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    100 PIN PQFP ALTERA DIMENSION Search Results

    100 PIN PQFP ALTERA DIMENSION Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    100 PIN PQFP ALTERA DIMENSION Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    EQFP 144 PACKAGE

    Abstract: BGA and eQFP Package TQFP 144 PACKAGE altera micro fineline BGA eQFP EPC16
    Text: Package dimensions selector guide FineLine BGA FBGA ; Hybrid FineLine BGA (HFBGA) as noted 1,932 1,760 45.00 x 45.00 1.00 1,517 43.00 x 43.00 1.00 1,020 40.00 x 40.00 1.00 896 33.00 x 33.00 1.00 1,508 780 31.00 x 31.00 1.00 40.00 x 40.00 1.00 35.00 x 35.00


    Original     		PDF

    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


    Original     		PDF

    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


    Original     		PDF

    BC 1098

    Abstract: EPM7384 ALTERA 68 PLCC t187
    Text: Altera Device Package Information June 1998, ver. 7.01 Introduction Data Sheet This data sheet provides the following package information for all Altera¨ devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF 232-pin 240-pin 100-pin 256-pin 484-pin 672-pin BC 1098 EPM7384 ALTERA 68 PLCC t187

    ep600i

    Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
    Text: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    transistors BC 458

    Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
    Text: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


    Original     		PDF 144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760

    208 pin rqfp drawing

    Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF

    EP20K100E

    Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
    Text: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.


    Original     		PDF 49-pin 169-pin EP20K100E EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA

    100 PIN "PGA" ALTERA DIMENSION

    Abstract: No abstract text available
    Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.


    Original     		PDF

    altera ep610

    Abstract: EPM5130 240 PIN QFP ALTERA DIMENSION epm7064s cross reference 192PGA EPF10K100 EPF10K20 EPF10K30 EPF10K40 EPF10K50
    Text: Altera Device Package Information June 1996, ver. 6 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in ascending pin count order.


    Original     		PDF

    240 pin rqfp drawing

    Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
    Text: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)


    Original     		PDF 7000B, 7000AE, 240 pin rqfp drawing BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance

    100 PIN PQFP ALTERA DIMENSION

    Abstract: 100 PIN tQFP ALTERA DIMENSION TQFP 144 PACKAGE altera altera TQFP 44 PACKAGE EPM7096S altera TQFP 32 PACKAGE TQFP 144 PACKAGE DIMENSION epm7032s package dimensions EPM7128S altera board
    Text: Saving Board Space with MAX 7000S TQFP Packages April 1997, ver. 1 Altera® devices allow designers to save board space by enabling the integration of 22V10s, PALs, and GALs into higher density devices. Designers can save even more board space by using Altera MAX 7000S


    Original     		PDF 7000S 22V10s, EPM7032S EPM7064S 100 PIN PQFP ALTERA DIMENSION 100 PIN tQFP ALTERA DIMENSION TQFP 144 PACKAGE altera altera TQFP 44 PACKAGE EPM7096S altera TQFP 32 PACKAGE TQFP 144 PACKAGE DIMENSION epm7032s package dimensions EPM7128S altera board

    TQFP 144 PACKAGE DIMENSION

    Abstract: EPM7128A DIMENSIONS pqfp 100 TQFP Package 44 lead 100 PIN PQFP ALTERA DIMENSION altera TQFP 32 PACKAGE 100 PIN tQFP ALTERA DIMENSION
    Text: Saving Board Space with MAX 7000S & MAX 7000A TQFP Packages February 1998, ver. 2 Board Space Savings Altera® devices allow designers to save board space by enabling the integration of 22V10s, PALs, and GALs into higher density devices. Designers can save even more board space by using Altera MAX® 7000S


    Original     		PDF 7000S 22V10s, 7000S 44-Pin TQFP 144 PACKAGE DIMENSION EPM7128A DIMENSIONS pqfp 100 TQFP Package 44 lead 100 PIN PQFP ALTERA DIMENSION altera TQFP 32 PACKAGE 100 PIN tQFP ALTERA DIMENSION

    TQFP 100 PACKAGE footprint

    Abstract: 225-pin BGA transistor BF 998 BGA and QFP Package PQFP ALTERA 160 PLCC pin configuration 84 pin plcc ic base 2030 ic 5 pins 256-pin BGA AW 55 IC
    Text: Packaging Solutions Advanced Packaging Solutions for High-Density PLDs June 1998 • package options • pin compatibility Advanced • design flexibility Packaging Solutions FineLine BGA • vertical migration • space efficiency • cost-effectiveness


    Original     		PDF 100-Pin 256-Pin 484-Pin 672-Pin 20-Pin 32-Pin 7000S, M-GB-ALTERAPKG-01 TQFP 100 PACKAGE footprint 225-pin BGA transistor BF 998 BGA and QFP Package PQFP ALTERA 160 PLCC pin configuration 84 pin plcc ic base 2030 ic 5 pins 256-pin BGA AW 55 IC

    240 PIN QFP ALTERA DIMENSION

    Abstract: 403-pin 304-pin dimensions bga EPM9560 pinout 4572 IC 8PIN altera flex10k 256 PIN QFP ALTERA DIMENSION
    Text: Packaging Solutions Advanced Packaging Solutions for High-Density PLDs June 1998 • package options • pin compatibility Advanced • design flexibility Packaging Solutions Table of Contents Advanced Packaging Solutions . . . . . . . . . . . . . . . . . . . . . .2


    Original     		PDF 100-Pin 256-Pin 484-Pin 672-Pin 225-Pin 7000S, M-GB-ALTERAPKG-01 240 PIN QFP ALTERA DIMENSION 403-pin 304-pin dimensions bga EPM9560 pinout 4572 IC 8PIN altera flex10k 256 PIN QFP ALTERA DIMENSION

    100 PIN tQFP ALTERA DIMENSION

    Abstract: TQFP 144 PACKAGE DIMENSION 100 PIN PQFP ALTERA DIMENSION TQFP 100 PACKAGE TQFP 144 PACKAGE PQFP chip size TQFP 144 PACKAGE altera altera EPM7032S altera TQFP 32 PACKAGE EPM7128S
    Text: Saving Board Space with MAX 7000S & MAX 7000A TQFP Packages February 1998, ver. 2 Board Space Savings Altera® devices allow designers to save board space by enabling the integration of 22V10s, PALs, and GALs into higher density devices. Designers can save even more board space by using Altera MAX® 7000S


    Original     		PDF 7000S 22V10s, 44-Pin 100 PIN tQFP ALTERA DIMENSION TQFP 144 PACKAGE DIMENSION 100 PIN PQFP ALTERA DIMENSION TQFP 100 PACKAGE TQFP 144 PACKAGE PQFP chip size TQFP 144 PACKAGE altera altera EPM7032S altera TQFP 32 PACKAGE EPM7128S

    EPM7160 Transition

    Abstract: 6402 uart 4 bit updown counter vhdl code EPM7064L-84 epf8282alc84-4 ep330 EPM7192 Date Code Formats EPM7160L-84 EPF81500ARI240-3 EPF81500ARI240
    Text: Newsletter for Altera Customers ◆ Third Quarter ◆ August 1996 ClockLock & ClockBoost Circuitry for High-Density PLDs Altera is introducing two new options for high-density programmable logic devices PLDs . The ClockLock feature uses a phase-locked loop (PLL) to minimize


    Original     		PDF

    EPM9560 pinout

    Abstract: PLMJ5064 Yamaichi TQFP 244 CQFP 208 IC51-0444-1568 PLMJ5192A PLMG5130A PLMJ7000-84
    Text: About this CD-ROM June 1997 The Altera Digital Library contains all current technical literature for the FLEX 10K, FLEX 8000, FLEX 6000, MAX 9000, MAX 7000, MAX 5000, Classic, and Configuration EPROM device families, MAX+PLUS II development tools, and programming hardware. In addition, updates to


    Original     		PDF 10-Pin EPM9560 pinout PLMJ5064 Yamaichi TQFP 244 CQFP 208 IC51-0444-1568 PLMJ5192A PLMG5130A PLMJ7000-84

    BGA PACKAGE thermal profile

    Abstract: 896-Pin TQFP 144 PACKAGE DIMENSION CII51015-2 EP2C20 EP2C35 EP2C50 F256 EP2C5256 CII51015
    Text: 15. Package Information for Cyclone II Devices CII51015-2.3 Introduction This chapter provides package information for Altera Cyclone® II devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Table 15–1 shows Cyclone II device package options.


    Original     		PDF CII51015-2 EP2C15 BGA PACKAGE thermal profile 896-Pin TQFP 144 PACKAGE DIMENSION EP2C20 EP2C35 EP2C50 F256 EP2C5256 CII51015

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22

    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80

    EPM9560RC304-15

    Abstract: EPM7064SLC44-10 vhdl code for ARQ EASY 21653 EPC1 price epc1213 EPM5064 EPM7032S through hole chip carriers Lexra PLMQ7192/256-160NC
    Text: Newsletter for Altera Customers ◆ Fourth Quarter ◆ November 1998 Quartus: Altera’s Fourth-Generation Development Tool With Altera’s new QuartusTM software, programmable logic development tools enter the multi-million-gate era. This powerful fourthgeneration software meets


    Original     		PDF

    4572 IC 8PIN

    Abstract: epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610
    Text: Altera Device Package Information J u n e 1995, ver. 6 Introduction Data Sheet This data sh eet p rovid es the fo llo w in g package inform ation for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package w eig h ts Package outlines


    OCR Scan     		PDF 503-Pin 4572 IC 8PIN epx780 TQFP 144 PACKAGE DIMENSION ALTERA EP610