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    12 X 12 FBGA THERMAL RESISTANCE Search Results

    12 X 12 FBGA THERMAL RESISTANCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation

    12 X 12 FBGA THERMAL RESISTANCE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    3S110

    Abstract: BGA 64 PACKAGE thermal resistance 12 x 12 fbga thermal resistance CHIP RESISTANCE TABLE 3S150 FBGA 152 JEDEC FBGA EP2S15
    Text: Stratix Series Device Thermal Resistance February 2007, version 2.0 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History Date and Document Version Changes Made April 2006 v1.0 Initial release.


    Original     		PDF

    FBGA 152

    Abstract: 68 ball fbga thermal resistance FBGA1020 78 ball fbga thermal resistance EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 FBGA-484
    Text: 10. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values


    Original     		PDF SII52010-4 EP2S15 EP2S30 EP2S60 FBGA 152 68 ball fbga thermal resistance FBGA1020 78 ball fbga thermal resistance EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 FBGA-484

    BT 1610

    Abstract: 672-FBGA FBGA 12x12 heat sink FBGA-484 datasheet JEDEC FBGA EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: 16. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values


    Original     		PDF SII52010-4 EP2S15 EP2S30 EP2S60 BT 1610 672-FBGA FBGA 12x12 heat sink FBGA-484 datasheet JEDEC FBGA EP2S15 EP2S180 EP2S30 EP2S60 EP2S90

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		PDF 7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance

    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22

    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


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    BT 1610

    Abstract: FBGA 152 FBGA-484 datasheet EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 68 ball fbga thermal resistance
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


    Original     		PDF

    fBGA package tray 12 x 19

    Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    taiyo PSR4000

    Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    transistor smd G46

    Abstract: fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm
    Text: FBGA User’s Guide Version 4.2 -XO\  7KH IROORZLQJ GRFXPHQW UHIHUV WR 6SDQVLRQ PHPRU\ SURGXFWV WKDW DUH QRZ RIIHUHG E\ ERWK $GYDQFHG 0LFUR 'HYLFHV DQG XMLWVX $OWKRXJK WKH GRFXPHQW LV PDUNHG ZLWK WKH QDPH RI WKH FRPSDQ\ WKDW RULJ LQDOO\ GHYHORSHG WKH VSHFLILFDWLRQ WKHVH SURGXFWV ZLOO EH RIIHUHG WR FXVWRPHUV RI ERWK $0' DQG


    Original     		PDF N32-2400 22142J transistor smd G46 fluke 52 k/j Thermocouple 7512 pin diodes in micro semi data sheet smd transistor marking ey SMD MARKING CODE h5 MCP Technology Trend BGA-64 pad AMD reflow soldering profile BGA SMD MARKING CODE l6 BGA Solder Ball 0.6mm

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


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    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


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    Untitled

    Abstract: No abstract text available
    Text: CY7C1079DV33 32-Mbit 4 M x 8 Static RAM 32-Mbit (4 M × 8) Static RAM Features • High Speed ❐ tAA = 12 ns ■ Low Active Power ❐ ICC = 250 mA at 12 ns ■ Low CMOS Standby Power ❐ ISB2 = 50 mA Functional Description The CY7C1079DV33 is a high performance CMOS Static RAM


    Original     		PDF CY7C1079DV33 32-Mbit CY7C1079DV33

    CY62137CV

    Abstract: CY62137V
    Text: CY62137CV25/30/33 MoBL CY62137CV MoBL® 2M 128K x 16 Static RAM Life (MoBL®) in portable applications such as cellular telephones. The devices also has an automatic power-down feature that significantly reduces power consumption by 80% when addresses are not toggling. The device can also be put


    Original     		PDF CY62137CV25/30/33 CY62137CV I/O15) CY62137V

    CY62137CV

    Abstract: CY62137V CY62137CVSL-70BAI
    Text: CY62137CV25/30/33 MoBL CY62137CV MoBL® 2M 128K x 16 Static RAM Life (MoBL®) in portable applications such as cellular telephones. The devices also has an automatic power-down feature that significantly reduces power consumption by 80% when addresses are not toggling. The device can also be put


    Original     		PDF CY62137CV25/30/33 CY62137CV I/O15) CY62137V CY62137CVSL-70BAI

    fbga Substrate design guidelines

    Abstract: FR4 substrate epoxy dielectric constant 4.4 FR4 substrate with dielectric constant 4.4 relative permittivity of fr4 FR4 epoxy dielectric constant 4.2 FR4 4.9 dielectric constant FR4 epoxy dielectric constant 4.4 FR4 dielectric constant 4.9 FR4 dielectric constant and loss tangent at 2.4 G EP2S15
    Text: Section VI. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


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    power transistor tsd 4m

    Abstract: 12 x 12 fbga thermal resistance
    Text: CY7C1079DV33 32-Mbit 4 M x 8 Static RAM 32-Mbit (4 M × 8) Static RAM Features • High Speed ❐ tAA = 12 ns ■ Low Active Power ❐ ICC = 250 mA at 12 ns ■ Low CMOS Standby Power ❐ ISB2 = 50 mA Functional Description The CY7C1079DV33 is a high performance CMOS Static RAM


    Original     		PDF CY7C1079DV33 32-Mbit CY7C1079DV33 power transistor tsd 4m 12 x 12 fbga thermal resistance

    AMD reflow soldering profile BGA

    Abstract: Theta JC of FBGA AM29LV800B thermal resistance solder paste 63sn alpha metal fbga thermal resistance fbga 12 x 12 thermal resistance smd codes marking A21 AMD thermal design retention mechanism FR4 substrate fiberglass AMD K6
    Text: 5/11/99 Version 2.3 1999 Advanced Micro Devices, Inc. Advanced Micro Devices reserves the right to make changes in its products without notice in order to improve design or performance characteristics. This publication neither states nor implies any warranty of any kind, including but not limited to implied warrants of


    Original     		PDF 22247F AMD reflow soldering profile BGA Theta JC of FBGA AM29LV800B thermal resistance solder paste 63sn alpha metal fbga thermal resistance fbga 12 x 12 thermal resistance smd codes marking A21 AMD thermal design retention mechanism FR4 substrate fiberglass AMD K6

    Untitled

    Abstract: No abstract text available
    Text: CY7C1079DV33 32-Mbit 4 M x 8 Static RAM 32-Mbit (4 M × 8) Static RAM Functional Description Features • High Speed ❐ tAA = 12 ns ■ Low Active Power ❐ ICC = 250 mA at 12 ns ■ Low CMOS Standby Power ❐ ISB2 = 50 mA The CY7C1079DV33 is a high performance CMOS Static RAM


    Original     		PDF CY7C1079DV33 32-Mbit CY7C1079DV33

    Untitled

    Abstract: No abstract text available
    Text: IS61QDP2B41M18A/A1/A2 IS61QDP2B451236A/A1/A2 1Mx18 , 512Kx36 18Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.0 Cycle Read Latency) FEATURES •                    512Kx36 and 1Mx18 configuration available.


    Original     		PDF IS61QDP2B41M18A/A1/A2 IS61QDP2B451236A/A1/A2 1Mx18 512Kx36 1Mx18 suppl13x15 13x15 400MHz

    CY62157CV25

    Abstract: CY62157CV30 CY62157CV33 CY62157DV30 CY62157DV30L CY62157DV30LL
    Text: CY62157DV30 MoBL 8-Mbit 512K x 16 MoBL® Static RAM Functional Description[1] Features • Temperature Ranges The CY62157DV30 is a high-performance CMOS static RAM organized as 512K words by 16 bits. This device features advanced circuit design to provide ultra-low active current.


    Original     		PDF CY62157DV30 I/O15) 45-ns 70-ns CY62157CV25 CY62157CV30 CY62157CV33 CY62157DV30L CY62157DV30LL

    IS61QDPB42M36A1-450M3I

    Abstract: IS61QDPB42M36A1
    Text: IS61QDPB44M18A/A1/A2 IS61QDPB42M36A/A1/A2 4Mx18, 2Mx36 72Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.5 Cycle Read Latency) FEATURES •                    2Mx36 and 4Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid


    Original     		PDF IS61QDPB44M18A/A1/A2 IS61QDPB42M36A/A1/A2 4Mx18, 2Mx36 4Mx18 500MHz 450MHz 400MHz IS61QDPB42M36A1-450M3I IS61QDPB42M36A1

    Untitled

    Abstract: No abstract text available
    Text: IS61QDP2B42M18A/A1/A2 IS61QDP2B41M36A/A1/A2 2Mx18, 1Mx36 36Mb QUAD-P Burst 4 SYNCHRONOUS SRAM (2.0 Cycle Read Latency) FEATURES •                    1Mx36 and 2Mx18 configuration available. On-chip delay-locked loop (DLL) for wide data valid


    Original     		PDF IS61QDP2B42M18A/A1/A2 IS61QDP2B41M36A/A1/A2 2Mx18, 1Mx36 2Mx18 400MHz 333MHz 300MHz