N14H

    1312H

    Abstract: 144BH 1458h 1351h 13D0H 1444H
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0100 Rev.1.00 Oct 27, 2006 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


    Original     		PDF R8C/22 R8C/23 REJ03B0097-0100 48-pin 1312H 144BH 1458h 1351h 13D0H 1444H

    AT24C1024

    Abstract: 8cn3
    Text: Features • Low-voltage Operation – 2.7 VCC = 2.7V to 5.5V Internally Organized 131,072 x 8 2-wire Serial Interface Schmitt Triggers, Filtered Inputs for Noise Suppression Bi-directional Data Transfer Protocol 400 kHz (2.7V) and 1 MHz (5V) Clock Rate


    Original     		PDF 256-byte AT24C1024 1471H 8cn3

    R5F2123

    Abstract: R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


    Original     		PDF R8C/22 R8C/23 REJ03B0097-0110 48-pin R5F2123 R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP

    1C65H

    Abstract: 1a5ah
    Text: :5 6: 55 AM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 05 12 PM5316 es da y, 13 De ce SPECTRA 4x155 Data Sheet Released Issue No. 6: November 2005 Do wn lo ad ed by Co nt e nt Te a m of P ar tm in er In co n Tu SONET/SDH Payload Extractor/Aligner


    Original     		PDF 4x155 PM5316 4x155 PMC-1990822, 1C65H 1a5ah

    r5f2122ckfp

    Abstract: r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H
    Text: REJ09B0251-0200 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/2x SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


    Original     		PDF REJ09B0251-0200 R8C/22 R8C/23 r5f2122ckfp r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H

    NEC 1378h

    Abstract: R5F2123CKFP 1347h 13F9H R5F21226DFP R5F21226JFP R5F2123 R5F21227JFP R5F21228DFP R5F21228JFP
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		PDF

    145AH

    Abstract: MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0200 Rev.2.00 Aug 20, 2008 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of


    Original     		PDF R8C/22 R8C/23 REJ03B0097-0200 48-pin 145AH MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP

    13D2H

    Abstract: 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0010 Rev.0.10 Mar 08, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU


    Original     		PDF R8C/22, R8C/23 16-BIT REJ03B0097-0010 48-pin di5-900 Unit2607 13D2H 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H

    Untitled

    Abstract: No abstract text available
    Text: 2: 03 PM SPECTRA 4x155 ASSP Telecom Standard Product Data Sheet Released m be r, 20 02 02 :4 PM5316 da y, 03 De ce SPECTRA 4x155 Data Sheet Released Issue No. 5: September 2002 Do wn lo ad ed by Pa rtM i ne rI nc of Pa rtm in er In co n Tu es SONET/SDH Payload Extractor/Aligner


    Original     		PDF 4x155 PM5316 4x155 PMC-1990822,

    Untitled

    Abstract: No abstract text available
    Text: REJ09B0251-0110 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU M16C FAMILY / R8C/Tiny SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


    Original     		PDF REJ09B0251-0110 R8C/22 R8C/23