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    Brady Worldwide Inc 7145-1HV-PK

    B946 7145-1HV BK/YW 5PK
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    DigiKey 7145-1HV-PK Bulk 1
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    RS 7145-1HV-PK Package 4 Weeks 1
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    Samtec Inc HTMS-114-51-H-S

    Conn Unshrouded Header HDR 14 POS 1.27mm Solder ST Thru-Hole - Bulk (Alt: HTMS-114-51-H-S)
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    Samtec Inc FLE-145-01-H-DV-K

    Board to Board & Mezzanine Connectors Cost Effective Surface Mount Socket, 0.050" Pitch
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    Mouser Electronics FLE-145-01-H-DV-K
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    Brady Worldwide Inc 7145-1HV

    B946 7145-1Hv Blk/Yel/Card |Brady 7145-1HV
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    Aptiv PLC 1021451H

    Automotive Connectors
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    1451H Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    NEC asu

    Abstract: 13E3h 1442H
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    PDF R8C/22 R8C/23 REJ09B0251-0200 NEC asu 13E3h 1442H

    T8032

    Abstract: 0547 fsm 0x1516 0x150F 13,824mhz "K042" tb8032 transistor GT 1081
    Text: W681307 Product Datasheet USB1.1 CODEC Microprocessor Control Unit with 32KB Mask ROM and 4KB RAM. -1- Publication Release Date: May, 2007 Revision 1.3 W681307 AMENDMENT HISTORY Changes •: modified, √: added, x: removed Ver Date 1.0 2006/11/22 Filename


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    PDF W681307 W681307 0x14C4. 0x14E5. T8032 0547 fsm 0x1516 0x150F 13,824mhz "K042" tb8032 transistor GT 1081

    13CD

    Abstract: MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0020 Rev.0.20 Sep 29, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is


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    PDF R8C/22, R8C/23 16-BIT REJ03B0097-0020 48-pin 13CD MA 1360H 13BFh 1344H R5F21226JFP R5F21226KFP R5F21227JFP R5F21227KFP 1421H 1447H

    1312H

    Abstract: 144BH 1458h 1351h 13D0H 1444H
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0100 Rev.1.00 Oct 27, 2006 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


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    PDF R8C/22 R8C/23 REJ03B0097-0100 48-pin 1312H 144BH 1458h 1351h 13D0H 1444H

    gtr driver

    Abstract: tea7089a TEA7089AFP TEA7532 TEA7540
    Text: TEA7089A LOW-RANGE PHONE DEDICATED CHIP . . . . . RING - GENERATION OF 8 MELODY TONES Including the 3 German Melody Tones - 4 STEPS DIGITAL CONTROL ON THE AMPLIFIER OUTPUT LEVEL SPEECH - TRANSMIT GAINEXTERNALLY ADJUSTABLE - RECEIVINGGAINEXTERNALLYADJUSTABLE


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    PDF TEA7089A 79MHz 58MHz gtr driver tea7089a TEA7089AFP TEA7532 TEA7540

    R5F2123

    Abstract: R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0110 Rev.1.10 Mar 16, 2007 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level


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    PDF R8C/22 R8C/23 REJ03B0097-0110 48-pin R5F2123 R5F2123CKFP 131Bh R5F2122CJFP R5F21226DFP R5F21226JFP R5F21227DFP R5F21227JFP 1428H R5F21228JFP

    TEA7089A

    Abstract: TEA7089AFP TEA7532 TEA7540 crystal 3.58MHZ oscillator 3 pin figure 120 VAC crystal oscillator
    Text: TEA7089A LOW-RANGE PHONE DEDICATED CHIP . . . . . RING - GENERATION OF 8 MELODY TONES Including the 3 German Melody Tones - 4 STEPS DIGITAL CONTROL ON THE AMPLIFIER OUTPUT LEVEL SPEECH - TRANSMIT GAINEXTERNALLY ADJUSTABLE - RECEIVINGGAINEXTERNALLYADJUSTABLE


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    PDF TEA7089A 79MHz 58MHz TEA7089A TEA7089AFP TEA7532 TEA7540 crystal 3.58MHZ oscillator 3 pin figure 120 VAC crystal oscillator

    r5f2122ckfp

    Abstract: r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H
    Text: REJ09B0251-0200 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/2x SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


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    PDF REJ09B0251-0200 R8C/22 R8C/23 r5f2122ckfp r5f21237jfp R5F21238KFP REJ09B0251-0200 R5F21236JFP R5F2123CKFP 1342H

    tea7090

    Abstract: hf electret microphone handsfree chip IC TEA7088A TEA7532 LS1 Piezo buzzer
    Text: APPLICATION NOTE TEA7088A - TELEPHONE SET DEVICE CONTENTS Page I TEA7088A GENERAL INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 I.1 I.2 I.3 I.4 SETTING THE TEA7088A APPLICATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .


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    PDF TEA7088A tea7090 hf electret microphone handsfree chip IC TEA7532 LS1 Piezo buzzer

    hdg104

    Abstract: HDG104-DN-2 wifi RECEIVER CIRCUIT DIAGRAM HGD104 wi-fi transmitter block diagram WIFI data transmitter and receiver schematic HDG104-DN-3 wifi amplifier circuit wifi antenna schematic 1451-HDG104
    Text: HDG104-WiFi 802.11b+g System in Package Data Sheet HDG104 WiFi SIP component Data Sheet - Preliminary HDG104 WiFi SIP component Revision History Revision Revision date Description PA1 2009-08-24 First issue PA2 2009-09-18 Reference designs PA6 2009-11-13 Final draft for review


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    PDF HDG104-WiFi HDG104 HDG104 1451-HDG104 HDG104-DN-2 wifi RECEIVER CIRCUIT DIAGRAM HGD104 wi-fi transmitter block diagram WIFI data transmitter and receiver schematic HDG104-DN-3 wifi amplifier circuit wifi antenna schematic 1451-HDG104

    NEC 1378h

    Abstract: R5F2123CKFP 1347h 13F9H R5F21226DFP R5F21226JFP R5F2123 R5F21227JFP R5F21228DFP R5F21228JFP
    Text: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


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    PDF

    145AH

    Abstract: MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP
    Text: R8C/22 Group, R8C/23 Group RENESAS MCU 1. REJ03B0097-0200 Rev.2.00 Aug 20, 2008 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of


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    PDF R8C/22 R8C/23 REJ03B0097-0200 48-pin 145AH MA 1360H 1320H 1378H ic r5f2122ckfp R5F2123CKFP 13C4H R5F2122AJFP R5F21226DFP R5F21227DFP

    TEA7088A

    Abstract: TEA7088AFP TEA7532 TEA7540 BUZ13 7088A-14 770HZ 1451h
    Text: TEA7088A LOW-RANGE PHONE DEDICATED CHIP . . . . . RING - GENERATION OF 8 MELODY TONES Including the 3 German Melody Tones - 4 STEPS DIGITAL CONTROL ON THE AMPLIFIER OUTPUT LEVEL SPEECH - TRANSMIT GAINEXTERNALLY ADJUSTABLE - RECEIVINGGAINEXTERNALLYADJUSTABLE


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    PDF TEA7088A 79MHz 58MHz TEA7088A TEA7088AFP TEA7532 TEA7540 BUZ13 7088A-14 770HZ 1451h

    13D2H

    Abstract: 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H
    Text: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/22, R8C/23 Group SINGLE-CHIP 16-BIT CMOS MICROCOMPUTER 1. REJ03B0097-0010 Rev.0.10 Mar 08, 2005 Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C/Tiny Series CPU


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    PDF R8C/22, R8C/23 16-BIT REJ03B0097-0010 48-pin di5-900 Unit2607 13D2H 1429H 1332H R5F2123 1466H 1439H 1423H 1342H 13F9H 1436H

    Untitled

    Abstract: No abstract text available
    Text: REJ09B0251-0110 16 R8C/22 Group, R8C/23 Group Hardware Manual RENESAS MCU M16C FAMILY / R8C/Tiny SERIES All information contained in these materials, including products and product specifications, represents information on the product at the time of publication and is subject to change by


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    PDF REJ09B0251-0110 R8C/22 R8C/23