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    84-1lmis

    Abstract: mold compound AND S6300H bond 84-1-lmis-r4
    Text: ASSEMBLY DIAGRAM CONTROLLED DOCUMENT Specification No : ADD-05457XXXEAK Effective : 06-DEC-2000 09:18:54 Package : EAK 14 LEAD PDIP Metal ID : Issue : 7 Status : RELEASED Scale : 20X Printed : 09-APR-2001 09:16:04 EST PLASTIC_PKG Data as of 09-APR-2001 09:16:05 by sherpa at farview


    Original     		PDF ADD-05457XXXEAK 06-DEC-2000 09-APR-2001 84-1LMISR4 S6300H R004-0003 84-1lmis mold compound AND S6300H bond 84-1-lmis-r4

    V23601-A1227-E1

    Abstract: T116
    Text: 3 THIS DRAWING IS UNPUBLISHED. C O P Y R I G H T 20 0 0 RELEASED BY TYCO ELECTRONICS FOR C O R P O R A T I O N . AL L 2000 PUBLICATION RIGHTS LOC RESERVED. REV ISIONS D 1ST QW LTR DESCRIPTION A1 17.9 DATE DWN APVD SR10-0146-G1 09APR2001 CM KM SR10-0497-02


    OCR Scan     		PDF SR10-0146-01 SR10-0497-02 09APR2001 22NOV2002 V23601-A1227-E1 04APR2001 APR2001 3IMAR20Ã T116