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    WED3C750A8M-200BX

    Abstract: No abstract text available
    Text: PowerPC 750 /8Mbit SSRAM Multi-Chip Package Optimum Density and Performance in One Package WED3C7508M-200BX Features • • • A 200 MHz 750 RISC µProcessor 8 Mbit of Synchronous pipeline burst SRAM configured as 128Kx72 L2 Cache Extended temperature modules for industrial and military applications


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    PDF 750TM/8Mbit WED3C7508M-200BX 128Kx72 WED3C750A WED3C7558M-300BX WED3C750A8M-200BX* WEDPN8M72V-XBX* 750sbd WED3C750A8M-200BX

    sram 1mbyte 3.3v

    Abstract: 16x16 bga Multi-Chip Package MEMORY TQFP 100 PACKAGE footprint with or without underfill PC755B PCX755B
    Text: PC755B Microprocessor + 1MByte L2-Cache Multi-Chip Module Fact Sheet Main Features • PC755B RISC microprocessor • 8 Mbit of Synchronous Pipelined Burst SRAM configured as 128Kx72 L2-Cache • Extended temperature modules 2.0V (Core)/3.3V (I/0) for industrial and military applications


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    PDF PC755B 128Kx72 PCX745BVZFUxxxLE PC7410M16MGxxxLE PCX755B BP123 sram 1mbyte 3.3v 16x16 bga Multi-Chip Package MEMORY TQFP 100 PACKAGE footprint with or without underfill

    ATMEL 322

    Abstract: atmel 711 PC755B
    Text: 3& 0LFURSURFHVVRU  0%\WH /&DFKH 0XOWL&KLS 0RGXOH DFW 6KHHW 0DLQ )HDWXUHV • PC755B RISC microprocessor • 8 Mbit of Synchronous Pipelined Burst SRAM configured as 128Kx72 L2-Cache) • Extended temperature modules 2.0V (Core)/3.3V (I/0) for industrial and military applications


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    PDF PC755B 128Kx72 PCX745BVZFUxxxLE PC7410M16MGxxxLE PCX755B BP123 ATMEL 322 atmel 711

    WED3C7508M-200BX

    Abstract: WED3C750A8M-200BX WEDPN8M72V-XBX
    Text: PowerPC 750 /8Mbit SSRAM Multi-Chip Package WED3C750A8M Product Sheet Rev. 1 5/01 Optimum Density and Performance in One Package WED3C7508M-200BX Features • • • A 200 MHz 750 RISC µProcessor 8 Mbit of Synchronous pipeline burst SRAM configured as 128Kx72 L2 Cache


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    PDF 750TM/8Mbit WED3C750A8M WED3C7508M-200BX 128Kx72 25x21mm, 525mm WED3C750A 625mm2 352mm2 1329mm2 WED3C750A8M-200BX WEDPN8M72V-XBX

    Untitled

    Abstract: No abstract text available
    Text: SM372EBSFN3XGXX December 1995 Rev 0 SMART Modular Technologies SM372EBSFN3XGXX 1MByte 128Kx72 Synchronous Secondary Cache SRAM Module General Description Features The SM372EBSFN3XGXX is a high performance, 1 Megabyte synchronous secondary cache SRAM module.


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    PDF SM372EBSFN3XGXX 128Kx72) SM372EBSFN3XGXX 168-pin, 64Kx18

    with or without underfill

    Abstract: WED3C7410E16M-400BX WED3C750A8M-200BX WED3C7558M-XBX WED3C755E8M-XBX 21mmx25mm
    Text: PowerPC 755E/8Mbit SSRAM Multi-Chip Package Optimum Density and Performance in One Package WED3C755E8M-XBX Features • 300 or 350 MHz 755E Rev RISC µProcessor • 8 Mbit of Synchronous pipeline burst SRAM configured as 128Kx72 L2 Cache • Extended temperature modules 2.0V (Core)/3.3V (I/0) for


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    PDF 755E/8Mbit WED3C755E8M-XBX 128Kx72 25x21mm, 525mm2. WED3C755E8M-XBX x64/x72 WED3C755E8M MIF2032 with or without underfill WED3C7410E16M-400BX WED3C750A8M-200BX WED3C7558M-XBX 21mmx25mm

    WED3C750A8M-200BX

    Abstract: No abstract text available
    Text: WED3C750A8M-200BX HI-RELIABILITY PRODUCT RISC Microprocessor Module PRELIMINARY* OVERVIEW The WED3C750A8M-200BX is offered in industrial -40°C to +85°C and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight


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    PDF WED3C750A8M-200BX WED3C750A8M-200BX 750/SSRAM

    CY7C1304V25

    Abstract: No abstract text available
    Text: 5 CY7C1304V25 Advanced Information 9-Mb Pipelined SRAM with QDR Architecture Features Functional Description • Separate Independent Read and Write Data Ports — Supports concurrent transactions • 167 MHz Clock for High Bandwidth — 2.5 ns Clock-to-Valid access time


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    PDF CY7C1304V25 CY7C1304V25

    MPC755

    Abstract: WED3C750A8M-200BX WED3C7558M-XBX WED3C755E8M-XBX
    Text: White Electronic Designs WED3C755E8M-XBX RISC MICROPROCESSOR MULTI-CHIP PACKAGE OVERVIEW FEATURES The WEDC 755E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features:


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    PDF WED3C755E8M-XBX 755E/SSRAM WED3C755E8M-XBX MPC755 WED3C750A8M-200BX WED3C7558M-XBX

    CY7C1304V25

    Abstract: No abstract text available
    Text: 304V25 CY7C1304V25 Advanced Information 9-Mb Pipelined SRAM with QDR Architecture Features Functional Description • Separate Independent Read and Write Data Ports — Supports concurrent transactions • 167 MHz Clock for High Bandwidth — 2.5 ns Clock-to-Valid access time


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    PDF 304V25 CY7C1304V25 CY7C1304V25

    bwh series

    Abstract: ECHO schematic diagrams
    Text: MITSUBISHI LSIs 2001.May Rev.0.1 M5M5Y5672TG – 25,22,20 Advanced Information Notice: This is not final specification. Some parametric limits are subject to change. 18874368-BIT 262144-WORD BY 72-BIT NETWORK SRAM DESCRIPTION The M5M5Y5672TG is a family of 18M bit synchronous SRAMs


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    PDF M5M5Y5672TG 18874368-BIT 262144-WORD 72-BIT) M5M5Y5672TG 262144-words 72-bit. bwh series ECHO schematic diagrams

    BE5L

    Abstract: CYD18S18V18 CYD09S36V18 CYD18S36V18 SKR 175 FullFlex36
    Text: FullFlex FullFlex Synchronous SDR Dual Port SRAM Features Functional Description • True dual port memory enables simultaneous access to the shared array from each port ■ Synchronous pipelined operation with Single Data Rate SDR operation on each port


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: Advance Information IDT71T6480H 9Mb Pipelined QDR SRAM Burst of 4 Features ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ ◆ Description 9Mb Density 512K x 18 Separate Independent Read and Write Data Ports — Supports concurrent transactions


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    PDF IDT71T6480H x4033

    FullFlex36

    Abstract: No abstract text available
    Text: FullFlex FullFlex Synchronous DDR Dual-Port SRAM Features • True dual-ported memory allows simultaneous access to the shared array from each port • Synchronous pipelined operation with selectable Double Data Rate DDR or Single Data Rate (SDR) operation on each port


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    PDF 36-Gb/s 484-ball 256-ball FullFlex72 CYDD36S72V18) CYDD18S72V1t 27mmx27mmx2 36Mx36 36Mx18 FullFlex36

    FullFlex36

    Abstract: No abstract text available
    Text: FullFlex FullFlex Synchronous DDR Dual-Port SRAM Features • True dual-ported memory allows simultaneous access to the shared array from each port • Synchronous pipelined operation with selectable Double Data Rate DDR or Single Data Rate (SDR) operation on each port


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    PDF 36-Gb/s 484-ball 256-ball FullFlex72 CYDD36S72V18) CYDD18S72V1mation 27mmx27mmx2 36Mx36 36Mx18 FullFlex36

    CY7C1304V25

    Abstract: No abstract text available
    Text: CY7C1304V25 9-Mb Pipelined SRAM with QDR Architecture Features Functional Description • Separate independent Read and Write data ports — Supports concurrent transactions • 167 MHz Clock for high bandwidth — 2.5 ns Clock-to-Valid access time • 4-Word burst for reducing address bus frequency


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    PDF CY7C1304V25 CY7C1304V25

    Untitled

    Abstract: No abstract text available
    Text: a WY128K72V-XG5X WHITE /MICROELECTRONICS 128Kx72 Synchronous Flow Through SRAM MODULE ad van ced * FEATURES • Fast A cc e ss Tim e s of 10 and 11ns ■ Flo w th ro u g h Data Bus ■ Fast OE A cce s s T im e of 5ns ■ C o m m e rc ial, Industrial and M i l i t a r y T e m p e r a tu re Ranges


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    PDF WY128K72V-XG5X 128Kx72

    IC 4047 BE pin diagram

    Abstract: IC 4047 pin diagram
    Text: EDI2AL72128V m x 128Kx72 Flow Through Synchronous Burst SRAM ELECTRONIC DESIGNS INC ADVANCED 128Kx72, 3.3V, Flow Through Synchronous Burst SRAM Features The EDI2AL72128VxxLC is a 3.3V, 9 megabit synchronous RISC Microprocessor Memory Solution SRAM constructed with two 128K x 36 die mounted on a multi­


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    PDF EDI2AL72128V 128Kx72 128Kx72, EDI2AL72128VxxLC EDI2AL72128V IC 4047 BE pin diagram IC 4047 pin diagram

    Untitled

    Abstract: No abstract text available
    Text: a WY128K72V-XG5X WHITE /MICROELECTRONICS 128Kx72 Synchronous Flow Through SRAM MODULE advanced* FEATURES • Fast A cc e ss Tim e s of 10 and 11ns ■ Flo w th ro u g h Data Bus ■ Fast OE A cce s s T im e of 5ns ■ C o m m e rc ial, Industrial and M i l i t a r y T e m p e r a tu re Ranges


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    PDF WY128K72V-XG5X 128Kx72 Pin8K72V-XG5X 128KX72

    Untitled

    Abstract: No abstract text available
    Text: M EDI2AL72128V U 128Kx72 Flow Through Synchronous Burst SRAM ELECTRONIC DESIGNS INC ADVANCED 128Kx72, 3.3V, Flow Through Synchronous Burst SRAM Features The EDI2AL72128VxxLC is a 3.3V, 9 megabit synchronous RISC Microprocessor Memory Solution SRAM constructed with two 128K x 36 die mounted on a multi­


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    PDF EDI2AL72128V 128Kx72 128Kx72, EDI2AL72128VxxLC const11 EDI2AL72128V85U I2AL72128V1 MO-143 EDI2AL72128V

    TJ77T

    Abstract: WY128K72V-XG5X
    Text: YZA WHITE /MICROELECTRONICS WY128K72V-XG5X 128Kx72 Synchronous Flow Through SRAM MODULE advan ced * FEATURES • Fast A c c e s s T i m e s o f 10 a nd 11 ns ■ F l o w t h r o u g h D at a Bus ■ Fast OE A c c e s s T i m e o f 5ns ■ C o m m e r c i a l , I n d u s tr i a l a nd M i l i t a r y T e m p e r a t u r e Rang es


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    PDF WY128K72V-XG5X 128Kx72 128KX72 TJ77T WY128K72V-XG5X

    9261A

    Abstract: CYM9260 CYM9263 PM44 9261
    Text: fax id: 2042 3g~ yr pyprfs^ PRELIMINARY CYM9260 CYM9261A/B CYM9262A/B CYM9263 64K x 72 SRAM 128K x 72 SRAM 256K x 72 SRAM 512K x 72 SRAM Features Module Module Module Module 9262B, 9263 SRAM’s in plastic surface mount packages on an epoxy laminate board with pins. The modules are designed


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    PDF CYM9260 CYM9261A/B CYM9262A/B CYM9263 18/128K 168-position CYM9260, CYM9261, CYM9262 CYM9263 9261A PM44 9261

    9261A

    Abstract: No abstract text available
    Text: fax id: 2042 3g~ yr pyprfs^ PRELIMINARY CYM9260 CYM9261A/B CYM9262A/B CYM9263 64K x 72 SRAM 128K x 72 SRAM 256K x 72 SRAM 512K x 72 SRAM Features • Operates at 50 MHz. • Uses 64K x 1 8 /1 28K x 18 or 256K x 18 high perform ance synchronous SRAMs. • 168-position Angled DIMM from Amp p/n 179508-2


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    PDF CYM9260 CYM9261A/B CYM9262A/B CYM9263 168-position CYM9260, CYM9262 CYM9263 9262B, 9261A

    Untitled

    Abstract: No abstract text available
    Text: IBM14N1372 IBM14N3272 IBM14N6472 High Perform ance SRAM Modules Features • 256K, 512K, and 1MB secondary cache module family using Synchronous and Asynchronous SRAMs. • Organized as a 32K, 64K, or 128K x 72 package on a 4.3” x 1.1”, 160-lead, Dual Read-out DIMM


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    PDF IBM14N1372 IBM14N3272 IBM14N6472 160-lead, i486/PentiumTM 50MHz 66MHz 256KB, 512KB,