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    100 PIN TQFP ALTERA 0.5 Search Results

    100 PIN TQFP ALTERA 0.5 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    100 PIN TQFP ALTERA 0.5 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    UBGA49

    Abstract: EPM3128A EPM7032AE EPM7064AE EPM7128AE EPM7128B EPM7128S EPM7160S EPM7256AE
    Text: CPLD Package & I/O Matrix December 15, 2002. This document is revised quarterly. Visit the Altera web site at www.altera.com for the latest version. 36 68 100-Pin TQFP 36 84 84 100 120 120 36 84 100 120 68 68 84 100 212 256-Pin BGA 68 100-Pin FBGA 1.0 mm


    Original     		PDF 100-Pin EPM3512A 160-Pin EPM3256A EPM3128A EPM7256S EPM7192S EPM7160S EPM7064S EPM7128S UBGA49 EPM3128A EPM7032AE EPM7064AE EPM7128AE EPM7128B EPM7128S EPM7160S EPM7256AE

    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


    Original     		PDF

    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


    Original     		PDF

    transistors BC 458

    Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
    Text: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    ep600i

    Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
    Text: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


    Original     		PDF 144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760

    100 PIN PQFP ALTERA DIMENSION

    Abstract: 100 PIN tQFP ALTERA DIMENSION TQFP 144 PACKAGE altera altera TQFP 44 PACKAGE EPM7096S altera TQFP 32 PACKAGE TQFP 144 PACKAGE DIMENSION epm7032s package dimensions EPM7128S altera board
    Text: Saving Board Space with MAX 7000S TQFP Packages April 1997, ver. 1 Altera® devices allow designers to save board space by enabling the integration of 22V10s, PALs, and GALs into higher density devices. Designers can save even more board space by using Altera MAX 7000S


    Original     		PDF 7000S 22V10s, EPM7032S EPM7064S 100 PIN PQFP ALTERA DIMENSION 100 PIN tQFP ALTERA DIMENSION TQFP 144 PACKAGE altera altera TQFP 44 PACKAGE EPM7096S altera TQFP 32 PACKAGE TQFP 144 PACKAGE DIMENSION epm7032s package dimensions EPM7128S altera board

    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    BC 1098

    Abstract: EPM7384 ALTERA 68 PLCC t187
    Text: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF 232-pin 240-pin 100-pin 256-pin 484-pin 672-pin BC 1098 EPM7384 ALTERA 68 PLCC t187

    EP20K100E

    Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
    Text: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF 49-pin 169-pin EP20K100E EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA

    TQFP 144 PACKAGE DIMENSION

    Abstract: EPM7128A DIMENSIONS pqfp 100 TQFP Package 44 lead 100 PIN PQFP ALTERA DIMENSION altera TQFP 32 PACKAGE 100 PIN tQFP ALTERA DIMENSION
    Text: Saving Board Space with MAX 7000S & MAX 7000A TQFP Packages February 1998, ver. 2 Board Space Savings Altera® devices allow designers to save board space by enabling the integration of 22V10s, PALs, and GALs into higher density devices. Designers can save even more board space by using Altera MAX® 7000S


    Original     		PDF 7000S 22V10s, 7000S 44-Pin TQFP 144 PACKAGE DIMENSION EPM7128A DIMENSIONS pqfp 100 TQFP Package 44 lead 100 PIN PQFP ALTERA DIMENSION altera TQFP 32 PACKAGE 100 PIN tQFP ALTERA DIMENSION

    micro fineline BGA

    Abstract: EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z
    Text: 7. Package Information MII51007-2.1 Introduction This chapter provides package information for Altera’s MAX II devices, and includes these sections: • “Board Decoupling Guidelines” on page 7–1 ■ “Device and Package Cross Reference” on page 7–1


    Original     		PDF MII51007-2 144-Pin 68-Pin 144Pin 100-pin micro fineline BGA EPM240 EPM570-144TQFP altera TQFP 32 PACKAGE bsc part 2 date sheet fbga Substrate design guidelines EPM1270 EPM2210 EPM240G EPM240Z

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		PDF 7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance

    Sis 968

    Abstract: EPF10K100GC503-4 EPM7160 Transition altera TTL library EPF6024AQC208 EPM7128 EPLD epm7192 PL-BITBLASTER PLMG7192-160 PLMQ7192/256-160NC
    Text: Newsletter for Altera Customers ◆ First Quarter ◆ February 1998 Altera’s 3.3-V ISP-Capable MAX 7000A Devices In recent years, an increasing number of engineers have moved their designs to a 3.3-V supply voltage environment. See Figure␣ 1. However, because the


    Original     		PDF

    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80

    transistors BC 458

    Abstract: BC 458 CQFP 208 datasheet EPM7032-44 EPM5192 44JPLCC TQFP-208 0245 192PGA EPM5128 280PGA
    Text: アルテラ・デバイス パッケージ・インフォメーション Altera Device Package Information Data Sheet 1998年 1 月 ver.7 イントロダク ション Data Sheet このデータシートにはアルテラのすべてのデバイス・パッケージに関する


    Original     		PDF PGAT-187 -DS-PKG-07/J 10KFLEX 9000MAX EPF10K10 transistors BC 458 BC 458 CQFP 208 datasheet EPM7032-44 EPM5192 44JPLCC TQFP-208 0245 192PGA EPM5128 280PGA

    EPM7032VLC44-12

    Abstract: low pass fir Filter VHDL code epf10k100efi484-2 TQFP-100 footprint HP 3070 series 2 specification HP 3070 Tester EPF10K50EFI256-2 EPF10K50EQI240-2 epm3032 EPM7032VLC44-15
    Text: & News Views Third Quarter, August 1999 The Programmable Solutions Company Newsletter for Altera Customers MAX 7000B Devices Provide Solutions for High-Performance Applications The feature-rich, product-term-based MAX® 7000B devices offer propagation delays


    Original     		PDF 7000B 7000B JES20, EPM7512B 100-Pin 144-Pin 208-Pin 256-Pin EPM7032VLC44-12 low pass fir Filter VHDL code epf10k100efi484-2 TQFP-100 footprint HP 3070 series 2 specification HP 3070 Tester EPF10K50EFI256-2 EPF10K50EQI240-2 epm3032 EPM7032VLC44-15

    "Constant fraction discriminator"

    Abstract: cti pet Constant fraction discriminator SIEMENS BST vhdl cordic code EPC1064V HP 30 pin lcd flex cable pinout vhdl code for cordic Constant fraction timing discriminator EPF10K50EQI240-2
    Text: & News Views First Quarter, February 2000 The Programmable Solutions Company Newsletter for Altera Customers Altera Provides World-Class HDL Synthesis & Simulation Tools Altera has entered into agreements with Synopsys, Inc., and Mentor Graphics Corporation that enable Altera’s entire


    Original     		PDF

    304 QFP amkor

    Abstract: lot Code Formats altera EPM5032 EPM7128 EPLD PLMQ7192/256-160NC amkor flip verilog code for Modified Booth algorithm ALTERA MAX 5000 BYTEBLASTER epm7192
    Text: Newsletter for Altera Customers ◆ Fourth Quarter ◆ December 1997 Faster FLEX 10K Devices To meet the increasing performance requirements of system designers, Altera recently unveiled plans for the next generation of programmable logic. Altera introduced two additions to the FLEX ␣ 10K family:


    Original     		PDF 35-micron, 10K-1 10K-2 304 QFP amkor lot Code Formats altera EPM5032 EPM7128 EPLD PLMQ7192/256-160NC amkor flip verilog code for Modified Booth algorithm ALTERA MAX 5000 BYTEBLASTER epm7192

    EPF6016TC144-3

    Abstract: relay Re 04501 re 04501 relay USART 8251 lms algorithm using vhdl code C8251 NEC RELAY 10PIN 5V 8251 uart vhdl PDN9516 verilog code for Modified Booth algorithm
    Text: Newsletter for Altera Customers ◆ Second Quarter ◆ May 1998 Altera Unveils FLEX 10KE Devices Altera recently unveiled enhanced versions of FLEX ␣ 10K embedded programmable logic devices— FLEX 10KE devices. Fabricated on a 0.25-µm, five-layer-metal process with a 2.5-V core, FLEX 10KE


    Original     		PDF EPF10K100B EPF6016TC144-3 relay Re 04501 re 04501 relay USART 8251 lms algorithm using vhdl code C8251 NEC RELAY 10PIN 5V 8251 uart vhdl PDN9516 verilog code for Modified Booth algorithm

    BGA PACKAGE thermal resistance

    Abstract: 100 PIN tQFP ALTERA DIMENSION capacitor cross reference EPM1270 EPM2210 324 air variable capacitor EPM2210 EPM240 EPM570 MS-026
    Text: Chapter 7. Package Information MII51007-1.0 Introduction This data sheet provides package information for Altera’s MAX II devices. It includes these sections: Section Page Device & Package Cross Reference . . . . . . . . . . . . . . . . . . . . . . 7–1


    Original     		PDF MII51007-1 324-Pin BGA PACKAGE thermal resistance 100 PIN tQFP ALTERA DIMENSION capacitor cross reference EPM1270 EPM2210 324 air variable capacitor EPM2210 EPM240 EPM570 MS-026

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22

    grid tie inverter schematics

    Abstract: grid tie inverters circuit diagrams grid tie inverter grid tie inverter schematic diagram TQFP 144 PACKAGE footprint footprint tqfp 208 TQFP 100 PACKAGE footprint m 208 b1 CMOS TTL Logic Family Specifications tic 226 bb
    Text: MAX 7000B Programmable Logic Device Family February 2000, ver. 2.0 Data Sheet Features. • Preliminary Information ■ f High-performance 2.5-V CMOS EEPROM-based programmable logic devices PLDs built on second-generation Multiple Array MatriX (MAX®) architecture (see Table 1)


    Original     		PDF 7000B 7000S grid tie inverter schematics grid tie inverters circuit diagrams grid tie inverter grid tie inverter schematic diagram TQFP 144 PACKAGE footprint footprint tqfp 208 TQFP 100 PACKAGE footprint m 208 b1 CMOS TTL Logic Family Specifications tic 226 bb

    TQFP 100 PACKAGE footprint

    Abstract: 225-pin BGA transistor BF 998 BGA and QFP Package PQFP ALTERA 160 PLCC pin configuration 84 pin plcc ic base 2030 ic 5 pins 256-pin BGA AW 55 IC
    Text: Packaging Solutions Advanced Packaging Solutions for High-Density PLDs June 1998 • package options • pin compatibility Advanced • design flexibility Packaging Solutions FineLine BGA • vertical migration • space efficiency • cost-effectiveness


    Original     		PDF 100-Pin 256-Pin 484-Pin 672-Pin 20-Pin 32-Pin 7000S, M-GB-ALTERAPKG-01 TQFP 100 PACKAGE footprint 225-pin BGA transistor BF 998 BGA and QFP Package PQFP ALTERA 160 PLCC pin configuration 84 pin plcc ic base 2030 ic 5 pins 256-pin BGA AW 55 IC