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    132 PIN PGA SOCKET Search Results

    132 PIN PGA SOCKET Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB15SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB15SKT0-000 D-Subminiature (DB15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD15SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD15SK-000 High-Density D-Subminiature (HD15 Female D-Sub) Connector, 15-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB50SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB50SKT0-000 D-Subminiature (DB50 Female D-Sub) Connector, 50-Position Socket Contacts, Solder-Cup Terminals Datasheet

    132 PIN PGA SOCKET Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 97-AQ132C - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: •Convert surface mount PQFP packages to an Amp interstitial PGA footprint. •Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. •Pins are mechanically fastened and soldered to board


    Original     		97-AQ132C -or97-AQ132C-P PDF

    18022

    Abstract: 132 pin PGA socket
    Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using


    Original     		97-AQ132D -or97-AQ132D-P 18022 132 pin PGA socket PDF

    mounting pad PQFP

    Abstract: No abstract text available
    Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using


    Original     		97-AQ132D -or97-AQ132D-P mounting pad PQFP PDF

    132 pin PGA socket

    Abstract: No abstract text available
    Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board


    Original     		97-AQ132D -or97-AQ132D-P 132 pin PGA socket PDF

    Untitled

    Abstract: No abstract text available
    Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using


    Original     		97-AQ132D -or97-AQ132D-P PDF

    amp pga socket

    Abstract: DIMENSIONS PQFP 132 ASTM-B16-85 mounting pad PQFP 132 pin PGA socket
    Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board


    Original     		97-AQ132D 97-AQ132D -or97-AQ132D-P amp pga socket DIMENSIONS PQFP 132 ASTM-B16-85 mounting pad PQFP 132 pin PGA socket PDF

    Untitled

    Abstract: No abstract text available
    Text: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,


    Original     		97-AQ132D 132-Pin C36ending 97-AQ132D-P PDF

    amp pga socket

    Abstract: AMS-QQ-N-290
    Text: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,


    Original     		97-AQ132D 132-Pin 97-AQ132D-P amp pga socket AMS-QQ-N-290 PDF

    A80960JD-33

    Abstract: A80960JD-40 A80960JD-50 A80960JD-66 A80960JT-100 A80960JT-75 NG80960JT-100 NG80960JT-75
    Text: 80960Jx 3.3 V Microprocessor 1.0 Packaging Information: 80960Jx 3.3 V Processors The 80960Jx is offered with four speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC = 3.3 V ± 0.15 V over a case temperature range of


    Original     		80960Jx 132-pin A80960JT-100 A80960JT-75 A80960JD-66 A80960JD-50 A80960JD-40 A80960JD-33 A80960JD-33 A80960JD-40 A80960JD-50 A80960JD-66 A80960JT-100 A80960JT-75 NG80960JT-100 NG80960JT-75 PDF

    intel packaging handbook 240800

    Abstract: AD9132 AD27 AD30 AD1981
    Text: 80L960JA/JF Microprocessor 1.0 Packaging Information: 80L960JA/JF Processor The 80L960JA/JF will be offered in several speed and package types. The 132-pin Pin Grid Array PGA device will be specified for operation at VCC = 3.3 V ± 5% over a case temperature range of


    Original     		80L960JA/JF 132-pin A80L960JA/JF-25 A80L960JA/JF-16 NG80L960JA/JF-25 NG80L960JA/JF-16 intel packaging handbook 240800 AD9132 AD27 AD30 AD1981 PDF

    68020 motorola

    Abstract: motorola 68020
    Text: 45.72mm [1.800"] Adapter to target PCB orientation A1 A1 ADAPTER PGA TOP 45.72mm [1.800"] Pin 1 2.54mm typ. [0.100"] Target PCB 132 position QFP land pattern 6.88mm [0.271"] 1 5.89mm [0.232"] 3 15.19mm[0.598"] Assembled 2 1 0.65mm typ. [0.026"] 26.54mm [1.045"]


    Original     		FR4/G10 PC-PGA/QFP-68020-L-01 68020 motorola motorola 68020 PDF

    A80960JC-33

    Abstract: A80960JC-40 A80960JC-50 A80960JC-66 A80960JS-16 A80960JS-33 NG80960JC-50 NG80960JC-66 NG80960JC-40
    Text: 80960JS/JC 3.3 V Microprocessor 2.0 Package Information: 80960JS/JC 3.3 V Processors The 80960JS/JC is offered with six speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC= 3.3 V ± 0.15 V over a case temperature range of


    Original     		80960JS/JC 132-pin A80960JC-66 A80960JC-50 A80960JC-40 A80960JC-33 A80960JS-33 A80960JS-25 A80960JC-33 A80960JC-40 A80960JC-50 A80960JC-66 A80960JS-16 A80960JS-33 NG80960JC-50 NG80960JC-66 NG80960JC-40 PDF

    Wakefield Thermal Solutions TYPE 120

    Abstract: intel packaging handbook 240800 Diode Mark N10 f 6061 A80960JD-33 A80960JD-40 A80960JD-50 A80960JD-66 A80960JT-100 A80960JT-75
    Text: 80960JA/JF/JD/JT 3.3 V Microprocessor 1.0 Packaging Information: 80960Jx 3.3 V Processors The 80960Jx is offered with four speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC = 3.3 V ± 0.15 V over a case temperature range of


    Original     		80960JA/JF/JD/JT 80960Jx 132-pin A80960JT-100 A80960JT-75 A80960JD-66 A80960JD-50 A80960JD-40 A80960JD-33 Wakefield Thermal Solutions TYPE 120 intel packaging handbook 240800 Diode Mark N10 f 6061 A80960JD-33 A80960JD-40 A80960JD-50 A80960JD-66 A80960JT-100 A80960JT-75 PDF

    A80960JC-33

    Abstract: A80960JC-40 A80960JC-50 A80960JC-66 A80960JS-16 A80960JS-33 NG80960JC-50 NG80960JC-66
    Text: 80960JS/JC 3.3 V Microprocessor 2.0 Package Information: 80960JS/JC 3.3 V Processors The 80960JS/JC is offered with six speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC= 3.3 V ± 0.15 V over a case temperature range of


    Original     		80960JS/JC 132-pin A80960JC-66 A80960JC-50 A80960JC-40 A80960JC-33 A80960JS-33 A80960JS-25 A80960JC-33 A80960JC-40 A80960JC-50 A80960JC-66 A80960JS-16 A80960JS-33 NG80960JC-50 NG80960JC-66 PDF

    68302

    Abstract: QFE132SA SF-QFJ132SA-L-01
    Text: Relative orrientations top views 1 13 A A1 PGA 1.800" Pin 1 QFP N Top View 1.800" 2 1 0.501" 0.600" (assembled) Surface mount base: (included) see SF-QFJ132SA-L-01 drawing for greater detail 0.250" 0.025" pitch 1.040" Side View Target PCB 132 position QFP Land Pattern


    Original     		SF-QFJ132SA-L-01 QFE132SA FR4/G10 finish10µ PC-PGA/QFP-68302-L-01 68302 PDF

    68302

    Abstract: motorola ST 1076 QFE132SA SF-QFJ132SA-G-02 land pattern QFP 132
    Text: Relative orrientations top views 1 13 A A1 PGA 1.800" Pin 1 QFP N Top View 1.800" 2 1 0.501" 0.630" (assembled) Surface mount base: (included) see SF-QFJ132SA-G-02 drawing for greater detail 0.276" 0.025" pitch 1.076" Side View Target PCB 132 position QFP Land Pattern


    Original     		SF-QFJ132SA-G-02 QFE132SA FR4/G10 finish10µ PC-PGA/QFP-68302-G-01 68302 motorola ST 1076 land pattern QFP 132 PDF

    footprint 8M1-A

    Abstract: No abstract text available
    Text: Zero Insertion Force PGA Test and Burn-in Sockets cont. Grid Size No. of Pins Dim. “C” 12 x 12* 144 1.100 [27.94] 13 x 13 169 1.200 [30.48] 14 x 14* 196 1.300 [33.02] 15 x 15 225 1.400 [35.56] 16 x 16* 256 1.500 [38.10] 17 x 17 289 1.600 [40.64] 18 x 18*


    Original     		PDF

    Preci-Dip Durtal SA

    Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
    Text: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin


    Original     		CH-2800 540-PP-020-24-000-1 540-PP-028-24-000-1 540-PP-032-24-000-1 540-PP-044-24-000-1 540-PP-052-24-000-1 540-PP-068-24-000-1 540-PP-084-24-000-1 Preci-Dip Durtal SA C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148 PDF

    footprint pga 84

    Abstract: footprint pga 208 e-tec pcp
    Text: PGA/PGI Series - Pin Grid Array Sockets E-tec offers any configuration from 5 x 5 upwards. You may choose between open frame and closed frame socket bodies. The E-tec PGA sockets with Insulator code “S” will be supplied either in PBT plastic or FR4 Epoxy depending on material


    Original     		19x19 footprint pga 84 footprint pga 208 e-tec pcp PDF

    footprint pga 84

    Abstract: PGA 145 socket 8x8 64 footprint footprint pga 208 X18180 X1388 8x8 68 footprint 84 pin PGA socket
    Text: PGA/PGI Series - Pin Grid Array Sockets E-tec the Swiss connection E-tec offers any configuration from 5 x 5 upwards. You may choose between open frame and closed frame socket bodies. The E-tec PGA sockets with Insulator code “S” will be supplied either in PBT plastic or FR4 Epoxy depending on material


    Original     		19x19 insulat00 footprint pga 84 PGA 145 socket 8x8 64 footprint footprint pga 208 X18180 X1388 8x8 68 footprint 84 pin PGA socket PDF

    ZIF pga 84

    Abstract: PGA 145 socket QFP 128 pin Socket PA-QFJ172SB-P-Z-01 ZIF qfp 172
    Text: Page 1 of 2 Use if QFP Pin 1 is lower left when device is placed on ZIF socket Top ViewQFP Socket 129 87 86 130 44 172 QFP PIN 1in lower left corner QFP PIN 1 43 A1 Top ViewPGA Base A17 126 125 129 128 127 121 113 110 109 103 97 91 88 87 90 89 85 130 123


    Original     		PA-QFJ172SB-P-Z-01 ZIF pga 84 PGA 145 socket QFP 128 pin Socket ZIF qfp 172 PDF

    n03n

    Abstract: DSP56002 ti31 58af S-8675 S-7641 TXC 40MHz xtal S7504 TXC 40MHz oscillator Nippon capacitors
    Text: Order this document by DSP56002/D MOTOROLA - SEMICONDUCTOR TECHNICAL DATA Advance Information 24-Bit General Purpose Digital Signal Processor DSP56002 Pin Grid Array PGA Available in a 132 pin ceramic throughhoie package. Plastic Quad Flat Pack (PQFP) Available in a 132 pin, small footprint,


    OCR Scan     		DSP56002/D DSP56002 24-Bit DSP56002 DSP56001 n03n ti31 58af S-8675 S-7641 TXC 40MHz xtal S7504 TXC 40MHz oscillator Nippon capacitors PDF

    pga 132 packaging

    Abstract: 55274-1 augat PGM 5527 Intel 386 DX TEXTOOL PGA TEXTOOL zif AUGAT wire wrap 132 pin PGA socket
    Text: Int*l386 DX MICROPROCESSOR 8. MECHANICAL DATA 8.2 PACKAGE DIMENSIONS AND MOUNTING 8.1 INTRODUCTION The initial Intel386 OX package is a 132-pin ceramic pin grid array PGA . Pins of this package are ar­ ranged 0.100 inch (2.54mm) center-to-center, In a


    OCR Scan     		l386TM Intel386 132-pin pga 132 packaging 55274-1 augat PGM 5527 Intel 386 DX TEXTOOL PGA TEXTOOL zif AUGAT wire wrap 132 pin PGA socket PDF

    footprint 8M1-A

    Abstract: No abstract text available
    Text: ADVANCED INTERCONNECTIONS PGA Footprints 5 Energy Way, P.O. Box 1019, W e st Warw ick, Rl 02893 • Tel. 4 0 1 -8 2 3 -5 20 0 • FAX 401-823-8723 PGA Socket and Adapter Footprints 8 Pins Footprint Number 8" _J ^ 9 Pins Footprint Num ber 9* L .300 Sq. f 7.62


    OCR Scan     		PDF